GLPOLY XK-GN30 Thermal Gel

Therm-A-Gap™凝胶可分配，极低压缩力，热填缝剂

PARKER CHOMERICS  -  THERMAL GAP FILLERS,导热凝胶,THERMALLY CONDUCTIVE GELS,热间隙填料,T636,T635,THERM-A-GAP™,GEL 45,65-XX-YYYYY-ZZZZ,GEL 25NS,GEL 8010,T630,GEL 75,GEL 30,TC50,GEL 37,制动控制,MOSFET ARRAYS WITH COMMON HEAT SINKS,CONSUMER ELECTRONICS,消费电子,电子控制单元,功率半导体,TELEVISIONS,UNINTERRUPTIBLE POWER SUPPLIES,具有共用散热器的MOSFET阵列,发动机控制,ENGINE CONTROL,POWER CONVERSION EQUIPMENT,不断电系统,TRACTION CONTROL,变速箱控制,AUTOMOTIVE ELECTRONIC CONTROL UNITS,电视机,POWER SUPPLIES,牵引力控制,功率转换设备,POWER SEMICONDUCTORS,汽车电子控制单元,电源,BRAKING CONTROL,TRANSMISSION CONTROL,ECUS

Glpoly XK-G40热凝胶

本资料为GLPOLY XK-G40热凝胶的技术数据表。内容包括材料属性、操作程序与建议、优点与优势、包装规格以及有限保修信息。

金菱通达  -  THERMAL GEL,热凝胶,XK-G,XK-G40,XK-G SERIES,AUTOMOTIVE SYSTEMS,HAND-SET APPLICATIONS,消费电子,远程通信,汽车系统,TELECOMMUNICATION,CONSUMER ELECTRONICS,手机应用

HTG-100D系列双组分导热凝胶系列[导热填隙材料]数据表

HTG-100D系列双组分导热凝胶是一种可在室温下固化的热传导膏，固化后呈柔性橡胶弹性体。适用于电子/电气领域有散热需求的场合，特别适合不同组件之间有较大散热片间隙的情况。该产品可通过自动点胶实现自动化操作。

鸿富诚  -  HEAT CONDUCTIVE PASTE,双组份导热凝胶,TWO COMPONENT THERMAL CONDUCTIVE GEL,导热膏,THERMAL GAP FILLER,热间隙填料,HTG-100D SERIES,HTG-100D,LED灯,LED LAMPS,CONSUMER ELECTRONICS,SEMICONDUCTORS,汽车,半导体,高性能CPU,电子领域,消费电子,DISPLAY CARD PROCESSOR,电场,显示卡处理器,LUMINARIES,ELECTRICAL FIELD,散热器,RADIATOR,ELECTRONIC FIELD,AUTOMOTIVE,HIGH PERFORMANCE CPU,发光体

Parker Chomerics（派克固美丽）热界面材料（用于电子产品散热）选型指南

Company Profile    Heat Transfer Fundamentals    Thermal Gels    Gap Filler Pads    Phase Change Materials    Thermal Tapes    Potting and Underfill Materials    Dielectric Pads    Heat Spreaders    Thermal Greases    Glossary   

