Vapor Chambers
■超薄蒸汽室
●宝德是世界上唯一一家能够原型化并大规模生产各种蒸汽室的制造商,以满足铜、不锈钢和钛的各种性能和设计需求
●与具有改进导热性的薄格式石墨散热器相比,更有效地散热:
●铜/不锈钢/钛蒸汽室:导热系数约为石墨的5倍
蒸汽室 |
|
[ 摄像机 ][ 传感器 ][ 游戏机 ][ 电信基站 ][ 伺服器 ][ 逆变器 ][ IGBT ][ 笔记本电脑 ][ 移动电话 ][ 显卡 ] |
|
小册子,Brochure,商品及供应商介绍 |
|
|
|
详见资料 |
|
|
|
|
|
|
|
中文 英文 中英文 日文 |
|
2023/3/15 |
|
|
|
|
|
|
|
2.4 MB |
|
世强先进(深圳)科技股份有限公司 | |
世强硬创平台www.sekorm.com | |
世强硬创平台电子商城www.sekorm.com/supply/ | |
世强硬创平台www.sekorm.com | |
世强硬创平台www.sekorm.com |
- |
- +1 赞 0
- 收藏
- 评论 0
本文内容由BOYD品牌授权世强硬创平台转载,旨在分享知识与信息,如有内容侵权或者其他违规问题,请及时与我们联系,我们将在核实情况后尽快删除或提供适当的版权信息。对于通过本网站上传或发布的内容,世强硬创平台不承担任何版权责任。
相关推荐
农业与建筑
Boyd公司提供农业和建筑行业多方面的解决方案,包括精密转换解决方案和热管理解决方案。公司具备全面的生产和制造能力,提供从材料选择、创新制造技术到紧密公差的生产部件的完整解决方案。Boyd在质量与加工、设计工程和全球产能方面具有优势,能够满足客户在全球范围内的需求。
BOYD - 蒸汽室,环保垫圈,INVERTERS,HEAT SINKS,DC/DC转换器,PRECISION CONVERTER,模制瓶盖,DOOR SEALS,散热片,鼓风机,FLOORING,表面保护器,WINDOW SEALS,CUSTOM O-RINGS,PLUGS,成型软管,热界面材料,换档杆靴,BLOWERS,SEALS,液体冷却系统,密封件,IP SEALS,塞子,倒相器,MOLDED CAPS,LIQUID COOLING SYSTEMS,FANS,SURFACE PROTECTORS,波纹管,THERMAL INTERFACE MATERIALS,DC/DC CONVERTERS,地板,MULTI-LAYERED FLOOR MAT ASSEMBLIES,窗户密封条,仪表板密封件,定制O型圈,BELLOWS,窗组件,HEAT PIPES,门封条,SHIFTER BOOTS,热管,VAPOR CHAMBERS,精密转换器,FORMED HOSES,WINDOW ASSEMBLIES,铺垫,扇子,MATTING,ENVIRONMENTAL GASKETS,多层地板垫组件,NVH,远程信息处理系统,电池,COMMUNICATIONS SYSTEMS,ADAS,电池模块冷却,传感器阵列,BATTERY MODULE COOLING,车充,系统优化电子单元,机上处理,SENSOR ARRAYS,COMPLEX MULTI-STACK APPLICATIONS,BATTERY,AGRICULTURE,SENSORS,建筑,BSR,CONSTRUCTION,ON BOARD PROCESSING,NAVIGATION,导航,LIDAR,农业,TELEMATICS SYSTEMS,VEHICLE CHARGING,电气绝缘,通信系统,ELECTRICAL INSULATION,传感器,复杂的多堆栈应用程序,SYSTEM OPTIMIZATION ELECTRONIC UNITS
企业解决方案
Boyd公司提供全面的元器件行业解决方案,涵盖企业级热管理、密封与保护、快速原型制作、清洁室能力、电气绝缘材料等多个领域。公司通过整合设计、工程和制造,提供从设计到生产、包装和物流的全服务解决方案,将创新理念转化为现实。Boyd的产品和服务包括空气隔板、散热片、液体冷却系统、电磁屏蔽、绝缘材料等,旨在加速产品上市时间,提高产品性能和可靠性。
BOYD - 蒸汽室,EMI SHIELD,软管,识别信息标签,ELECTRICAL INSULATORS,BGA ASSEMBLIES,ENCLOSURE,ABSORPTION GASKETS,高度工程化的液体冷却板,分流器,噪声阻尼,LIQUID COLD PLATE CONNECTOR O-RINGS,系统信息标签,空气挡板,外壳,DOOR SEALS,SYSTEM INFORMATION LABELS,硬盘驱动器臂减震器,SENSORS,GASKETS,HIGHLY ENGINEERED LIQUID COLD PLATES,BGA组件,液体冷却交换器,HEAT PIPE ASSEMBLIES,风管垫片,I/O垫圈,液体冷板连接器O形圈,I/O GASKETS,液态冷板,EMBEDDED HEAT PIPES,AXIAL HEAT PIPES,DIVERTERS,电绝缘体,THERMOSIPHONS,热管组件,安装方向图,热虹吸,电磁波屏蔽,SEALS,HDD ARM DAMPERS,液体冷却系统,密封件,LIQUID