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Parker Chomerics（派克固美丽）导电弹性EMI垫片（模压和挤压材料）选型指南
目录- EMI Materials Gasket Elastomer Binder & Elastomer Filler
型号- CHO-TM101,CHO-SEAL 1285,L6303,CHO-SEAL 6452,CHO-SEAL 6330,CHO-SEAL®,CHO-SEAL 6371,CHO-SEAL 6370,1217,1215,1212,CHO-SEAL V6433,1298,6502,CHO-SEAL 1239
Parker Chomerics（派克固美丽）热界面材料（用于电子产品散热）选型指南
描述- Parker Chomerics is a global provider of EMI shielding and thermal interface materials as well as electrically conductive thermoplastics and optical products. Parker provides products and services to OEM and CEM electronics companies in the telecommunications, information technology, consumer, power conversion, medical device, defense and transportation markets.
型号- PAD30G,60-XX-D065-ZZZZ,60-XX-4353-ZZZZ,60-XX-D379-ZZZZ,60-XX-D417-ZZZZ,G570,PAD30A,GEL 75,T500,60-XX-6875-ZZZZ,60-XX-D420-ZZZZ,G974,60-XX-D381-ZZZZ,60
Parker Chomerics（派克固美丽）Tecknit EMI 屏蔽材料选型指南
目录- Company Profile and Products introduction Electromagnetic Compatibility Overview EMI SHIELDING DESIGN Special Applications Knitted Wire Mesh Metal Fibers and Screens Oriented Wires Conductive Elastomer EMI Shielding Windows Air Vent Panels Conductive Systems Products Shielding Components Beryllium Copper Gaskets Fabric-over-Foam Gaskets EMI Shielding Products Glossary and Appendix
型号- 82-12916,21-13910,82-12911,21-13911,21-13912,60-02010,21-13913,60-02011,21-13914,60-02012,21-13915,60-02013,21-13916,60-02014,21-13917,60-02015,21-139
Parker Chomerics（派克固美丽）CHOFORM®和ParPHorm®系列EMI屏蔽垫片选型指南
目录- EMI Gaskets ParPHorm and CHOFORM Sealing Compounds CHOFORM Shielded Housing Assemblies
型号- PARPHORM L1938,CHOFORM 5560,19-26-5560-0500,PARPHORM S1945,CHOFORM 5541,19-26-1938-0200,CHOFORM®5541,PARPHORM® 1800,CHOFORM®5560,PARPHORM®1800,19-26-5
【选型】Parker Chomerics（派克固美丽）热管理材料选型指南
目录- 产品简介 热传递基础 填缝材料 THERM-A-GAP™569,570,579,580,热垫片 THERM-A-GAP™974,G974,976,高性能热垫片 THERM-A-GAP™T63X系列,可涂布填缝材料 THERM-A-GAP™TP575NS,无硅热垫片 THERM-A-GAP™174,274,574,热垫片 THERMFLOW®相变垫片 HERMATTACH®热粘合带 THERM-A-FORM™可现场固化的灌注和底部填充材料 导热脂和导热胶 绝缘垫片 CHO-THERM®商用热绝缘垫片 CHO-THERM®高能热绝缘垫片 T-WING®和C-WING™薄型散热器 热管理词汇表 安全指南
型号- 65-00-T6XX-0030,WW-XX-5442-ZZZZ,WW-XX-D426-ZZZZ,T500,69-XX-20684-ZZZZ,WW-XX-D387-ZZZZ,69-12-XXXXX-A274,WW-XX-D390-ZZZZ,WW-XX-4659-ZZZZ,61 - 07 - 0909
PARKER CHOMERICS间隙填充垫选型表
PARKER CHOMERICS提供以下技术参数的间隙填充垫选型，导热系数1~6.5W/m·K，介电强度127~200Vac/mil，热膨胀系数100~250ppm/K，多种颜色可选
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产品型号
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品类
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Color
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Binder
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Standard Thicknesses, in (mm)
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Specific Gravity
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Hardness
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Percent Deflection(0.125 in thick sample)@ 5 psi (
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Percent Deflection(0.125 in thick sample)@ 10 psi
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Percent Deflection(0.125 in thick sample)@ 25 psi
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Percent Deflection(0.125 in thick sample)@ 50 psi
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Operating Temperature Range,℃
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Thermal Conductivity, W/m-K
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Thermal Impedance, ℃-in²/W (℃-cm²/W)
@0.04in(1mm)
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Heat Capacity, J/g-K
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Coefficient of Thermal Expansion, ppm/K
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Dielectric Strength, Vac/mil (kVac/mm)
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Volume Rosistivity, ohm-cm
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Dielectric Constant@ 1,000 kHz
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Dissipation Factor @ 1,000 kHz
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Flammability Rating (See UL File E140244 for detai
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RoHS Compliant
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Outgassing, % TML (% CVCM)
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Shelf Life, months from date of shipment
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Storage Conditions, ℃ @ 50% Relative Humidity
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HCS10
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间隙填充垫
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Orange/ Gray Carrier
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Silicone
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0.010- 0.200 (0.25-5.0)
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2
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4 Shore 00
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26