PARKER CHOMERICS  -  THERMALLY CONDUCTIVE PADS,NON-SILICONE,PHASE-CHANGE THERMAL INTERFACE PADS,热间隙填充垫,HEAT SPREADERS,热绝缘体,间隙填充垫,DOUBLE-SIDED THERMAL TAPES,热敏胶带,热润滑脂,压敏黏合剂,THERMAL INTERFACE MATERIALS,THIN HEAT SPREADERS,DOUBLE-SIDED THERMAL INTERFACE TAPES,PRESSURE SENSITIVE ADHESIVE,THERMAL TAPES,PSA,GELS,THERMAL GAP FILLER PADS,HEAT SPREADERS,THERMAL INTERFACE MATERIALS,THERMAL INSULATOR PADS,THERMAL INSULATORS,散热器,导热垫,GAP FILLER PADS,THERMAL GREASES,导热电绝缘垫,PADS,UNDERFILL MATERIALS,THERMALLY CONDUCTIVE GAP FILLER PADS,PHASE CHANGE MATERIALS,灌封材料,THERMALLY CONDUCTIVE ATTACHMENT TAPES,THERMAL GREASES,底部填充材料,THERMALLY CONDUCTIVE ELECTRICAL INSULATOR PADS,热凝胶,导热间隙填充垫,导热连接带,绝缘垫,POTTING MATERIALS,非硅胶，相变热界面垫,THERMAL GAP FILLERS,GAP FILLERS,NON-SILICONE, PHASE-CHANGE THERMAL INTERFACE PADS,SILICONE GREASE,导热凝胶,DIELECTRIC PADS,相变材料,THERMALLY CONDUCTIVE GELS,THERMAL GELS,PAD30G,60-XX-D065-ZZZZ,60-XX-4353-ZZZZ,60-XX-D379-ZZZZ,60-XX-D417-ZZZZ,G570,PAD30A,GEL 75,T500,60-XX-6875-ZZZZ,60-XX-D420-ZZZZ,G974,60-XX-D381-ZZZZ,60-XX-4305-ZZZZ,60-XX-D382-ZZZZ,G579,579PN,A580,60-XX-D396-ZZZZ,T630,60-XX-4997-ZZZZ,60-XX-4306-ZZZZ,PAD 30,60-XX-D416-ZZZZ,6W-XX-YYYY-ZZZZ,60-XX-4996-ZZZZ,60-XX-D421-ZZZZ,60-XX-D402-ZZZZ,60-XX-6956-ZZZZ,60-XX-D404-ZZZZ,G569,60-XX-D415-ZZZZ,60-XX-D418-ZZZZ,60-XX-D429-ZZZZ,65-00-T670-3790,65-1P-CIP35-5600,60-XX-D395-ZZZZ,60-XX-D398-ZZZZ,60-XX-5792-ZZZZ,69-1X-YYYYY-ZZZZZZ,65-00-CIP35-0400,60-XX-D406-ZZZZ,T404,T647,60-12-20264-TW10,PAD60A,T405,T646,60-XX-D400-ZZZZ,T766,T644,T642,60-XX-4511-ZZZZ,60-XX-D384-ZZZZ,60-XX-D428-ZZZZ,60-XX-5791-ZZZZ,65-00-YYYY-ZZZZ,60-XX-D419-ZZZZ,T650,60-XX-D385-ZZZZ,60-XX-D391-ZZZZ,T636,T635,60-XX-D394-ZZZZ,G580,TC50,60-XX-D397-ZZZZ,60-XX-D378-ZZZZ,60-XX-D375-ZZZZ,60-XX-D425-ZZZZ,1641,65-5P-CIP35-10452,60-XX-D422-ZZZZ,60-XX-D372-ZZZZ,60-XX-D403-ZZZZ,60-12-20267-TW10,GEL 37,6W-XX-1015-ZZZZZZ,60-XX-D373-ZZZZ,60-XX-D409-ZZZZ,PC07DM-7,60-XX-4661-ZZZZ,579KT,60-XX-D387-ZZZZ,60-XX-YYYY-ZZZZ,60-XX-D412-ZZZZ,65-00-1641-0000,60-XX-D388-ZZZZ,65-00-T644-0045,65-00-T644-0200,GEL 30,64-XX-YYYY-ZZZZ,60-XX-D374-ZZZZ,60-XX-D390-ZZZZ,60-XX-4659-ZZZZ,60-XX-D408-ZZZZ,T670,65-00-T642-0035,T405-R,60-XX-4374-ZZZZ,T418,60-XX-D424-ZZZZ,60-XX-D410-ZZZZ,GEL 