PROCESSING GUIDELINES Laminate: Synamic8G Prepreg: Synamic8GB

产品加工指南 芯板: Synamic8G 粘结片: Synamic8GB

本指南基于IPC-4101E标准，针对生益Synamic8G/Synamic8GB覆铜板和半固化片的使用提供详细指导。内容包括储存条件、PCB加工建议、焊接工艺等。强调储存环境、操作规范和加工参数，以确保产品性能和可靠性。

生益科技  -  芯板,粘结片,SYNAMIC8GB,SYNAMIC8G

Synamic8G 超低损耗耐热多层板用材料 产品加工指南

本指南针对Synamic8G/Synamic8GB超低损耗耐热多层板材料，基于IPC-4101E标准，提供储存、加工和焊接建议。涵盖储存条件、PCB加工建议（包括开料、烘烤、叠料、层压、钻孔等）、焊接工艺等，旨在确保材料性能和加工质量。

生益科技  -  芯板,超低损耗耐热多层板用材料,粘结片,SYNAMIC8GB,SYNAMIC8G

QMTS2.E109769-聚合材料-纤维缠绕管、工业层压板、硫化纤维和制造公认印刷线路板用材料-部件

生益科技  -  MATERIALS FOR USE IN FABRICATING RECOGNIZED PRINTED WIRING BOARDS,缠绕管,FILAMENT,灯丝,用于制造公认的印刷线路板的材料,WOUND TUBING,聚合材料,工业层压板,POLYMERIC MATERIALS,INDUSTRIAL LAMINATES,VULCANIZED FIBER,硫化纤维,SU1611,SU1610,SP120,S1141 150,AEROBOND 359,S168GN,S168GL,SU1615,AEROBOND 350,SAR30S,SML02G,S1150G,SDI03K,SF212,S1150F,SCR15S,ST220P,S7546,Q360,S1141-4,S1440,S7038V,AEROWAVE 300,S21300JB,AEROWAVE300X,SI643HU,Q100,SCGA-500-GF220,LSD103K,AEROWAVE 350B,SAR20LM,S2131JB,S1455W,SU1603,ST210G,SF202,SG7350D,SU1609,SYNAMIC8G,ST110G,PQ260,SI246U,M215,S1155GXB,SFR15S,S,S5W,S7135D,SAR15,SL,S1220,S6018-1,Q260,S1000-2M,S6101,SE40,S1170M,SF230,SDI06K,SFR155,SD106K,S7136D,S78,SF335C,SF202C,S7136H,STR20L,S1600LB,S7439,S7438,SP170N,SH260M,DL,SAR10S,MMWAVE,AUTOLAD2G,S3155G,Q162,Q161,Q160,SU1402,S1190,S1000-2,SCGA-500-GF300,SDI03,S1141-4F,ST115,SI246,S1165M,BIF202,BIF201,S7045GH,SD103,SI10U,AUTOLAD1G,AEROWAVE350,S1250G,SFR20S,STR20,ST110,SP170G,S1170GP,SU1611B,SA110L,Q100D,Q100E,Q100F,S1155GX,Q100G,Q100A,SAR20S,Q100B,Q100C,SI242D,SI643U,SAR20L,SB170G,S7643,SAR20H,S1140F,S1152G,S7735D2,S7040GXB,SU1501,SU1621,SG7350D2,ST115D,ST115G,S7439C,S2155G,SE80,SU1504,SI13U,S7439G,AUTOLAD3G,SG7300N,S1151G,S7645G,SF305,SFR10S,S3155,LNB33C,Q360H,Q360G,S2130,SF305C,S1600,S7439HW,SI13NB,S6015-1,SG3300,Q360W,S1190G,S2131,S1165,S2136,S2135,S7135,S1155KB,SYNAMIC 6B,S1150,S1151,SCR30S,S12100G,S1000M,SB120,WLM1,S7439GS,SAR15S,S-2,S7136,S1000H,SL7038,S2126,SDI06KB,S1000HS,SH260,S7045G,COB714,STR15,BLM1,SYNAMIC 6N,AEROWAVE 360,S2155,S1860,SP225GN,Q100CB,SI055W,SU1301,S1170,S7036,S7035,S7735D2B,S1155MB,S2600R,ST210,SP168GN,SYNAMIC8GN,S1155 600,ST215,SU1305,SU1304,S7338B,S1155M,AUTOLAD5,S2600F,S1155K,AUTOLAD2,SYNAMIC 6NB,SL1155KB,AUTOLAD3,SFR30S,S1250GB,S7135D2,AUTOLAD1,S3110,S7641G,S7038,SAR25H,S3116,Q310,PQ160,SA120,S0101 600,SII55GX,S1170G,S7335B,S1170F,SAR30,SF215C,S1000,S6015,S6018,S1125,SU1301B,SG3300W2,SA115,SU1804,SCR10S,SI643,MMWAVE77,SAR20,SF325C,S1210G,S7335,S7542G,S7542K,S7338,S1141 170,SI42D,SF280,S1141KF,SYNAMIC 6,S7242,SF206B,SF315B,SF206C,SF315C,SCR105,SL1155K,SI546,SFOPT,SF302C,S26,S25,S1180G,S1141,S1145,SD103K,S7040G,S1600HB,SYNAMIC6GX,S100HSB,S7040GX,S2130JB,S1190M,SU1903,SCR20S,SI543,SCR20L,S1210GB,SF303C,SI64X,SF701,S1130,S1135G,S1600L,S1600M,S1135,S1600H,S2600EF,S7040GB

