金菱通达(GLPOLY)热对策材料选型指南
●金联通达电子有限公司致力于热接口材料的设计、开发和制造,开发高质量的TIM,热解决方案是首要任务。研发团队能够为客户提供引脚对当前先进产品的有效热解决方案
●产品:硅热垫、导热绝缘体、硅腻子垫、硅热胶带、热界面润滑脂、两部分热界面密封化合物、硅热凝胶、热界面相变材料和非硅类产品
●应用领域:新能源汽车、无人机、计算机、电信、消费电子、光学产品、LED照明、空中飞行、存储设备、军事和医疗设备、电力转换
选型目录
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全部评论(15)
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日月皓 Lv4. 资深工程师 2023-09-07学习一下,以前用过这家的产品
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一无所有 Lv4. 资深工程师 2022-11-23了解学习下
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用户18396822 Lv8 2022-11-15学习了
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tiankai001 Lv7. 资深专家 2022-11-10了解,学习
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sdlibin007 Lv7. 资深专家 2022-11-08了解一下
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guojun Lv9. 科学家 2022-11-05学习学习
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用户20751457 Lv4. 资深工程师 2022-11-03学习
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阿尼古 Lv8. 研究员 2022-11-03感谢分享
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无016 Lv4. 资深工程师 2022-05-13热对策材料,在装置散热上有很大用处
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落幕 Lv4. 资深工程师 2021-12-06学习
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Parker Chomerics(派克固美丽)热界面材料(用于电子产品散热)选型指南
Company Profile Heat Transfer Fundamentals Thermal Gels Gap Filler Pads Phase Change Materials Thermal Tapes Potting and Underfill Materials Dielectric Pads Heat Spreaders Thermal Greases Glossary
PARKER CHOMERICS - THERMALLY CONDUCTIVE PADS,NON-SILICONE,PHASE-CHANGE THERMAL INTERFACE PADS,热间隙填充垫,HEAT SPREADERS,热绝缘体,间隙填充垫,DOUBLE-SIDED THERMAL TAPES,热敏胶带,热润滑脂,压敏黏合剂,THERMAL INTERFACE MATERIALS,THIN HEAT SPREADERS,DOUBLE-SIDED THERMAL INTERFACE TAPES,PRESSURE SENSITIVE ADHESIVE,THERMAL TAPES,PSA,GELS,THERMAL GAP FILLER PADS,HEAT SPREADERS,THERMAL INTERFACE MATERIALS,THERMAL INSULATOR PADS,THERMAL INSULATORS,散热器,导热垫,GAP FILLER PADS,THERMAL GREASES,导热电绝缘垫,PADS,UNDERFILL MATERIALS,THERMALLY CONDUCTIVE GAP FILLER PADS,PHASE CHANGE MATERIALS,灌封材料,THERMALLY CONDUCTIVE ATTACHMENT TAPES,THERMAL GREASES,底部填充材料,THERMALLY CONDUCTIVE ELECTRICAL INSULATOR PADS,热凝胶,导热间隙填充垫,导热连接带,绝缘垫,POTTING MATERIALS,非硅胶,相变热界面垫,THERMAL GAP FILLERS,GAP FILLERS,NON-SILICONE, PHASE-CHANGE THERMAL INTERFACE PADS,SILICONE GREASE,导热凝胶,DIELECTRIC PADS,相变材料,THERMALLY CONDUCTIVE GELS,THERMAL GELS,PAD30G,60-XX-D065-ZZZZ,60-XX-4353-ZZZZ,60-XX-D379-ZZZZ,60-XX-D417-ZZZZ,G570,PAD30A,GEL 