45,T777,1642 65-00-1642-0000,60-XX-D413-ZZZZ,T414,T411,T412,1671,60-12-20266-TW10,60-XX-8531-ZZZZ,60-12-20269-TW10,60-XX-D407-ZZZZ,PAD 60,569PN,60-XX-5527-ZZZZ,65-XX-YYYYY-ZZZZ,60-XX-5442-ZZZZ,60-XX-D426-ZZZZ,569,65-00-CIP35-0200,65-00-CIP35-0045,T660,PAD30PN,HCS10,T725,60-XX-D370-ZZZZ,60-XX-D376-ZZZZ,67-XX-YYYY-ZZZZ,65-00-T642-0250,60-XX-8302-ZZZZ,T444,GEL 8010,T766-06,65-00-T646-0045,A569,65-01-1641-0000,60-XX-D423-ZZZZ,PAD30KT,60-XX-D392-ZZZZ,60-XX-4969-ZZZZ,T609,570,65-00-T646-0200,1678,1674,60-XX-D371-ZZZZ,974,60-XX-D399-ZZZZ,60-XX-D405-ZZZZ,579,60-XX-D401-ZZZZ,976,60-XX-D377-ZZZZ,65-00-CIP35-1200,65-00-T647-0200,65-00-T647-0045,60-XX-D393-ZZZZ,60-XX-D427-ZZZZ,65-00-T650-0160,T558,HCS10G,6W-XX-0909-ZZZZZZ,T710,T557,CIP 35,60-XX-D383-ZZZZ,A579,PAD60,60-XX-D386-ZZZZ,580,60-XX-D389-ZZZZ,A570,60-XX-D430-ZZZZ,GEL 25NS,60-XX-D411-ZZZZ,HCS10A,60-XX-D414-ZZZZ,60-12-20268-TW10,T441,60-XX-D380-ZZZZ,60-12-20265-TW10,电机控制器,INFORMATION TECHNOLOGY,TELECOMMUNICATION INFRASTRUCTURE COMPONENTS,MEMORY MODULES,TELEVISIONS,GRAPHICS PROCESSORS,不间断电源,UPS,电信基础设施组件,不断电系统,HANDHELD PORTABLE ELECTRONICS,图形处理器,MEDICAL DEVICE,MOTOR,POWER CONVERSION,LIGHT EMITTING DIODE,LIGHTING,电机控制处理器,金属氧化物半导体场效应晶体管阵列,POWER SEMICONDUCTORS,汽车电子控制单元,SERVER CPU,ENGINE CONTROLLERS,CONSUMER ELECTRONICS,手机,POWER MODULES,MOTOR CONTROLLERS,INDUSTRIAL APPLICATIONS,AUTOMOTIVE ELECTRONIC CONTROL UNIT,LAPTOP PC,UNINTERRUPTIBLE POWER SUPPLIES,欧洲货币单位,DEFENSE,服务器CPU,ENGINE CONTROL,TELECOMMUNICATIONS EQUIPMENT,PC PROCESSORS,微处理器,MOSFET ARRAYS,HIGH SPEED DISK DRIVES,发动机,AUTOMOTIVE ELECTRONICS,牵引力控制,MOBILE,电视和电子产品,TRANSPORTATION,发光二极管,ECU,工业应用,笔记本电脑,AEROSPACE,内存模块,汽车电子,TRANSMISSION CONTROL MODULES,制动控制,LAPTOP PCS,发动机控制,TRACTION CONTROL,桌面,ENGINE,AUTOMOTIVE ELECTRONIC CONTROL UNITS,发光二极体,POWER SUPPLIES,MOTOR CONTROL PROCESSORS,TELECOMMUNICATIONS,功率转换设备,个人电脑处理器,BRAKING CONTROL,TELEVISIONS ELECTRONICS,CONSUMER ELECTRONICS,CHIPSETS,发动机控制器,消费电子,功率半导体,无线通讯,LEDS,TELECOMMUNICATIONS,GRAPHICS PROCESSORS,SERVERS,DESKTOP,MICROPROCESSORS,POWER CONVERSION EQUIPMENT,变速箱控制,CONSUMER,HANDHELD DEVICES,LAPTOPS,电视机,DESKTOP COMPUTERS,变速器控制模块,MOBILE,LED,手持便携式电子设备,高速磁盘驱动器,INDUSTRIAL,CPUS,电源,TRANSMISSION CONTROL