QMTS2.E109769-聚合材料-纤维缠绕管、工业层压板、硫化纤维和用于制造公认印刷线路板的材料-组件UL Product IQ™

资料详细介绍了多种聚合物材料，包括预浸料、高密度互连 buildup 材料、工业层压板等，涉及不同品牌和型号的产品。内容涵盖了材料的厚度、颜色、耐热性、阻燃性等关键性能参数，以及相关的认证信息。

生益科技  -  FILAMENT-WOUND TUBING,PRINTED WIRING BOARDS,纤维缠绕管,工业层压板,INDUSTRIAL LAMINATES,VULCANIZED FIBER,印刷线路板,硫化纤维,SU1611,SU1621B,SU1610,SP120,S1141 150,S7542,SDI03B,SE80B,SU1615,AEROBOND 350,SAR30S,S1190MB,SML02G,SI643HB,S1150G,SDI03K,SF212,S1150F,SCR15S,SI242DB,ST220P,S7546,Q360,S1440,S7038V,S1141-4,S7641GB,AEROWAVE 300,S1150B,SU1305B,S7045GHB,AEROWAVE300X,SI643HU,Q100,SCGA-500-GF220,SU1402B,SB170GB,S2131JB,SU1603,AEROBOND 360,ST210G,S7038B,S0155 600,S0104,SF201,SF202,SG7350D,SU1609,S0101,S0102,SYNAMIC8G,S0103,SU1304B,PQ260,SI246U,S7542GB,M215,S1155GXB,AEROWAVE350B,SFR15S,S5W,S7135D,SAR15,S1220,SI246B,S6018-1,Q260,S1000-2M,S6101,SE40,S78B,S1170M,SF230,SDI06K,S7136D,S78,SF335C,SF202C,S7136H,SDI03KB,S1600LB,S7439,S1000-2B,S7438,SP170M,SP170N,SU1504B,SH260M,S1170FB,DL,S7035B,SAR10S,AUTOLAD2G,S3155G,LNB33CB,S1000HSB,AUTOLAD2B,S7242B,Q162,SH260B,Q161,Q160,SU1402,S1860B,S1190,WLM1B,S1170GB,SCGA-500-GF300,SDI03,S1000-2,S1141-4F,ST115,SI246,S1165M,BIF202,BIF201,S7045GH,S0401KF,AUTOLAD1G,SI10U,S1250G,SFR20S,AEROWAVE350,S7045GB,AUTOLAD1B,AUTOLAD2GB,SP170G,S1170GP,SI546B,SI64XB,S7439CB,SI643B,SA110L,SU1611B,Q100D,Q100E,S1155GX,Q100F,Q100G,Q100A,SAR20S,Q100B,Q100C,SI242D,SI10NB,SI643U,SB170G,S7643,SAR20H,S1140F,S1152G,S7735D2,S7040GXB,SU1501,SU1621,SG7350D2,ST115D,AUTOLAD3B,AEROBOND 