75,T500,60-XX-6875-ZZZZ,60-XX-D420-ZZZZ,G974,60-XX-D381-ZZZZ,60-XX-4305-ZZZZ,60-XX-D382-ZZZZ,G579,579PN,A580,60-XX-D396-ZZZZ,T630,60-XX-4997-ZZZZ,60-XX-4306-ZZZZ,PAD 30,60-XX-D416-ZZZZ,6W-XX-YYYY-ZZZZ,60-XX-4996-ZZZZ,60-XX-D421-ZZZZ,60-XX-D402-ZZZZ,60-XX-6956-ZZZZ,60-XX-D404-ZZZZ,G569,60-XX-D415-ZZZZ,60-XX-D418-ZZZZ,60-XX-D429-ZZZZ,65-00-T670-3790,65-1P-CIP35-5600,60-XX-D395-ZZZZ,60-XX-D398-ZZZZ,60-XX-5792-ZZZZ,69-1X-YYYYY-ZZZZZZ,65-00-CIP35-0400,60-XX-D406-ZZZZ,T404,T647,60-12-20264-TW10,PAD60A,T405,T646,60-XX-D400-ZZZZ,T766,T644,T642,60-XX-4511-ZZZZ,60-XX-D384-ZZZZ,60-XX-D428-ZZZZ,60-XX-5791-ZZZZ,65-00-YYYY-ZZZZ,60-XX-D419-ZZZZ,T650,60-XX-D385-ZZZZ,60-XX-D391-ZZZZ,T636,T635,60-XX-D394-ZZZZ,G580,TC50,60-XX-D397-ZZZZ,60-XX-D378-ZZZZ,60-XX-D375-ZZZZ,60-XX-D425-ZZZZ,1641,65-5P-CIP35-10452,60-XX-D422-ZZZZ,60-XX-D372-ZZZZ,60-XX-D403-ZZZZ,60-12-20267-TW10,GEL 37,6W-XX-1015-ZZZZZZ,60-XX-D373-ZZZZ,60-XX-D409-ZZZZ,PC07DM-7,60-XX-4661-ZZZZ,579KT,60-XX-D387-ZZZZ,60-XX-YYYY-ZZZZ,60-XX-D412-ZZZZ,65-00-1641-0000,60-XX-D388-ZZZZ,65-00-T644-0045,65-00-T644-0200,GEL 30,64-XX-YYYY-ZZZZ,60-XX-D374-ZZZZ,60-XX-D390-ZZZZ,60-XX-4659-ZZZZ,60-XX-D408-ZZZZ,T670,65-00-T642-0035,T405-R,60-XX-4374-ZZZZ,T418,60-XX-D424-ZZZZ,60-XX-D410-ZZZZ,GEL 45,T777,1642 65-00-1642-0000,60-XX-D413-ZZZZ,T414,T411,T412,1671,60-12-20266-TW10,60-XX-8531-ZZZZ,60-12-20269-TW10,60-XX-D407-ZZZZ,PAD 60,569PN,60-XX-5527-ZZZZ,65-XX-YYYYY-ZZZZ,60-XX-5442-ZZZZ,60-XX-D426-ZZZZ,569,65-00-CIP35-0200,65-00-CIP35-0045,T660,PAD30PN,HCS10,T725,60-XX-D370-ZZZZ,60-XX-D376-ZZZZ,67-XX-YYYY-ZZZZ,65-00-T642-0250,60-XX-8302-ZZZZ,T444,GEL 8010,T766-06,65-00-T646-0045,A569,65-01-1641-0000,60-XX-D423-ZZZZ,PAD30KT,60-XX-D392-ZZZZ,60-XX-4969-ZZZZ,T609,570,65-00-T646-0200,1678,1674,60-XX-D371-ZZZZ,974,60-XX-D399-ZZZZ,60-XX-D405-ZZZZ,579,60-XX-D401-ZZZZ,976,60-XX-D377-ZZZZ,65-00-CIP35-1200,65-00-T647-0200,65-00-T647-0045,60-XX-D393-ZZZZ,60-XX-D427-ZZZZ,65-00-T650-0160,T558,HCS10G,6W-XX-0909-ZZZZZZ,T710,T557,CIP 35,60-XX-D383-ZZZZ,A579,PAD60,60-XX-D386-ZZZZ,580,60-XX-D389-ZZZZ,A570,60-XX-D430-ZZZZ,GEL 25NS,60-XX-D411-ZZZZ,HCS10A,60-XX-D414-ZZZZ,60-12-20268-TW10,T441,60-XX-D380-ZZZZ,60-12-20265-TW10,电机控制器,INFORMATION TECHNOLOGY,TELECOMMUNICATION INFRASTRUCTURE COMPONENTS,MEMORY MODULES,TELEVISIONS,GRAPHICS PROCESSORS,不间断电源,UPS,电信基础设施组件,不断电系统,HANDHELD PORTABLE ELECTRONICS,图形处理器,MEDICAL DEVICE,MOTOR,POWER CONVERSION,LIGHT EMITTING DIODE,LIGHTING,电机控制处理器,金属氧化物半导体场效应晶体管阵列,POWER SEMICONDUCTORS,汽车电子控制单元,SERVER CPU,ENGINE CONTROLLERS,CONSUMER ELECTRONICS,手机,POWER