金菱通达（GLPOLY）热对策材料选型指南

Company Profile    Low Density Thermally Conductivity Silicone Gel Pad/Stressless Silicone Thermal Putty Gel    Thermal Pad    Thermal Silicone Pad & Silicone Thermal Fiberglass/Film    EMI absorber/Absorption Gel    Two-part Liquid Thermal Gap Pad/PCMs/Non-Silicone Sealing Compound    Silicone/Non-Silicone Thermal grease    Silicone Thermal Tape    Graphite Thermal radiation Pad/Vibration Dampening Silicone Pad   

金菱通达  -  低密度导热硅凝胶垫,NON-SILICONE THERMAL TAPE,NON-SILICONE THERMAL GREASE,LOW DENSITY THERMAL GAP PAD FOR EV BMS,ELECTROSTATIC DISCHARGE THERMAL SILICONE PAD,热间隙垫,硅酮热膜,减振硅胶垫,硅橡胶热垫,NON-SILICONE THERMAL FIBERGLASS,非硅酮热玻璃纤维,无硅密封剂,热腻子凝胶,PRINTABLE PCM THERMAL LNTERFACE MATERIAL,热界面相变材料,导热电磁干扰吸收软垫,SILICONE THERMAL FIBERGLASS,无应力硅酮热腻子凝胶,脉冲编码调制系统,EML吸收器,非硅酮热敏带,EMI ABSORBER,石墨热辐射垫,热EMI吸收凝胶,用于电动汽车BMS的低密度热间隙衬垫,THERMALLY CONDUCTIVE INSULATOR,非硅酮热垫,THERMALLY CONDUCTIVE EMI ABSORBER,双组分热界面密封剂,静电放电散热硅胶垫,THERMAL CONDUCTIVE SILICONE GEL PAD,SILICONE RUBBER THERMAL PAD,导热粘合剂,THERMAL FIBERGLASS,THERMAL INTERFACE PHASE CHANGE MATERIALS,PRINTABLE PCM THERMAL INTERFACE MATERIAL,ELECTROSTATIC DISCHARGE THERMAL GAP PAD,可印刷PCM热界面材料,GRAPHITE THERMAL RADIATION PAD,非硅酮热润滑脂,非硅酮腻子凝胶,THERMAL EMI ABSORPTION GEL,THERMAL PUTTY GEL,NON-SILICONE THERMAL PAD,SILICONE RUBBERTHERMAL PAD,SILICONE THERMAL PUTTY PAD,两部分液体热间隙垫,硅酮热垫,导热绝缘体,两部分可分配热垫,硅热玻璃纤维,SILICONE FREE SEALING COMPOUND,硅酮热腻子垫,STRESSLESS SILICONE THERMAL PUTTY GEL,THERMAL GREASE,NON-SILICONE THERMAL GREASE,SILICONE THERMAL PAD,PHASE CHANGE MATERIALS,静电放电热间隙垫,SILICONE THERMAL FILM,热界面润滑脂,EML ABSORBER,热玻璃纤维,SILICONE THERMAL TAPE,热导率EML吸收体PCM,THERMAL CONDUCTIVITY EMI ABSORBER SOFT PAD,TWO-PART THERMAL INTERFACE SEALING COMPOUND,导热硅凝胶垫,THERMAL GAP PAD,硅酮热敏带,THERMALLY CONDUCTIVE ADHESIVE,PCMS,非硅酮密封剂,VIBRATION DAMPENING SILICONE PAD,硅热凝胶,SILICONE PUTTY PAD,THERMAL CONDUCTIVITY EMI ABSORBER,非硅酮型,硅热润滑脂,NON-SILICONE SEALING COMPOUND,导热EMI吸收材料,TWO-PART DISPENSABLE THERMAL PAD,TWO-PART LIQUID THERMAL GAP PAD,THERMAL LNTERFACE GREASE,散热膏,THERMAL INTERFACE GREASE,NON-SILICONE PUTTY GEL,硅酮腻子垫,THERMAL CONDUCTIVITY EML ABSORBER PCM,NON-SILICONE TYPE,相变材料,导热EMI吸收凝胶,SILICONE THERMAL GREASE,THERMALLY CONDUCTIVE EMI ABSORPTION GEL,SILICONE THERMAL GEL,LOW DENSITY THERMALLY CONDUCTIVITY SILICONE GEL PAD,XK-G20E,XK-P20系列,XK-R系列,XK-P PUTTY,XK-PN50,XK-Z系列,XK-P20LD,XK-P80,XK-RE