DDR5 Memory Modules
■DDR5旨在满足包括云计算和数据中心处理在内的广泛应用中对高效性能日益增长的需求。通过使用on DIMM 12V电压调节器（PMIC）和1.1 I/O电压，与DDR4相比，DDR5内存为开发人员提供了两倍的性能（4800到6400 MT/s），并提高了电源效率。
■DDR5还可以提高扩展性能，而不会在更高速度下降低通道效率。通过将突发长度加倍到BL16，并将存储组计数从16增加到32，可以提高性能。为了提高可靠性和效率，DDR5 DIMM在同一模块上使用两个40位完全独立的子通道。内存密度为64Gb的模块具有更高的内存密度，因此具有更大的内存容量。
▲特征
●命令/地址和控制总线的数据速率是原来的两倍
●在读取数据帧中生成CRC校验和
●默认突发长度增加到BL16–单次突发=64B数据
●集成温度传感器（MR4）
●DDR5 DRAM包含256个模式寄存器
▲利益
●更高带宽，DDR5初始设计4800 MHz
●低功率
●更好的能效和可扩展性
●更高的内存效率，更低的延迟
●高容量DIMM
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DDR5内存模块 |
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ST4098RD520805SB、ST4098RD520805MAV、ST2047UD520805SB、ST8198RD540405-SB、ST4098RD520805-SB、ST4098RD540405-SB、ST2048RD520805-SB、ST4G6SO5285-SB、ST2G6SO5285-SB、ST1G6SO5165-SB、ST4G6UD5285-SB、ST2G6UD5285-SB、ST1G6UD5165-SB |
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数据手册,数据表,data sheet |
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详见资料 |
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中文 英文 中英文 日文 |
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02.09.22 |
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Rev.10 |
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2.1 MB |
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| 世强先进（深圳）科技股份有限公司 | |
| 世强硬创平台www.sekorm.com | |
| 世强硬创平台电子商城www.sekorm.com/supply/ | |
| 世强硬创平台www.sekorm.com | |
| 世强硬创平台www.sekorm.com |
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产品型号
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品类
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DDR
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DIMM 类型
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容量
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数据速率
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组件配置
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工作温度范围
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ST4097MU44D825SAV
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UDIMM
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DDR4
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VLP Mini UDIMM
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32GB
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3200MT/s
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2Gx8
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C 温度（0˚C 至 +70˚C）
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Company Profile Segment Challenges and Solutions Thermal Solutions Endurance Solutions Security Solutions CFexpress & USB 3.0 Value Line SSDs DDR5 DRAM SOLUTIONS FLASH SOLUTIONS Flash Products Naming Rule Solutions & Technologies Flash Technology Overview table Complete Flash Spec Overview & Product Dimensions
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ATP（华腾国际）固态硬盘选型指南
Since 1991, we have consistently distinguished ourselves as one of the world’s leading original equipment manufacturers (OEM) of high-performance, high-quality and high-endurance NAND flash products and DRAM modules.