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36
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59
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73
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-55 to 200
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1
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1.5(9.7)
@10psi,“G”version
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1
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N/A
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200 (8)
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10^14
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5.3
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0.013
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V-0
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Yes
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0.44 (0.13)
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36(With aluminum foil carrier: 18)
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10 to 32
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选型表 - PARKER CHOMERICS 立即选型>>
PARKER CHOMERICS导热凝胶选型表
PARKER CHOMERICS提供以下技术参数的导热凝胶选型，导热系数包含0.7~7.5W/m·K，热膨胀系数150~400ppm/K，介电强度180~220Vac/mil，符合ROHS标准，多种颜色可选
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产品型号
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品类
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Color
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Binder
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Flow Rate, grams/min - 30cc syringe with no tip at
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Specific Gravity
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Typical Minimum Bondine Thickness, in (mm)
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Thermal Conductivity, W/m-K
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Heat Capacity, J/g-K
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Coefficient of Thermal Expansion, ppm/K
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Operating Temperature Range, ℃
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Dielectric Strength, Vac/mil (kVac/mm)
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Volume Resistivity, ohm-cm
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Dielectric Constant @ 1,000 kHz
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Dissipation Factor @ 1,000 kHz
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Flammability Rating
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RoHS Compliant
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Outgassing,% TML (% CVCM)
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Shelf Life, months from date of manufacture
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Storage Conditions, ℃ @50% Relative Humidity
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T630
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导热凝胶
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White
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Silicone
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10 @0.130"orifice
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2
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0.004 (0.10)
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0.7
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1.1
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350
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-55 to 200
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200 (8)
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10¹⁴
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5.5
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0.01
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V-0
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Yes
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0.55 (0.14)
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18
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10 to 32
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选型表 - PARKER CHOMERICS 立即选型>>
QSFP-DD Optical Transceiver Thermal Interface Materials with Greater Density, Greater Heat
High performance QSFP-DD optical modules must use thermal interface materials to help dissipate heat efficiently and effectively to ensure the optimum operating performance, reliability and dependability of the high-speed transceiver. The introduction of QSFP-DD, or Quad Small Form Factor Pluggable Double Density optical modules, have now doubled of the number of high-speed electrical interfaces that the module supports compared with a standard QSFP28 module.
厂牌及品类 发布时间 : 2021-07-22
THERM-A-GAP™ GEL 35VT 3.5 W/m-K High Reliability, Fully Cured, Dispensable Thermal Gel
型号- 65-00-GEL35VT-0010,65-1P-GEL35VT-2500,65-02-GEL35VT-0030,THERM-A-GAP GEL 35VT,65-00-GEL35VT-0300,THERM-A-GAP™ GEL 35VT,65-02-GEL35VT-0180,GEL 35VT
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