SERIES,XK-RAY310,XK-A100,XK-FN系列,XK-F系列,XK-FN,XK-FN20,XK-J系列,XK-C35D,XK-C35C,XK-PN45,XK-GN SERIES,XK-Z,XK-FST,XK-F35,XK-R30,XK-Z SERIES,XK-F10ST,XK-FN10,XK-P PUTTY SERIES,XK-FN15,XK-FST系列,XK-SF SERIES,XK-P45-PUTTY,XK-GN20,XK-Z15,XK-RE系列,XK-FN50,XK-X SERIES,XK-T SERIES,XK-G40,XK-F20,XK-J20,XK-SF35,XK-XN40,XK-P60,XK-RAY,XK-J25,XK-FST SERIES,XK-C系列,XK-SN SERIES,XK-R20,XK-G系列,XK-PN系列,XK-K系列,XK-TN08,XK-GN15,XK-XN系列,XK-SN系列,XK-FN40,XK-XN50,XK-G30,XK-S15LV,XK-F10,XK-C35,XK-PN60,XK-S30LV,XK-TN,XK-J10,XK-P50,XK-F15,XK-A SERIES,XK-TN12,XK-PS SERIES,XK-R10,XK-J18,XK-X50,XK-SF系列,XK-R15,XK-P30S20,XK-A80,XK-A60,XK-P系列,XK-PLD SERIES,XK-P20 SERIES,XK-PN15,XK-T系列,XK-P50-PUTTY,XK-C20,XK-X系列,XK-G20,XK-S20LV,XK-C25,XK-PLD,XK-SN,XK-SF15,XK-GEL 100,XK-SF18,XK-SN10,XK-P45,XK-PS系列,XK-P80-P,XK-SF,XK-K4,XK-X40,XK-TN SERIES,XK-F20ST,XK-K6,XK-P20S,XK-F SERIES,XK-GN30,XK-J SERIES,XK-S12LV,XK-C15,XK-C16,XK-P PUTTY 系列,XK-K10,XK-P15LD,XK-G15,XK-P50-P,XK-P30,XK-SN20,XK-P SERIES,XK-P80-PUTTY,XK-RE,XK-PN SERIES,XK-C,XK-TN系列,XK-G,XK-F,XK-F60,XK-R SERIES,XK-S25LV,XK-PN30,XK-A,XK-P20S20,XK-R,XK-A系列,XK-T,XK-R10E9,XK-PLD系列,XK-P20,BETA GEL 100,XK-X,XK-P25,XK-K,XK-J,XK-P45-P,XK-RAY SERIES,XK-P,XK-G SERIES,XK-PN,XK-T09,XK-A30,XK-PS,XK-F50,XK-F15ST,XK-C SERIES,XK-PN20,XK-K SERIES,XK-XN,XK-XN10,XK-XN SERIES,XK-RAY 系列,XK-P10LD,XK-FN SERIES,XK-R50,XK-GN系列,XK-T12,XK-GN,XK-ANFC,XK-X10,电机控制,MOTOR CONTROLS,空中飞行,OPTICAL PRODUCTS,HEAT SINK,军事的,摄像头,DIGITAL DISK DRIVES,北桥集成电路,医学电子学,MEDICAL ELECTRONICS,DC-DC CONVERTERS,高压装置,NEW ENERGY VEHICLES,AEROSPACE,散热片,COMPUTER,HIGH FREQUENCY IC CHIP,CAMERA,存储设备,手机应用,AIR FLIGHT,GRAPHIC CARDS,POWER SUPPLIES,光学产品,LED LIGHT,PERIPHERALS,HIGH PERFORMANCE COMPUTER PROCESSORS GRAPHIC CARDS,HAND-SET APPLICATIONS,POWER CONVERSION,TELECOMMUNICATIONS,工业控制设备,LED LIGHTING,POWER SEMICONDUCTORS,CELLULAR PHONES,FPC,军工设备,MILITARY EQUIPMENT,HIGH PERFORMANCE COMPUTER PROCESSORS,CONSUMER ELECTRONICS,射频模块,LED灯,CONSUMER ELECTRONICS,手机,HIGH VOLTAGE UNITS,SEMICONDUCTOR,消费电子,RF MODULE,航空航天,功率半导体,无线通讯,光纤模块,UAV,TELECOMMUNICATIONS,COMPUTER,医疗器件,DC-DC转换器,数字磁盘驱动器,高性能计算机处理器,STORAGE DEVICE,FIBER OPTICS MODULES,MILITARY,MEDICAL DEVICES,AUTOMOTIVE SYSTEMS,半导体,医疗设备,MEDICAL EQUIPMENT,AUTOMOTIVE ELECTRONICS,新能源汽车,LED,COMPUTER CPU,计算机中央处理器,功率转换,TELECOMMUNICATIONS CAMERA,LED照明,图形卡,外围设备,INDUSTRIAL CONTROL EQUIPMENT,电脑,NORTH BRIDGE IC,发光二极管,电源,汽车系统,高频集成电路芯片,汽车电子,柔性线路板,无人飞机