ATP - PCIE®GEN4 X4 M.2 2280，U.2 SSD,PCIE® GEN3 NVME M.2 2230 SSD,DDR5 MEMORY,PCIE®GEN3 NVME M.2 2230固态硬盘,MICROSDHC CARD,PCIE® GEN4 NVME U.2 SSD,SATA III 2.5" SSD,USB DRIVE,SD CARD,SATA III M.2 2280 SSD,SDXC CARD,PCIE®GEN3 NVME M.2 2280固态硬盘,SATA III 2.5英寸固态硬盘,PCIE®GEN4 NVME U.2固态硬盘,USB 2.0 EUSB,CFEXPRESS TYPE B MEMORY CARDS,M.2 TYPE 1620 HSBGA SSD,M.2 2242 SSD,NVME固态硬盘,MICROSDHC卡,PCIE® GEN4 X4 M.2 2280, U.2 SSDS,SECURSTOR MICROSD CARD,MSATA固态硬盘,PCIE® GEN4 NVME E1.S SSD,SATA III MSATA SSD,DRAM模块,PCIE®GEN4 NVME M.2 2280固态硬盘,MICROSDXC卡,NVME SSDS,DDR5内存,PCIE ® GEN4 NVME CFEXPRESS CARD,EMMC,SD卡,PCIE®GEN4 NVME E1.S固态硬盘,DRAM MODULES,M.2 2280固态硬盘,PCIE®GEN3 NVME M.2 2242固态硬盘,PCIE® GEN4 NVME CFEXPRESS CARD,NANODURA双UFD,E1.S PCIE GEN4 X4 SSD,SDHC CARD,袖珍闪存卡,E.MMC,PCIE® GEN3 NVME M.2 TYPE 1620 HSBGA SSD,MICROSD,M.2 2280 SSD,M.2 2230 SSD,SATA III M.2 2280固态硬盘,PCIE® GEN3 NVME U.2 SSD,NANODURA DUAL UFDS,MICROSD卡,CFEXPRESS卡,PCIE®GEN3 NVME U.2固态硬盘,SDXC卡,SATA III M.2 2242 SSD,PCIE® GEN3 NVME M.2 2242 SSD,MICROSD CARD,CFAST卡,1.ES PCIE GEN4 X4固态硬盘,SDHC卡,PCIE®GEN3 NVME M.2型1620 HSBGA固态硬盘,随身碟,CFEXPRESS CARD,COMPACTFLASH CARD,COMPACTFLASH卡,PCIE®GEN4 NVME CFEXPRESS卡,PCIE® GEN3 NVME M.2 2280 SSD,PCIE ® GEN3 NVME M.2 TYPE 1620 HSBGA SSD,EUSB,VALUE LINE SSDS,M.2型1620 HSBGA SSD,CFEXPRESS B型存储卡,CFAST CARD,M.2 2230固态硬盘,价值线固态硬盘,MSATA SSD,SECURSTOR MICROSD卡,PCIE® GEN4 NVME M.2 2280 SSD,MICROSDXC CARD,COMPACT FLASH CARD,M.2 2242固态硬盘,PCIE ® GEN3 NVME U.2 SSD,SATA III M.2 2242固态硬盘,A750PI,S600SC,B800PI,S750 SERIES,S600SI,B600SC,N700PC,A750 SERIES,E650SC,N601,N651SI,A600VI,S800PI,E600VC,I800PI,A600VC,A650SI,A650SC,N651SC,N750,S650SI,A600VI SERIES,N750PI,N651SIE,A800PI,N601 SERIES,A700PI,N651SIA,N650 SERIES,E600SAA,A750,A600VC SERIES,N600SC,E600SA,E650SI,N750 SERIES,E700PIA,N600SI,S650,S650SC,N651SI SERIES,E700PAA,B600SC SERIES,E600SI,N600VI SERIES,I700SC,N600VI,N650SI,E600SIA,N650SC,E750PI,N600VC,I600SC,E750PC,N651,S700PI,A650 SERIES,N650,N751PI,S700PC,N600VC SERIES,N651 SERIES,S650 SERIES,A650,N601SC,S750PC,E700PI,A600SI,N700PI,E700PA,S750,S750PI,E700PC,N651SCE,A600SC,数据记录,伺服器,汽车,AI SURVEILLANCE INFRASTRUCTURES,NETWORKING,ARTIFICIAL INTELLIGENCE (AI)-ENABLED SURVEILLANCE,HANDHELD COMPUTING,工业企业,物联网,手持计算,WEB SERVERS,网络,DATA LOGGING,POINT-OF-SALE (POS) TRANSACTIONS,自动化,IMAGING,企业,5G,STORAGE,成像,POS,销售点（POS）交易,BOX PCS,AUTOMOTIVE,SERVER,电信,ENTERPRISE,TRANSPORTATION,ROBOTICS,IOT,交通运输,SURVEILLANCE,人工智能（AI）监控,盒装PCS,边缘计算系统,工业,机器人学,AUTOMATION,EDGE COMPUTING,MISSION-CRITICAL APPLICATIONS,边际运算,INTERNET OF THINGS,EDGE COMPUTING SYSTEMS,TELECOM,INDUSTRIAL,INDUSTRIAL ENTERPRISE,关键任务应用程序,监控,存储器,人工智能监控基础设施,网络服务器
DDR5 Memory Modules ,Default Burst Length Increased to BL16 – Single Burst = 64B of Data
SMART‘s DDR5 memory modules have a maximum die density of 64Gb and hence are capable of having a much higher DIMM storage capacity.
迁移到DDR5内存模块白皮书
本文探讨了DDR5内存模块的特点和应用。DDR5内存提供低延迟、高性能、几乎无限的访问耐久性和低功耗，适用于从手持设备到复杂系统部署的各种应用。与DDR4相比，DDR5具有更高的数据速率、更大的容量、更低的功耗和增强的可靠性、可用性和服务性（RAS）功能。文章详细比较了DDR5与DDR4在性能、容量、电压、通道架构、错误检测和纠正等方面的差异，并介绍了DDR5的增强功能，如双通道架构、片上ECC、数据接收器均衡、循环冗余检查（CRC）和DQS延迟监控。此外，文章还讨论了DDR5在解决市场挑战方面的作用，如信号完整性、电源传输和布局复杂性，以及SMART Modular Technologies在DDR5内存模块发展中的作用。