300,S7439C,S2155G,SE80,S7036B,SU1504,S7439G,SF302,AUTOLAD3G,SI055WB,SG7300N,S0701M,S1151G,AUTOLAD1GB,S7645G,ST115B,SFR10S,SF305,S3155,S1151B,LNB33C,S0440,Q360H,S7038VB,SE40B,Q360G,S2130,LSDI03K,S0165M,S1180GB,SF305C,S25B,S1600,S7439HW,S6015-1,S1190B,SG3300,Q360W,S2131,S1165,SI543B,S2136,S2135,S7645GB,S7135,S1155KB,SYNAMIC 6B,S1145B,S1150,S1151,AUTOLAD5B,SCR30S,S7546B,S1000M,SB120,WLM1,S7643B,S7439GS,SAR15S,SL7038B,S-2,S7136,S1000B,SI246UB,S1000H,SL7038,S2126,AEROWAVE300XB,SDI06KB,S1000HS,SH260,SU1603B,S7045G,S7439GB,LSDI03KB,COB714,SU1615B,STR15,SYNAMIC 6N,S1000HB,AEROWAVE 360,S0401 170,ST115DB,S2155,S1860,S7439GSB,SP225GN,Q100CB,SI055W,SU1301,S1170,S7036,S7035,S7735D2B,S1152GB,S1155MB,S1140FB,S2600R,ST210,SP168GN,SYNAMIC8GN,SU1308,S1155 600,ST215,SU1305,SU1304,S7338B,S0401,S1155M,AUTOLAD5,S2600F,S1155K,AUTOLAD2,SYNAMIC 6NB,SL1155KB,AUTOLAD3,SFR30S,S1250GB,S7135D2,AUTOLAD1,AUTOLAD3GB,S3110,S7641G,S7038,SYNAMIC8GB,S3116,Q260#,Q310,PQ160,SA120,SU1609B,S0101 600,S1170G,S7335B,S1170F,SAR30,S0401 150,SF215C,S1000,S6015,S6018,S1125,SCGA-500-GF265,SI643UB,S1151GB,SU1301B,SYNAMIC8GNB,SG3300W2,S1125B,SA115,SCR10S,SI643,MMWAVE77,SAR20,S0701,SF325C,S1210G,S7335,S7542G,S7542K,S7338,S7136HB,S1141 170,S1150FB,SF280,S7542KB,SYNAMIC 6,S1141KF,S7242,SF206B,SF315B,SF206C,SF315C,SL1155K,SI546,SF302C,S26,S25,S1180G,S1141,S1145,S7040G,S1600HB,SYNAMIC6GX,S1170GPB,S7040GX,SI455W,S2130JB,S1135B,S1150GB,S1190M,SCR20S,SI543,SF303C,S1210GB,SI64X,SF701,S1130,S1135G,S1600L,S1600M,S0165,S1220B,S1135,S1135GB,S1600H,S2600EF,S7040GB