MODULES,MOTOR CONTROLLERS,INDUSTRIAL APPLICATIONS,AUTOMOTIVE ELECTRONIC CONTROL UNIT,LAPTOP PC,UNINTERRUPTIBLE POWER SUPPLIES,欧洲货币单位,DEFENSE,服务器CPU,ENGINE CONTROL,TELECOMMUNICATIONS EQUIPMENT,PC PROCESSORS,微处理器,MOSFET ARRAYS,HIGH SPEED DISK DRIVES,发动机,AUTOMOTIVE ELECTRONICS,牵引力控制,MOBILE,电视和电子产品,TRANSPORTATION,发光二极管,ECU,工业应用,笔记本电脑,AEROSPACE,内存模块,汽车电子,TRANSMISSION CONTROL MODULES,制动控制,LAPTOP PCS,发动机控制,TRACTION CONTROL,桌面,ENGINE,AUTOMOTIVE ELECTRONIC CONTROL UNITS,发光二极体,POWER SUPPLIES,MOTOR CONTROL PROCESSORS,TELECOMMUNICATIONS,功率转换设备,个人电脑处理器,BRAKING CONTROL,TELEVISIONS ELECTRONICS,CONSUMER ELECTRONICS,CHIPSETS,发动机控制器,消费电子,功率半导体,无线通讯,LEDS,TELECOMMUNICATIONS,GRAPHICS PROCESSORS,SERVERS,DESKTOP,MICROPROCESSORS,POWER CONVERSION EQUIPMENT,变速箱控制,CONSUMER,HANDHELD DEVICES,LAPTOPS,电视机,DESKTOP COMPUTERS,变速器控制模块,MOBILE,LED,手持便携式电子设备,高速磁盘驱动器,INDUSTRIAL,CPUS,电源,TRANSMISSION CONTROL
热界面材料选型指南
本资料为Henkel公司提供的电子产品热管理解决方案指南,涵盖了热界面材料的选择和应用。内容包括热界面材料的导热性能、测试方法、不同类型热界面材料(如GAP PAD、Gap Filler、TIC、HI-FLOW、SIL PAD、BOND-Ply和LIQUI-BOND)的特性和应用,以及如何根据具体需求选择合适的热界面材料。此外,还提供了常见问题解答和订购信息。
BERGQUIST - THERMALLY CONDUCTIVE INSULATORS,间隙垫热界面材料,THERMALLY CONDUCTIVE TUBES,ORIGINAL SIL PAD MATERIAL,聚酰亚胺基绝缘体,粘合-薄膜,粘合层和液体粘合剂,银垫导热绝缘体,E高性能聚酰亚胺绝缘体,粘合层胶带,THERMALLY CONDUCTIVE INSULATION MATERIAL,LIQUID SILICONE ADHESIVE,压敏相变热界面材料,热界面材料,SIL PAD - FIBERGLASS,粘接-玻璃纤维,润滑脂更换材料,粘合-未加固,相变涂层铝材,LIQUID FORMABLE MATERIAL,THERMALLY CONDUCTIVE ELASTOMERIC MATERIAL,中性能聚酰亚胺基绝缘体,GAP PAD,增强相变热界面材料,高可靠性绝缘子,导热管,软粘性弹性体材料,液体环氧粘合剂,BOND-PLY ADHESIVE TAPES,GAP FILLER,MEDIUM PERFORMANCE POLYIMIDE-BASED INSULATOR,“凝胶状”模数填隙材料,BONDING - THIN FILM,LIQUID GAP FILLING MATERIAL,THERMAL INTERFACE MATERIALS,玻璃纤维增强压敏胶带,PHASE CHANGE THERMAL INTERFACE MATERIAL,FIBERGLASS-REINFORCED PRESSURE SENSITIVE ADHESIVE TAPE,BONDING - LAMINATES,间隙填充液分配材料,GREASE REPLACEMENT MATERIALS,LIQUID GAP FILLER MATERIAL,高流动相变界面材料,EMI ABSORBING MATERIAL,GAP FILLER LIQUID DISPENSED MATERIALS,THERMALLY CONDUCTIVE PHASE CHANGE MATERIAL,间隙垫,液体间隙填充材料,GAP PAD THERMAL INTERFACE MATERIALS,SOFT TACK ELASTOMERIC MATERIAL,THERMALLY CONDUCTIVE MATERIAL,GLASS-REINFORCED GREASE REPLACEMENT THERMAL INTERFACE,原始银垫材料,间隙垫导热材料,导热填隙材料,E HIGH PERFORMANCE POLYIMIDE-BASED INSULATOR,玻璃纤维增强润滑脂替代热界面,“GEL-LIKE” MODULUS GAP FILLING MATERIAL,液键液体粘合剂,THERMALLY CONDUCTIVE GREASE COMPOUNDS,REWORKABLE GAP FILLING MATERIAL,压敏胶带,银垫-玻璃纤维,液体可成形凝胶材料,加强型“ S级”填隙材料,THERMALLY CONDUCTIVE LOW MODULUS MATERIAL,价值复合,补强填缝材料,BONDING - FIBERGLASS,POLYIMIDE-BASED INSULATOR,SILICONE-FREE