M.2 NVMe Targeted Product Portfolio, Engineered Specifically for Your Mission Critical Applications PRODUCT FLYER
■基于NVMe的M.2固态模块™协议利用速度极快的PCI Express®（PCIe®）接口，在速度和性能方面提供了显著的改进，以满足企业存储系统对响应能力日益增长的需求，并支持当今企业日益增长的数据需求。在PCIe 3.1 x4插槽上提供32 Gb/s带宽（每个通道8 Gb/s），ATP NVMe SSD的访问速度比串行ATA 6 Gb/s SSD快4-6倍，延迟降低3倍以上，每秒输入/输出（IOPS）更高。具有工业工作温度额定值的ATP NVMe SSD即使在-40°C至85°C的极端温度下也能提供稳定的性能，而动态热节流会自动调整速度，以在高强度和繁重的工作负载下保持较冷的运行。
■采用NVMe 1.3规范并集成3D NAND TLC技术，ATP的M.2 2280 NVMe模块可提供高达1.92TB的存储容量，并通过顺序读取高达3420 MB/s、顺序写入高达3050 MB/s和随机读取/写入IOPS高达225200/179200提供增强的性能。
■NVMe旨在克服机械驱动器的局限性，专为更快、更高效地访问具有非易失性存储器的存储设备而设计，如当前的NAND闪存解决方案和未来的非易失性存储器技术。这些SSD可以为任何要求苛刻的应用提供快速、可靠和持久的性能。
■主要特征
●基于单片机的失电保护设计
●带AES 256位加密的自加密驱动器（SED），TCG OPAL 2.0
●热管理解决方案
●端到端数据保护
●微调功能支持
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M.2 NVMe目标产品组合，专为您的关键任务应用设计产品传单 |
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N600Sc、N650Sc、N650Si、N750Pi、N700Pi、N600Si、AF120GSTJA-8BCIP、AF480GSTJA-8BCIP、AF240GSTJA-8BCXP、AF480GSTJA-8BCXP、AF960GSTJA-8BCXP、AF120GSTJA-8BAXP、AF240GSTJA-8BAXP、AF480GSTJA-8BAXP、AF960GSTJA-8BAXP、AF1T92STJA-8BAXP、AF120GSTJA-8BAXX、AF240GSTJA-8BAXX、AF480GSTJA-8BAXX、AF1T92STJA-8BAXX、AF960GSTJA-8BAXX、AF960GSTJA-8BCIP、AF240GSTJA-8BCIP、AF120GSTJA-8BCXP |
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PRODUCT FLYER,产品宣传折页,商品及供应商介绍 |
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| 世强先进（深圳）科技股份有限公司 | |
| 世强硬创平台www.sekorm.com | |
| 世强硬创平台电子商城www.sekorm.com/supply/ | |
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ATP（华腾国际）固态硬盘选型指南
Since 1991, we have consistently distinguished ourselves as one of the world’s leading original equipment manufacturers (OEM) of high-performance, high-quality and high-endurance NAND flash products and DRAM modules.
ATP - PCIE®GEN4 X4 M.2 2280，U.2 SSD,PCIE® GEN3 NVME M.2 2230 SSD,DDR5 MEMORY,PCIE®GEN3 NVME M.2 2230固态硬盘,MICROSDHC CARD,PCIE® GEN4 NVME U.2 SSD,SATA III 2.5" SSD,USB DRIVE,SD CARD,SATA III M.2 2280 SSD,SDXC CARD,PCIE®GEN3 NVME M.2 2280固态硬盘,SATA III 2.5英寸固态硬盘,PCIE®GEN4 NVME U.2固态硬盘,USB 2.0 EUSB,CFEXPRESS TYPE B MEMORY CARDS,M.2 TYPE 1620 HSBGA SSD,M.2 2242 SSD,NVME固态硬盘,MICROSDHC卡,PCIE® GEN4 X4 M.2 2280, U.2 SSDS,SECURSTOR MICROSD CARD,MSATA固态硬盘,PCIE® GEN4 NVME E1.S SSD,SATA III MSATA SSD,DRAM模块,PCIE®GEN4 NVME M.2 2280固态硬盘,MICROSDXC卡,NVME SSDS,DDR5内存,PCIE ® GEN4 NVME CFEXPRESS CARD,EMMC,SD卡,PCIE®GEN4 NVME E1.S固态硬盘,DRAM MODULES,M.2 2280固态硬盘,PCIE®GEN3 NVME M.2 2242固态硬盘,PCIE® GEN4 NVME CFEXPRESS CARD,NANODURA双UFD,E1.S PCIE GEN4 X4 SSD,SDHC CARD,袖珍闪存卡,E.MMC,PCIE® GEN3 NVME M.2 TYPE 1620 HSBGA SSD,MICROSD,M.2 2280 SSD,M.2 2230 SSD,SATA III M.2 2280固态硬盘,PCIE® GEN3 NVME U.2 SSD,NANODURA DUAL UFDS,MICROSD卡,CFEXPRESS卡,PCIE®GEN3 NVME U.2固态硬盘,SDXC卡,SATA III M.2 2242 SSD,PCIE® GEN3 NVME M.2 2242 SSD,MICROSD CARD,CFAST卡,1.ES PCIE GEN4 X4固态硬盘,SDHC卡,PCIE®GEN3 NVME M.2型1620 HSBGA固态硬盘,随身碟,CFEXPRESS CARD,COMPACTFLASH CARD,COMPACTFLASH卡,PCIE®GEN4 NVME CFEXPRESS卡,PCIE® GEN3 NVME M.2 2280 SSD,PCIE ® GEN3 NVME M.2 TYPE 1620 HSBGA SSD,EUSB,VALUE LINE SSDS,M.2型1620 HSBGA SSD,CFEXPRESS B型存储卡,CFAST CARD,M.2 2230固态硬盘,价值线固态硬盘,MSATA SSD,SECURSTOR MICROSD卡,PCIE® GEN4 NVME M.2 2280 SSD,MICROSDXC CARD,COMPACT FLASH CARD,M.2 2242固态硬盘,PCIE ® GEN3 NVME U.2 SSD,SATA III M.2 2242固态硬盘,A750PI,S600SC,B800PI,S750 SERIES,S600SI,B600SC,N700PC,A750 SERIES,E650SC,N601,N651SI,A600VI,S800PI,E600VC,I800PI,A600VC,A650SI,A650SC,N651SC,N750,S650SI,A600VI SERIES,N750PI,N651SIE,A800PI,N601 SERIES,A700PI,N651SIA,N650 SERIES,E600SAA,A750,A600VC SERIES,N600SC,E600SA,E650SI,N750 SERIES,E700PIA,N600SI,S650,S650SC,N651SI SERIES,E700PAA,B600SC SERIES,E600SI,N600VI SERIES,I700SC,N600VI,N650SI,E600SIA,N650SC,E750PI,N600VC,I600SC,E750PC,N651,S700PI,A650 SERIES,N650,N751PI,S700PC,N600VC SERIES,N651 SERIES,S650 SERIES,A650,N601SC,S750PC,E700PI,A600SI,N700PI,E700PA,S750,S750PI,E700PC,N651SCE,A600SC,数据记录,伺服器,汽车,AI SURVEILLANCE INFRASTRUCTURES,NETWORKING,ARTIFICIAL INTELLIGENCE (AI)-ENABLED SURVEILLANCE,HANDHELD COMPUTING,工业企业,物联网,手持计算,WEB SERVERS,网络,DATA LOGGING,POINT-OF-SALE (POS) TRANSACTIONS,自动化,IMAGING,企业,5G,STORAGE,成像,POS,销售点（POS）交易,BOX PCS,AUTOMOTIVE,SERVER,电信,ENTERPRISE,TRANSPORTATION,ROBOTICS,IOT,交通运输,SURVEILLANCE,人工智能（AI）监控,盒装PCS,边缘计算系统,工业,机器人学,AUTOMATION,EDGE COMPUTING,MISSION-CRITICAL APPLICATIONS,边际运算,INTERNET OF THINGS,EDGE COMPUTING SYSTEMS,TELECOM,INDUSTRIAL,INDUSTRIAL ENTERPRISE,关键任务应用程序,监控,存储器,人工智能监控基础设施,网络服务器
ATP将携最新的DDR5及PCIe Gen4闪存产品出席日本ESEC展会，存储解决方案满足嵌入式及工控机需求
ATP Electronics宣布自疫情后备受期待的日本IT周嵌入式和边缘计算春季博览会 (ESEC Spring) 回归。ESEC Spring是日本最大的IT展览会，有11个展示企业信息技术不同领域的展览，将于4月5日至7日在东京国际展示场举行，ATP的展位位于E46-1。
ATP Showcases “Industrial Only“ Memory and Storage Solutions for Connecting Embedded Intelligence at EW2020
ATP Electronics, the leading manufacturer of “Industrial Only” memory and storage solutions, showcases its latest robust and high-performance products for the era of connected embedded intelligence at Embedded World 2020.
ATP Exhibits at Embedded World 2024
Participants should not miss a visit to ATP’s Booth in Hall 1-210, where ATP once again demonstrates its commitment to redefine memory and data storage reliability, scalability, and efficiency. Attendees to Embedded World 2024 can expect to see a new breed of flash storage solutions with ATP’s 176-layer NAND flash innovation, industrial enterprise-readiness for Edge computing and artificial intelligence, and latest DDR5-5600 memory offerings.
M.2 2280 PSLC NVMe SSDs Break 3D TLC Limits wth 2000 MB/s Sustained Sequential Write Performance
ATP ELECTRONICS introduces its latest line of M.2 2280 NVMe solid state drives (SSDs) built on 3D triple level cell (TLC) NAND flash.
【产品】ATP Electronics宣布推出其最小的NVMe固态驱动器（SSD），HSBGA封装
2021年4月，专ATP Electronics宣布推出其最小的NVMe闪存产品：N700系列PCIe® 第3代x4 NVMe™ 固态驱动器（SSD），该产品采用了M.2 1620型散热器球栅阵列（HSBGA）封装。M.2 1620型HSBGA符合M.2规范，它支持高速PCIe 3.0接口x4通道和NVMe协议，以每通道8 Gb/s的速度提供高达32 Gb/s的带宽。
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