COLLTECH热界面材料

德聚  -  THERMAL GREASE,间隙填充剂,THERMAL INTERFACE MATERIALS,PU,EPOXY,MS,硅酮,SILICONE,热界面材料,THERMAL POTTING COMPOUND,导热粘合剂,微软,散热膏,THERMAL GEL,蒲蒲,环氧树脂,热灌封胶,THERMALLY CONDUCTIVE MATERIALS,热凝胶,ACRYLATE,丙烯酸酯,THERMALLY CONDUCTIVE ADHESIVE,GAP FILLER,导热材料,N-SIL 8780,N-SIL 8516W,N-SIL 8762S,N-SIL 8762,N-SIL 8220L1,N-SIL 8620,EW 6628M,N-SIL 8220L2,N-SIL 8626LS,N-SIL 8745,N-SIL 8206,N-SIL 8742M,N-SIL 8628,N-SIL 8628LS,N-SIL 8745B,N-PU 5820,N-SIL 8608D,N-SIL 8650-2,N-SIL 8275,N-SIL 8210,N-SIL 8745NSL,N-SIL 8772,N-SIL GP8772,N-SIL 8518,N-SIL 8206N,N-SIL 8215L1,AW 2925,INDUSTRIES,SEMICONDUCTOR,电信,汽车,手持设备可穿戴设备,消费电子,个人计算机,电池模块,DRONE,ADAS,DATA CENTER,AUTOMOTIVE,IGBT,CHIP PACKAGING,车载充电器,功率转换器,MEMS,POWER CONVERTERS,行业,PHOTOVOLTAICS,半导体,POWER BATTERY,无人机,TELECOMMUNICATION,动力电池,HAND HELD DEVICESWEARABLES,LED,微机电系统,数据中心,CONSUMER ELECTRONICS,ONBOARD CHARGER,智能家居类,PC,BATTERY MODULES,发光二极管,SMART HOME,阿达斯,ECU,DCU,光伏学,芯片封装

Parker Chomerics（派克固美丽）热界面材料（热传导性凝胶/在位灌封材料/润滑脂）选型指南

Company Profile    Overview of Dispensable Materials    Material Selection    Equipment Types    Technical Parameters    Packaging Options   

PARKER CHOMERICS  -  现场固化灌封化合物,GELS,ELECTRONIC APPLICATION,UNDERFILL MATERIALS,导热凝胶,DISPENSABLE, VERY LOW COMPRESSION FORCE, THERMAL GAP FILLERS,THERMAL GREASES,THERM-A-GAP™ GELS,CURE-IN-PLACE POTTING COMPOUNDS,热接口材料,热润滑脂,TIM,THERMALLY CONDUCTIVE GELS,THERMAL INTERFACE MATERIAL,POTTING MATERIALS,T636,T647,T635,T646,CIP 35,GEL 30,T642,TC 50,GEL 25NS,1642,1641,GEL 8010,T630,GEL 75,T650,GEL 45,T660,T670,GEL 37,HIGH-VOLUME AUTOMATED DISPENSING SYSTEMS,配药设备,制动控制,CONSUMER ELECTRONICS,消费电子,POWER DRIVERS,MEMORY MODULES,功率半导体,TELEVISIONS,移动服务器,DC/DC CONVERTERS,DC/DC转换器,LED模块,欧洲货币单位,MICROPROCESSORS,电信基站,不间断电源,TELECOM BASE STATION,POWER CONVERSION EQUIPMENT,TELECOM BASE STATIONS,AUTOMOTIVE ELECTRONIC CONTROL UNIT,DISPENSING EQUIPMENT,ENGINE,AUTOMOTIVE ELECTRONIC CONTROL UNITS,MOBILE SERVERS,微处理器,POWER SUPPLIES,BRAKING CONTROLS,MOSFET ARRAYS,发动机,牵引力控制,UNINTERRUPTABLE POWER SUPPLIES,功率转换设备,TRACTION CONTROLS,电视和电子产品,金属氧化物半导体场效应晶体管阵列,功率驱动器,POWER SEMICONDUCTORS,汽车电子控制单元,DESKTOPS,电源,ECU,高容量自动分配系统,TELEVISIONS ELECTRONICS,内存模块,台式机,LED MODULES

可有可无的导热凝胶系列[导热填缝剂]数据表

本资料介绍了HFC公司生产的可移除热导凝胶系列产品，适用于电子电气应用中的散热保护。该产品具有高热导率、低热阻、易于自动化应用等特点，适用于半导体、LED灯具、汽车和消费电子产品等领域的散热。