GAP FILLING MATERIAL,银垫-薄膜聚酰亚胺,导热相变材料,PRESSURE SENSITIVE ADHESIVE TAPE,可返工填缝材料,GAP PAD THERMALLY CONDUCTIVE MATERIALS,LIQUID FORMABLE GEL MATERIAL,LIQUID EPOXY ADHESIVE,SIL PAD - THIN FILM POLYIMIDE,液体硅胶粘合剂,导热绝缘材料,REINFORCED GAP FILLING MATERIAL,导热绝缘体,超低模量材料,PRESSURE SENSITIVE PHASE CHANGE THERMAL INTERFACE MATERIAL,可相变热界面材料,无硅填隙材料,REINFORCED PHASE CHANGE THERMAL INTERFACE MATERIAL,HIGH PERFORMANCE INSULATOR,HI-FLOW PHASE CHANGE INTERFACE MATERIALS,THERMALLY CONDUCTIVE GAP FILLING MATERIAL,导热低模量材料,LIQUID ADHESIVE,BONDING - UNREINFORCED,导热弹性材料,液体可成形材料,粘合-层压板,未增强的间隙填充材料,间隙填充剂,UNREINFORCED GAP FILLING MATERIAL,REINFORCED “S-CLASS” GAP FILLING MATERIAL,液体粘合剂,HIGH RELIABILITY INSULATOR,PHASE CHANGE COATED ALUMINUM MATERIAL,高性能绝缘子,ULTRA-LOW MODULUS MATERIAL,EMI吸波材料,BOND-PLY AND LIQUI-BOND ADHESIVES,SIL PAD THERMALLY CONDUCTIVE INSULATORS,LIQUI-BOND LIQUID ADHESIVES,液体填隙材料,导热油脂化合物,VALUE 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951753,GP2000S40-0.020-02-0816-NA,SPK4-0.006-00-11.512-NA,PPK10-0.006-00-11.512-NA,GPHC3.0-0.020-02-0816-NA,SPK6-0.006-00-11.512-NA,GP2200SF-0.010-02-0816-N,LBEA1805-00-30-50CC-NA,SP2000-0.010-AC-00-NA,GF1000SR-00-60-50CC-NA,SP980-0.009-AC-00-ACME 951753,GF1400SL-00-120-120CC-NA,QII-0.006-AC-1212-NA,BP800-0.005-00-1212-NA,SPK10-0.006-00-11.512-NA,SP800-0.005-AC-1212-AA,ANTI-LOCK,ELECTRONICS,CONNECTORS,FULL BRICKS,HIGH-END COMPUTER PROCESSORS,MEMORY MODULES,需要低装配压力的设备,电容器,HEAT SINK,OPTICS,BGA图形处理器,HEAT SINK INTERFACE,电源模块组件,DDR SDRAM内存模块,POWER TRANSISTOR,不间断电源,散热片,AUTOMOTIVE ENGINE,FIBER OPTIC TELECOMMUNICATIONS EQUIPMENT,硅酮敏感应用,INDUCTORS,FRAMES,CHIP SCALE PACKAGES,驱动处理器,FB-DIMM MODULES,CHASSIS,PROCESSOR,卡车,HEAT-GENERATING SEMICONDUCTORS,POWER SEMICONDUCTORS,散热器,DC BRUSH MOTORS,MOTOR,芯片级封装,框架,AUTOMOTIVE ELECTRONICS CONTROL MODULES,散热器接口,RELAYS,电阻器,DVD光驱,磁性元件,分数阶和积分阶电机控制,SILICONE SENSITIVE APPLICATIONS,火车,线性电源,FB-DIMM模块,VOLTAGE REGULATOR MODULES,数字磁盘驱动器,HEAT SPREADER,LED应用,固态继电器,COMPUTERS,AUTOMOTIVE ELECTRONICS,光纤电信设备,CD-ROM,电脑,对硅敏感的电子学,HARD DISK ASSEMBLIES,动力传输,处理器,AEROSPACE,MECHANICAL SWITCHING RELAY,汽车电子,DISCRETE POWER SEMICONDUCTORS AND MODULES,MEDICAL,汽车,WHITE GOODS,公共汽车,DIGITAL DISK DRIVES,GPU,医学电子学,汽车电子控制系统,变速箱控制装置,PC应用程序,MEDICAL ELECTRONICS,分立功率半导体和模块,MILITARY,电压调节器模块,IGBT MODULES,POWER MODULE ASSEMBLIES,GRAPHIC CARDS,数码产品,电源转换器印刷电路板,PERIPHERALS,硅酮敏感光学元件,汽车照明,INDUSTRIAL CONTROLS,大容量存储设备,电绝缘体,热增强BGA,MASS STORAGE DEVICES,机械开关继电器,BUSES,热模块,汽车发动机,HIGH PERFORMANCE COMPUTER PROCESSORS,AUTOMOTIVE