QMTS2.E109769-聚合材料-纤维缠绕管、工业层压板、硫化纤维；和用于制造公认的印刷线路板的材料.元件

生益科技  -  FILAMENT-WOUND TUBING,纤维缠绕管,聚合材料,工业层压板,POLYMERIC MATERIALS,INDUSTRIAL LAMINATES,VULCANIZED FIBER,硫化纤维,SU1611,SU1610,SP120,S1141 150,S168GL,SU1615,AEROBOND 350,SAR30S,SML02G,S1150G,SDI03K,SF212,S1150F,SCR15S,ST220P,S7546,Q360,S1141-4,S1440,S7038V,AEROWAVE 300,AEROWAVE300X,SI643HU,Q100,SCGA-500-GF220,SAR20LM,S2131JB,S1455W,S-2C,SU1603,ST210G,SF202,SG7350D,SU1609,SYNAMIC8G,PQ260,SI246U,M215,SFR15S,S,S5W,S7135D,SAR15,SL,S1220,S6018-1,Q260,S1000-2M,S6101,SE40,S1170M,SF230,SDI06K,S7136D,S78,SF335C,SF202C,S7136H,S7439,S7438,SP170N,SH260M,DL,SAR10S,MMWAVE,AUTOLAD2G,S3155G,Q162,Q161,Q160,SU1402,S2130JB$,S1190,S1000-2,SCGA-500-GF300,SDI03,S1141-4F,ST115,SI245,S1165M,BIF202,S7045GH,SI10U,AUTOLAD1G,AEROWAVE350,S1250G,SFR20S,ST110,SP170G,S1170GP,SA110L,Q100D,Q100E,S1155GX,Q100F,Q100G,Q100A,SAR20S,Q100B,Q100C,S1546,SI242D,SCR20LM,SI643U,SB170G,S7643,SAR20H,S1140F,S1152G,S7735D2,SU1501,SU1621,SG7350D2,ST115D,ST115G,S7439C,S2155G,SE80,SU1504,SI13U,S7439G,AUTOLAD3G,SG7300N,S1151G,SFR10S,SF305,S3155,LNB33C,Q360H,Q360G,S2130,LSDI03K,SF305C,S1600,S7439HW,S6015-1,S7654G,SG3300,Q360W,S1190G,S2131,S1165,S2136,S2135,S7135,S1150,S1151,SCR30S,S1000M,SB120,WLM1,S7439GS,SAR15S,S-2,S7136,S1000H,SL7038,S2126,S1000HS,SH260,S7045G,STR20LM,COB714,STR15,BLM1,SYNAMIC 6N,AEROWAVE 360,S2155,S1860,SP225GN,Q100CB,SI055W,SU1301,S1170,S7036,S7035,S2600R,ST210,SP168GN,SYNAMIC8GN,S1155 600,ST215,SU1305,SU1304,S1155M,AUTOLAD5,S2600F,S1155K,AUTOLAD2,AUTOLAD3,SFR30S,S7135D2,AUTOLAD1,S3110,S7641G,S7038,S3116,Q260#,Q310,PQ160,SA120,S0101 600,S1170G,S1170F,SAR30,SF215C,S1000,S6015,S6018,S1125,SCGA-500-GF265,SG3300W2,SA115,SU1804,SI643,MMWAVE77,SAR20,SF325C,S1210G,S7335,S7542G,S7542K,S7338,S1141 170,SF280,SYNAMIC 6,S1141KF,S7242,SF206B,SF315B,SF206C,SF315C,SCR105,SL1155K,SFOPT,SF302C,S26,S25,S1180G,S1141,S1145,S7040G,SYNAMIC6GX,S7040GX,S1190M,SU1903,SCR20S,SI543,SF303C,SI64X,SF701,S1130,S1135G,S1600L,S1600M,S1135,S1600H,S2600EF

SYNAMIC8GN SYNAMIC8GNB基材排列

该资料详细列出了不同厚度和类型的基材（Synamic8GN）和预浸料（Synamic8GNB）的典型厚度、介电常数（Dk）和损耗因子（Df）数据。资料中包含了从2.0mil到30.0mil不同厚度的基材和预浸料在1GHz至15GHz频率范围内的介电常数和损耗因子数据，以及测量方法和数据更新说明。

生益科技  -  SYNAMIC8GNB,SYNAMIC8GN

SYNAMIC8G基材排列

资料详细介绍了两种基材产品：薄芯（Synamic8G）和预浸料（Synamic8GB）。薄芯产品包括不同厚度和介电常数（Dk）的选项，预浸料产品则提供了玻璃样式、重量、厚度和Dk/Df等参数。数据适用于不同频率范围，并注明了测量方法和数据参考性质。

生益科技  -  PREPREG,半固化片,SYNAMIC8GB,SYNAMIC8G

产品加工指南 芯板: Synamic8GN 粘结片: Synamic8GNB

本指南详细介绍了Synamic8GN和Synamic8GNB产品的加工指南，包括储存条件、加工建议、焊接工艺等。内容涵盖覆铜板和半固化片的存放方式、环境要求、操作注意事项，以及PCB加工过程中的开料、钻孔、层压等关键步骤。此外，还提供了焊接工艺的相关参数和建议，以确保产品加工质量和可靠性。