SMART - DDR5 DIMM,DDR4 DRAM,DDR5 DRAM,DDR4 DIMM,DDR5 MEMORY MODULE,DDR5内存模块
SMART推出DDR5存储模块，芯片密度达64Gb，较DDR4比可支持更高容量的DIMM
DDR5突发长度为BL16 ，是DDR4 的2倍，而存储体数也从DDR4的16个增加到了32个，因此DDR5相比较DDR4具有更高的性能。SMART DDR5存储模块最大的芯片密度可达64Gb，并且支持扩展到相对于DDR4 DIMM大的多的存储容量。
【选型】SMART DuraMemory™系列DRAM存储模块选型指南
Company Introduction DuraMemory Product Introduction RDIMM UDIMM/SODIMM XRDIMM/SODIMM for Aerospace&Military Module-In-A-Package (MIP) Industrial Temperature Introduction to Enterprise Memory
SMART - RUGGED MEMORY,MEMORY MODULE PRODUCTS,存储模块产品,DURAMEMORY,RDIMM,硬脑膜记忆,UDIMM,SODIMM,DDR5,DDR4,MEMORY MODULE,DDR3,ENTERPRISE MEMORY MODULES,伺服器,NETWORKING,SERVER,IIOT,航空航天,军事的,刀片服务器,DATA CENTER,TELECOMMUNICATIONS,紧凑型服务器,工业物联网,AEROSPACE,DEFENSE,SBC,COMPACT SYSTEMS,MILITARY,ENERGY,COMPACT SERVERS,网络,BLADE/COMPACT SERVERS,COMPACT SYSTEM,紧凑系统,TELECOMMUNICATION,INDUSTRIAL INTERNET OF THINGS,TRANSPORTATION,数据中心,SOM,远程通信,SERVER/DATA CENTER,AEROSPACE,BLADE SERVERS
Compute Express Link（CXL®）内存模块白皮书简介
本文介绍了Compute Express Link (CXL®) 内存模块，这是一种高速互连标准，旨在实现CPU与平台子系统之间的有效连接。CXL基于PCI Express®基础设施，利用PCIe® 5.0的物理和电气接口。文章重点介绍了CXL的三个协议：CXL.io、CXL.mem和CXL.cache，以及它们在实现异构和分布式计算架构中的作用。此外，文章探讨了CXL在内存池化、交换、完整性和数据加密（IDE）方面的应用，并介绍了SMART Modular Technologies的CXL内存模块产品。
SMART - DDR5 DRAM,COMPUTE EXPRESS LINK (CXL ® ) MEMORY MODULES,COMPUTE EXPRESS LINK（CXL®）内存模块
【产品】SMART推出的DDR5 RDIMM，数据速率达4800MT/s，32/64GB容量可选
DDR5 RDIMM 旨在满足各大应用领域对高效性能日益增长的需求，包括云计算和数据处理。SMART公司的ST8198RD540405-SB，采用多种特色技术，商业级温度范围0˚C ~ 70˚C，工作电压1.1V，引脚数量288 Pin。
SMART Modular Technologies Expands DuraMemory Portfolio with New DDR5 Very Low Profile ECC UDIMMs
SMART Modular Technologies announced the addition of new DDR5 16GB and 32GB Very Low Profile Error-Correction Code Unbuffered Dual In-Line Memory Modules (VLP ECC UDIMM) to its lineup of blade memory VLP module products.
利用CXL®高级内存实现新一代数据中心的串行内存扩展
SMART Modular Technologies推出基于CXL技术的串行内存扩展解决方案，旨在降低数据中心成本、提高应用性能，并推动人工智能、高性能计算、机器学习和通信领域的新架构。该解决方案包括多种CXL内存模块和PCIe附加卡，支持DDR5内存，并提供定制化功能和调试能力。
SMART - 3.ES EDSFF 2T模块,CMM,4/8 SOCKET PCIE ADD-IN CARD,E3.S EDSFF 2T MODULES,4/8插槽PCIE附加卡,2T COMPACT MEMORY MODULES,坐标测量机,PCIE ADD-IN CARDS,AIC,艾克,PCIE附加卡,2T紧凑型内存模块,CMM-E3S,CXA-4F1Q,CXA-8F2W,COMMUNICATIONS,机器学习,通信,高性能计算,人工智能,MACHINE LEARNING,DATA CENTER,ARTIFICIAL INTELLIGENCE,HIGH-PERFORMANCE COMPUTING,数据中心
用于AI和ML的智能ZDIMM
本文介绍了SMART公司推出的ZDIMMs（Zefr Memory Modules）在人工智能（AI）和机器学习（ML）应用中的优势。ZDIMMs经过严格测试，可消除超过90%的内存可靠性故障，确保最大化的应用运行时间和优化内存子系统可靠性。文章还列举了ZDIMMs在自然语言处理、图像识别、DNA测序等领域的应用实例，并提供了DDR4和DDR5两种规格的ZDIMM订购信息。
SMART - ZDIMMS,DDR5 REGISTERED ZDIMM,DDR4 REGISTERED ZDIMM,DDR5寄存式ZDIMM,ZDIMM,DDR4注册ZDIMM,SRZHG8RD5648-SP,SRZ4G8RD5448-SP,SRZ2047RD410825-SE,SRZ8G8RD5448-SP,SRZ4G8RD5288-SP,SRZ4097RD420825-SC,SRZAG8RD5846-SB,SRZ8197RD440425-SC,SRZ4097RD440425-SC,HIGH RESOLUTION MEDICAL IMAGE PROCESSING,IMAGE RECOGNITION,LLMS,3D RENDERING,LLMS,REAL TIME HIGH-SPEED ANALYTICS,AI,DNA测序,DNA SEQUENCING,安全摄像机数据处理,ALGORITHMIC TRADING,实时高速分析,毫升,SECURITY CAMERA DATA PROCESSING,3D渲染,人工智能,高分辨率医学图像处理,NATURAL LANGUAGE PROCESSING,自然语言处理,图像识别,算法交易,ML
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