LIGHTING,信号放大器,ASICS,功率逆变器,马达,THERMALLY CONDUCTIVE VIBRATION DAMPENING,消费电子,航空航天,感应器,BARE-LEADED DEVICES,HEAT SPREADING DEVICES,DSPS,ASIC,HARD DRIVES,高端电脑处理器,防抱死,高性能计算机处理器,DDR SDRAM MEMORY MODULES,AUTOMOTIVE MODULES,SILICONE-SENSITIVE ELECTRONICS,工业控制,雨刮器控制,汽车模块,底盘,TELECOM,显卡,图形卡,HEAT PIPE ASSEMBLIES,汽车系统,有线/无线通信硬件,AUTOMOTIVE SYSTEMS,POWER SUPPLIES,军事的,POWER TRANSMISSIONS,TRAINS,继电器,裸引线器件,硬盘组件,COMPUTER,ULTRA CAPACITORS,UPS,CAPACITORS,TRANSFORMERS,MOTOR CONTROL PCB,热传导减振,RESISTORS,SOLID STATE RELAYS,热管组件,DVD ROM,电压有效值,DDR SDRAM,光学,SIGNAL AMPLIFIERS,WIRELINE/WIRELESS COMMUNICATIONS HARDWARE,DRIVE PROCESSOR,白色商品,电信,直流电刷电动机,POWER SUPPLY,DVD COOLING,航空电子,变压器,CD ROM,ELECTRICAL INSULATOR,超级电容器,满砖,铜基散热器,发热半导体,AUTOMOTIVE ECMS,BGA GRAPHIC PROCESSOR,中央处理器,屏蔽装置,功率转换装置,汽车电子控制模块,内存模块,POWER CONVERSION DEVICES,散热装置,POWER INVERTERS,医学,光盘只读存储器,POWER CONVERTER PCB,汽车舱内电子设备,CPU,照明,功率晶体管,DEVICES REQUIRING LOW ASSEMBLY PRESSURE,WIPER CONTROLS,THERMAL MODULES,TRUCKS,FRACTIONAL AND INTEGRAL MOTOR CONTROL,LED APPLICATIONS,DSP,COPPER-BASED HEAT SINKS,开关模式电源,VRMS,手持设备,THERMALLY-ENHANCED BGAS,TRANSMISSION CONTROLS,RESISTORS,AUTOMOTIVE,CONSUMER ELECTRONICS,AUTOMOTIVE IN-CABIN ELECTRONICS,POLS,电池,SILICONE-SENSITIVE OPTIC COMPONENTS,功率半导体,光纤模块,LINEAR POWER SUPPLIES,电机控制PCB,LIGHTING,波尔斯,HANDHELD DEVICES,FIBER OPTICS MODULES,IGBT模块,硬盘,BATTERIES,连接器,PC APPLICATIONS,AVIONICS,MAGNETIC COMPONENTS,外围设备,SHIELDING DEVICES,电源,SMPS,只读光盘,GRAPHICS CARD,计算机,DVD冷却
金菱通达热界面材料选型表
金菱通达提供以下导热结构胶、导热绝缘玻纤布、导热凝胶、点胶式导热垫片、导热绝缘薄材、导热垫片等热界面材料的参数选型:Thermal conductivity(W/m.K):1.2W/m.K-11.0W/m.K;Flammability:UL 94-V0;Specific Gravity(g/cm³):1.9±0.1g/cm³ to 3.45±0.1g/cm³。
产品型号
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品类
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Thermal conductivity(W/m.K)
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Flammability
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XK-P
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热界面材料
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11W/m.K
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UL 94-V0
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Rhyton High-Performance Silicone-Free Thermal Pads Escort for Electronic Equipment
HiPad4000SF is a silicone-free thermal pad material based on thermoplastic resin, whose thermal conductivity can reach 4W/m·K, and long-term use temperature can reach 125℃. It will not release or volatilize siloxane components during the working process.