生益科技  -  芯板,粘结片,SYNAMIC8GNB,SYNAMIC8GN

SYNAMIC8G SYNAMIC8GB基材系列

本资料详细列出了Synamic8G和Synamic8GB两种基材的规格参数，包括典型厚度、介电常数（Dk）和损耗因子（Df）等关键性能指标。数据覆盖了不同频率下的性能表现，适用于高频电子元件的设计和制造。资料还提供了测量方法和数据更新说明。

生益科技  -  SYNAMIC8GB,SYNAMIC8G

Synamic8G无卤超低损耗耐高温多层材料

生益科技  -  HALOGEN-FREE ULTRA-LOW LOSS & HEAT RESISTANCE MULTILAYER MATERIAL,无卤超低损耗耐高温多层材料,SYNAMIC8G,超高速网络设备,ULTRA-HIGH SPEED NETWORK EQUIPMENT,OPTICAL COMMUNICATION PRODUCTS,伺服器,SERVER,路由器,高频测量仪器,STORAGE,SWITCH,光通讯产品,HIGH PERFORMANCE COMPUTING,高性能计算,开关,存储器,HIGH FREQUENCY MEASURING INSTRUMENTS,ROUTERS

SYNAMIC8GN基材排列

资料详细介绍了两种基材：薄芯（Synamic8GN）和预浸料（Synamic8GNB）。薄芯的厚度从0.051mm到0.762mm不等，预浸料的厚度从64um到140um。资料提供了不同频率下的相对介电常数（Dk）和损耗角正切（Df）数据，以及玻璃重量和厚度信息。数据适用于1GHz至15GHz频率范围，并注明了测量方法和数据仅供参考。

生益科技  -  PREPREG,半固化片,SYNAMIC8GNB,SYNAMIC8GN

Synamic8GN 产品加工指南

本指南基于IPC-4101E标准，针对生益Synamic8GN/Synamic8GNB覆铜板和粘结片的使用提供详细指导。内容涵盖储存条件、PCB加工建议、焊接工艺等方面，包括存放方式、操作注意事项、加工参数、层压条件等，旨在确保产品性能和可靠性。

生益科技  -  芯板,粘结片,SYNAMIC8GNB,SYNAMIC8GN

Synamic8GN无卤超低损耗耐高温多层PCB材料

生益科技  -  HALOGEN-FREE ULTRA-LOW LOSS & HEAT RESISTANCE MULTILAYER PCB MATERIAL,无卤超低损耗耐高温多层PCB材料,SYNAMIC8GN,超高速网络设备,ULTRA-HIGH SPEED NETWORK EQUIPMENT,OPTICAL COMMUNICATION PRODUCTS,伺服器,SERVER,路由器,高频测量仪器,STORAGE,SWITCH,光通讯产品,HIGH PERFORMANCE COMPUTING,高性能计算,开关,存储器,HIGH FREQUENCY MEASURING INSTRUMENTS,ROUTERS

S7439 印制电路用玻璃布基覆铜箔层压板（玻纤布）产品认证证书（CQC15134131503）

本证书编号为CQC15134131503，由广东生益科技股份有限公司申请，制造商、生产企业均为广东生益科技股份有限公司，位于东莞市松山湖高新技术产业开发区工业西路5号。证书针对产品名称为印制电路用玻璃布基覆铜箔层压板（玻纤布）S7439，厚度范围为0.05mm至3.2mm，燃烧等级为FV0级。产品标准和技术要求符合GB/T 4725-1992、GB/T 6040-2019等标准。证书有效期为2020年7月30日至2025年7月30日，证书有效性基于发证机构的定期监督。证书为变更证书，首次颁发日期为2015年9月23日。

生益科技  -  玻璃布基覆铜箔层压板,S7439

S1150G（乌兰西：FR-4.1）高性能，中温无卤

生益科技  -  S1150G