鸿富诚  -  DISPENSABLE THERMAL CONDUCTIVE GEL,THERMAL GAP FILLER,可点胶导热凝胶,热间隙填料,HTDG-250,LED灯,SEMICONDUCTOR,LED LAMPS,CONSUMER ELECTRONICS,冷却电子设备,汽车,半导体,电子应用,消费电子,ELECTRICAL APPLICATIONS,CPU,ELECTRONIC APPLICATIONS,中央处理器,GPU,LUMINARIES,散热器,电气应用,AUTOMOTIVE,RADIATORS,COOLING ELECTRONIC DEVICES,发光体

HFC公司简介

深圳鸿富诚科技有限公司专注于电磁屏蔽材料、热界面材料和吸波材料的研发、生产和销售。公司成立于2003年，拥有超过400名员工，并在美国、日本、香港、台湾等地设有办公室。产品广泛应用于网络通信、手机、电脑、光通讯、新能源汽车等领域。公司拥有一支专业的研发团队，并建立了高效的自动化生产线和质量保证体系。主要产品包括导电泡沫、EMI屏蔽材料、热界面材料等。

鸿富诚  -  超软低热阻系列,UPER SOFT LOW THERMAL RESISTANCE SERIES,SMT GASKET,吸热材料,各向异性热垫,THERMAL INTERFACE MATERIALS,WAVE-ABSORBER MATERIALS,热相变材料,THERMAL ABSORBER MATERIAL,热界面材料,EMI SHIELDING MATERIALS,THERMAL PHASE CHANGE MATERIAL,THERMAL GEL,ANISOTROPIC THERMAL PAD,CONDUCTIVE FOA,热凝胶,EMI屏蔽材料,SMT垫片,导热垫,吸波材料,导电FOA,THERMAL PAD,H150-S,HTG SERIES,H150-S SERIES,H150-LD SERIES,H200-LD SERIES,HFC-A15000,H150-A SERIES,H200-A SERIES,H200-A,H200 S40 SERIES,HFC-A12000,HFC-A18000,HFC-A1000,H150-A,H200 S40,H200-LD,HTG,HFC-A5000,HFC-A25000,H150-LD,HFC-A2000,MAGNETIC SCREEN,贴片,消费电子,NFC,NEW ENERGY BATTERY INDUSTRY,苹果手机，苹果平板,散热模块,光电子产业,家电产品,航空航天领域,MEDICAL INSTRUMENTS MILITARY FIELD,3C电子,WIRELESS CHARQING,FOF垫圈,HEAT-DISSIPATION MODULES,IPHONE, IPAD,EMC,VEHICLES INDUSTRY,EMI,WEARABLE EQUIPMENT,车辆工业,磁屏,新能源电池产业,CHIP,FOF GASKET,网通产品,空气中的导电织物,OPTOELECTRONIC INDUSTRY,AUTOMOTIVE ELECTRONICS,CONDUCTIVE FABRIC OVER AIR,芯片,RFID,3C ELECTRONICS,通信设备,显示,电磁干扰,医疗器械军事领域,NETCOM PRODUCTS,无线CHARQING,可穿戴设备,CONMMUNICATION EQUIPMENTS,SMT,HOUSEHOLD APPLIANCES,AEROSPACE FIELD,汽车电子,CONSUMER ELECTRONICS,电磁兼容,DISPLAY

HTG-150D系列双组分导热凝胶系列[导热填隙材料]数据表

HTG-150D系列双组分导热凝胶是一种可在室温下固化的热传导膏，固化后呈现为柔软的橡胶弹性体。适用于电子/电气领域的散热需求，尤其适合不同组件之间有较大散热器间隙的情况。产品具有优异的导热性能，可自动点胶实现自动化操作。

鸿富诚  -  HEAT CONDUCTIVE PASTE,双组份导热凝胶,TWO COMPONENT THERMAL CONDUCTIVE GEL,导热膏,THERMAL GAP FILLER,热间隙填料,HTG-150D,HTG-150D SERIES,LED灯,LED LAMPS,CONSUMER ELECTRONICS,SEMICONDUCTORS,汽车,半导体,高性能CPU,电子领域,消费电子,DISPLAY CARD PROCESSOR,电场,显示卡处理器,LUMINARIES,ELECTRICAL FIELD,散热器,RADIATOR,ELECTRONIC FIELD,AUTOMOTIVE,HIGH PERFORMANCE CPU,发光体