【产品】金菱通达非硅导热硅胶片XK-PN20对标贝格斯Pad2200SF,热阻低近25%
金菱通达XK-PN20是一款非硅导热硅胶片,俗称不出油的导热硅胶片。导热系数2.0W ,无硅氧烷挥发、高绝缘、高压缩性、低硬度,核心对应富士高分子NR-D系列,贝格斯Gap pad 2200SF。
金菱通达专业做导热材料14年,提供导热胶/凝胶/垫片/结构胶/硅脂/绝缘片解决方案,服务行业前十头部客户
金菱通达专业做导热材料14年,导热材料产品种类齐全,且导热材料服务于各行业前10的头部客户,下面给大家介绍金菱通达导热材料主要的分类。
What is Thermal Pad?
Thermal pads are essential components in modern electronic devices, designed to facilitate efficient heat transfer from heat-generating components to heat sinks or other cooling solutions. Understanding what thermal pads are and their importance can help you choose the right material for your specific application.
非硅酮保温胶带/XK-TN08
XK-TN08是一种热导、电绝缘的双面胶带。具有优异的永久粘合性质、高热传导率和良好的绝缘性能。适用于需要电气隔离的应用,如处理器散热器和PCB散热片的安装。
金菱通达 - NON-SILICONE THERMAL TAPE,非硅酮热敏带,XK-TN08,XK-TN,发光二极管,HEAT SPREADER,散热器,散热片,HEAT SINK,LED,处理器,印刷电路板,PROCESSOR,PCB
【经验】导热硅胶片硬度分析和选型经验分享
那导热硅胶片要怎么选型呢?其实导热硅胶片硬度对于导热硅胶片选型来说是一个很重要的参考指标。今天,金菱通达电子就跟您详细分析一下,如何通过导热硅胶片硬度来进行选型,让您尽量避免入坑。
中国领先导热材料制造商 热对策专家 热失控解决方案领跑者
深圳市金菱通达电子有限公司,作为国内领先的导热材料制造商,专注于高端导热品牌GLPOLY的研发和生产。公司拥有14年行业经验,30多项研发专利,提供包括导热垫片、凝胶、结构胶等在内的160多种产品,支持客户定制。公司产品广泛应用于动力电池、无人机、军工装备等领域,并与蔚来汽车、大疆、华为等头部企业建立了合作关系。金菱通达以军工级品控和精准解决客户导热痛点为核心竞争力,致力于为客户提供全生命周期服务。
金菱通达 - 聚氨酯结构胶,双剂导热胶,导热绝缘薄材,导热结构胶,导热相变材料,导热垫片,导热双面胶带,改性环氧结构胶,有机硅结构胶,非硅导热凝胶,陶瓷化多功能导热/隔热结构胶,非硅导热垫片,聚氨酯导热结构胶,无应力凝胶,车规级改性环氧导热灌封胶,改性环氧导热结构胶,XK-CD,XK-P系列,XK-D,XK-G,XK-CD12L,XK-S系列,XK-U系列,XK-T589S,XK-S,XK-SF15,XK-U,XK-D系列,XK-D12L,XK-G系列,XK-PN系列,XK-D30L,XK-D153,XK-F20ST,XK-TN08,XK-D20L,XK-P,XK-U528,XK-PN,XK-D08L,XK-CCD06,XK-CD12,XK-U08L,XK-F35,XK-C16,XK- GN系列,XK-U12L,XK-U20L,XK-GN系列,XKCD20,XK-F10ST,XK-GN,XK-CD系列,毫米波雷达设备,军工装备,航天航空,大圆柱动力电池,车载电子,摄像头,PHEV,L3-L5自动驾驶系统,反恐委员会,军工,军工产品,无人机,动力电池,高速光通信模块,5G通讯,柔性电路板,氢能源电机控制系统,自动驾驶系统,扩音设备,电池极耳,高性能动力电池,LED灯,开关电源,高效率高发热设备,储能系统,通讯,6G通讯,AI电子,车灯,海底电缆,工控设备,光学器件,储能,自动驾驶,电源模块,新能源汽车,计算机周边,LED,医疗电子,油冷电机,大功率电晶体,核电,CTB,碳化硅电驱系统,电源装置,CTC,发光二极管,MOS管,轨道交通,汽车电子,EV动力电池,CTP,能动力电池,基础版动力电池,计算机
非硅酮导热垫/XK-PN20
非硅热垫(XK-PN20)适用于对硅胶敏感的应用。这种软垫具有高电绝缘性和热性能。
金菱通达 - 非硅酮热垫,NON-SILICONE THERMAL PAD,XK-PN20,光纤模块,数字磁盘驱动器,DIGITAL DISK DRIVES,FIBER OPTICS MODULES
非硅酮保温胶带/XK-TN12
XK-TN12是一种热导、电绝缘的双面胶带,具有优异的永久粘合性质和高热传导率。适用于需要电气隔离的应用,如处理器散热器和PCB散热片的安装。
金菱通达 - NON-SILICONE THERMAL TAPE,非硅酮热敏带,XK-TN12,XK-TN,发光二极管,HEAT SPREADER,散热器,散热片,HEAT SINK,LED,处理器,印刷电路板,PROCESSOR,PCB
机顶盒项目采用富士高分子Fujipoly XR-PE导热垫片,想进行国产化替代,贵司是否有推荐?
