BOYD Thermal Management Product Introduction

TRANSTHERM THERMAL MANAGEMENT

选型目录：

Thermal Management Product Introduction

Silicone Thermal Pad

Silicone Thermal Gap Filler

Thermal Gap Filler

Thermal Adhesive Tape and Phase Change Product

One Company, Many Solutions

After

Before

TRANS

Thermal Management Products by

THERM

™

TRANS

Thermal Management Products by

THERM

™

Boyd provides best-cost, engineered, specialty material-based energy management and sealing solutions

through comprehensive technical materials and design expertise, world-class manufacturing quality, service

reliability, and unparalleled supply chain management. Use Boyd’s years of experience and engineering

support in concert with your engineering / technical expertise to ensure your thermal challenges are solved

in a cost e

ective, leading edge way.

With a fully equipped and capable thermal analysis lab to support customer product evaluations, Boyd

utilizes excellent analysis tools and market experience to provide an unmatched ability to assist its OEM

customers, EMS partners and suppliers in designing solutions that solve thermal management challenges.

- Automotive: ECU (Electronic Control Unit) featuring

thermally conductive adhesives, heat spreaders and TIMs

- LED TV Displays: backlights cooled with graphite and

power modules cooled with TIMs

-Mobile Computing: CPU, power amplifiers and

displays featuring heat spreaders made of graphite,

copper and aluminum

- Enterprise Electronics: CPU, chips and heat sinks

featuring TIMs for heat transfer

- Lighting: thermally conductive adhesives and

TIMs used in LED chips and heat sinks

- Hybrid or Electric Vehicles: TIMs for battery temperature

management

For more than a decade, Boyd has provided thermal

management solutions for market segments and applications

including:

oyd Corporation Global Headquarters

5960 Inglewood Dr. Suite 115, Pleasanton, CA 94588

Visit us at

www.boydcorp.com

As electronics become an ever increasing part of our daily lives, so too OEMs’ challenges associated with

the advancing complexities and miniaturization of technologies they produce with attendant power con-

sumption, heat and thermal management-related challenges.