您好,可以采用金菱通达的XK-P80-PUTTY导热垫片,产品的详细信息请见如下网址:https://www.sekorm.com/doc/2034023.html
gb/t5471-1988电子冷却产品热接口材料及定制解决方案目录
PARKER CHOMERICS - 触摸屏镜头,COMMERCIAL AND MILITARY HONEYCOMB VENTS,PHASE-CHANGE MATERIALS (PCM),THERMAL GREASE,拉链式电缆屏蔽,定制集成热/电磁干扰组件,塑料或玻璃层压,TRADITIONAL THERMOPLASTICS,电磁干扰屏蔽塑料,粘合剂,弹簧手指,SPRINGFINGERS,CABLE SHIELDING,聚合物焊料混合物(PSH),箔层压板,FOIL LAMINATES,THERMALLY CONDUCTIVE GAP FILLER PADS,THIN FLEXIBLE HEAT SPREADERS,无硅热垫,CONDUCTIVE ELASTOMERS,RF ABSORBING MATERIALS,组合垫片,热界面材料,WIRE MESH TAPE,METAL MESH,直接金属化和导电涂料,钢丝网带,HARD COATED LENS PROTECTORS,EMI SHIELDING PLASTICS,EMI SHIELDING VENTS,ELECTRICALLY-CONDUCTIVE PLASTICS,射频吸收材料,完全固化的可溶热凝胶,TOUCHSCREEN LENSES,Z-AXIS FOAM,FERRITES AND HEAT-SHRINK TUBING,COMBINATION GASKETS,POLYMER SOLDER HYBRIDS (PSH),密封剂,THERMAL INTERFACE MATERIALS,抗反射/对比度增强滤光片,金属垫片,CONDUCTIVE TAPES,泡沫上的织物,传统热塑性塑料,SEALANTS,COATINGS,DISPENSABLE THERMAL COMPOUNDS,电缆屏蔽,SHIELDED OPTICAL WINDOWS,导电泡沫垫片,FABRIC-OVER-FOAM,可溶热化合物,导热间隙填充垫,CONDUCTIVE COMPOUNDS,相变材料(PCM),EMI屏蔽滤波器(导电涂层和金属丝网),嵌缝,导电化合物,涂料,绝缘垫,CONDUCTIVE FOAM BASED GASKETS,PLASTIC OR GLASS LAMINATIONS,METAL GASKETS,导电弹性体,DIRECT METALLIZATION AND CONDUCTIVE PAINTS,SILICONE-FREE THERMAL PADS,CAULKS,ADHESIVES,硬涂层透镜保护器,EMI SHIELDING FILTERS (CONDUCTIVE COATING & WIRE MESH),金属网,薄型柔性散热片,散热膏,EMI屏蔽通风口,导电胶带,ANTI-REFLECTIVE/CONTRAST ENHANCEMENT FILTERS,导电塑料,CUSTOM INTEGRATED THERMAL/EMI ASSEMBLIES,屏蔽光学窗,ZIPPERED CABLE SHIELDING,FULLY CURED DISPENSABLE THERMAL GELS,商用和军用蜂窝状通风口,Z轴泡沫,铁氧体和热缩管,DIELECTRIC PADS,GEL30,WW-XX-5442-ZZZZ,WW-XX-D426-ZZZZ,G570,T500,WW-XX-D387-ZZZZ,8010,G974,WW-XX-D390-ZZZZ,WW-XX-4659-ZZZZ,WW-XX-D411-ZZZZ,G579,WW-XX-D374-ZZZZ,A580,T630,WW-XX-D391-ZZZZ,WW-XX-4661-ZZZZ,WW-XX-D409-ZZZZ,WW-XX-D425-ZZZZ,0800,5192-6,WW-XX-D386-ZZZZ,HCS40,WW-XX-D372-ZZZZ,WW-XX-D375-ZZZZ,WW-XX-D430-ZZZZ,WW-XX-D410-ZZZZ,WW-XX-D424-ZZZZ,WW-XX-D427-ZZZZ,WW-XX-D408-ZZZZ,WW-XX-D413-ZZZZ,G569,WW-XX-D388-ZZZZ,65-00-T670-3790,1100,WW-XX-D399-ZZZZ,1900,T63X,WW-XX-D423-ZZZZ,T647,60-12-20264-TW10,T404,T405,T646,T766,T644,WW-XX-D376-ZZZZ,T642,WW-XX-5792-ZZZZ,WW-XX-D385-ZZZZ,0150,WW-XX-D429-ZZZZ,WW-XX-D398-ZZZZ,T630G,WW-XX-D414-ZZZZ,2200,65-00-YYYY-ZZZZ,T650,T636,T635,WW-XX-D389-ZZZZ,G580,WW-XX-5527-ZZZZ,10000D5152,WW-XX-D407-ZZZZ,WW-XX-D395-ZZZZ,1400,1642,WW-XX-8531-ZZZZ,1641,WW-XX-D392-ZZZZ,WW-XX-4969-ZZZZ,WW-XX-D370-ZZZZ,WW-XX-4374-ZZZZ,WW-XX-D373-ZZZZ,WW-XX-D401-ZZZZ,6W-XX-YYYYY-ZZZZ,65-00-1642-0000,WW-XX-D404-ZZZZ,WW-XX-6875-ZZZZ,WW-XX-D420-ZZZZ,60-12-20267-TW10,PC07DM-7,WW-XX-D379-ZZZZ,WW-XX-D396-ZZZZ,WW-XX-D382-ZZZZ,WW-XX-D418-ZZZZ,WW-XX-D403-ZZZZ,274,WW-XX-4306-ZZZZ,550,0600,65-00-1641-0000,65-00-T644-0045,0200,65-00-T644-0200,GEL 30,WW-XX-4353-ZZZZ,WW-XX-D397-ZZZZ,T670,WW-XX-D417-ZZZZ,WW-XX-D378-ZZZZ,65-00-T642-0035,T405-R,T418,WW-XX-D419-ZZZZ,WW-XX-D383-ZZZZ,WW-XX-D405-ZZZZ,T777,T413,WW-XX-D380-ZZZZ,T414,T411,T412,WW-XX-D402-ZZZZ,1671,60-12-20266-TW10,60-12-20269-TW10,1150,870 SERIES,WW-XX-D416-ZZZZ,WW-XX-D421-ZZZZ,WW-XX-D377-ZZZZ,WW-XX-4997-ZZZZ,569,WW-XX-D065-ZZZZ,WW-XX-4305-ZZZZ,T660,HCS10,T725,TS15,65-00-T642-0250,T444,GEL 8010,65-00-T646-0045,0075,A569,65-01-1641-0000,WW-XX-4511-ZZZZ,WW-XX-D393-ZZZZ,T609,570,174,65-00-T646-0200,WW-XX-D400-ZZZZ,1678,574,WW-XX-D428-ZZZZ,WW-XX-5791-ZZZZ,2400,1674,WW-XX-D371-ZZZZ,WW-XX-8302-ZZZZ,WW-XX-D422-ZZZZ,974,579,0100,976,WW-XX-D406-ZZZZ,65-00-T647-0200,65-00-T647-0045,250A-6OZ,WW-XX-6956-ZZZZ,WW-XX-D394-ZZZZ,0900,65-00-T650-0160,T558,HCS10G,T710,T557,A579,580,WW-XX-4996-ZZZZ,1600,A570,WW-XX-D384-ZZZZ,0750,WW-XX-D415-ZZZZ,HCS10A,60-12-20268-TW10,T441,60-12-20265-TW10,WW-XX-D381-ZZZZ,WW-XX-D412-ZZZZ,通讯设备,INFORMATION TECHNOLOGY,无线通讯,COMMUNICATIONS EQUIPMENT,飞机,TELECOMMUNICATIONS,消费设备汽车工业电子,DEFENSE,CONTROL SYSTEMS,信息技术,MEDICAL DEVICE,医疗器械,CONSUMER,COMPUTERS,国防,控制系统,AIRCRAFT,POWER CONVERSION,TRANSPORTATION MARKETS,功率转换,RADAR,雷达,CONSUMER DEVICES AUTOMOTIVE INDUSTRIAL ELECTRONICS,消费,运输市场,计算机
【选型】金菱通达导热硅胶片XK-P60在压缩机MOS管上成功应用,兼具产品性能与性价比
深圳市金菱通达电子有限公司研发生产的导热硅胶片XK-P60获某压缩机厂家用于MOS管绝缘导热测试通过,8月中旬将正式量产。
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