COOLING SYSTEMS,HIGH-END THERMAL INTERFACE MATERIALS,风管过滤器,DIRECT CHIP COOLING GASKET SEALS,INSTALLATION DIRECTION GRAPHICS,减振,LIQUID HEAT EXCHANGERS,轴向热管,AIR DUCT GASKETS,直接切屑冷却垫片密封,EMI屏蔽,VIBRATION DAMPING,门封条,LIQUID COOLING EXCHANGERS,VAPOR CHAMBERS,管道,EMI SHIELDING,DUCTING,INSTALLATION DIRECTION INSULATORS,LIQUID COOLING SYSTEM O-RINGS,IDENTIFICATION INFORMATION LABELS,HEAT EXCHANGERS,LIQUID COLD PLATES,AIR DUCT FILTERS,绝缘子安装方向,液体热交换器,HOSES,绝缘绝缘体,高端热界面材料,液体冷却系统O型环,热接口材料,吸收垫圈,垫片,预埋热管,AIR BAFFLES,NOISE DAMPING,传感器,THERMAL INTERFACE MATERIAL,换热器,DIELECTRIC INSULATORS,光开关,伺服器,芯片组冷却,SERVER,HDD,CPU,DATA CENTER,硬盘驱动器,OPTICAL SWITCH,CLOUD COMPUTING,节点级冷却,EDGE ROUTING,云计算,NODE LEVEL COOLING,ENTERPRISE SYSTEMS,企业系统,NETWORKING FABRIC,边缘布线,性能计算,中央处理器,数据中心,企业,网络结构,ENTERPRISE,机架级冷却,RACK LEVEL COOLING,ELECTRICAL EQUIPMENT,CHIPSET COOLING,电力仪器设备,PERFORMANCE COMPUTING
消费电子
该资料主要介绍了Boyd Corporation公司提供的多种元器件产品及其应用领域。涵盖消费电子、家庭办公与家庭影院、家电与智能家居、游戏与娱乐等领域的解决方案,包括密封件、热管理、保护产品等。同时,资料还展示了公司在质量管理体系和认证方面的优势。
BOYD - 层压胶带,VENTILATION GASKETS,定制软管,扬声器垫圈,SPEAKER GASKETS,传导空气-空气热交换器,贴纸,散热片,鼓风机,封装石墨片,冲压减振器,AIR BAFFLES,O型环,DOUBLE COATED TAPES,定制胶带,热模拟软件,液态冷板,热界面材料,AIR DUCTS GASKETS,振动支座,LABELS,风扇,FOAM TAPE,SEALING,保护膜,标籤,THERMOSIPHONS,PARTICULE FILTERS,CUSTOM TAPES,VIBRATION MOUNTS,散热器,热虹吸,OPTICALLY CLEAR ADHESIVES,KEYPAD,按钮盖,IP SEALS,显示组件,ENCAPSULATED GRAPHITE SHEETS,THERMAL INTERFACE MATERIALS,保护胶带,CONDUCTIVE AIR TO AIR HEAT EXCHANGER,柔性热管组件,定制O型圈,窗组件,门封条,压铸散热器,VIBRATION ISOLATORS,CABINETS,LIGHT ENHANCEMENT FILMS,VAPOR CHAMBERS,WINDOW ASSEMBLIES,POLYMERIC INSULATORS,钮扣,FLEXIBLE HEAT PIPE ASSEMBLIES,HEAT SHIELDING,散热膏,MOLDED MOUNT BUMPERS,GASKETS,超薄蒸汽室,电气绝缘,通风垫圈,SOLIMIDE FOAMS,STAMPED DAMPERS,换热器,标准软管,蒸汽室,PROTECTION FILMS,THERMALLY CONDUCTIVE INSULATORS DISPLAY GASKETS,封印,SHROUDS,ID TAGS,隔热板,橱柜,裹尸布,EMI/ RFI GASKETING,PARTICULE GUARDS,EMI/RFI垫圈,压敏胶带,风冷机箱,空气挡板,DOOR SEALS,CUSTOM MOLDINGS,RADIATOR,DISPLAY GASKETS,微粒防护装置,光增强膜,LAMINATING TAPES,ID标签,CUSTOM O-RINGS,风管垫片,导热绝缘体显示垫圈,STANDARD HOSES,HEAT SPREADERS,PRESSURE SENSITIVE ADHESIVE TAPE,O-RINGS,BLOWERS,RADIATORS,DISPLAY COMPONENTS,ULTRA THIN VAPOR CHAMBERS,光学透明粘合剂,双涂层胶带,HEAT SINKS,角帽,ELECTRICAL INSULATION,HEAT SHIELDS,ISOLATORS,钢丝网,散热器安装硬件,PROTECTIVE FILMS,THERMAL GREASE,隔热层,WIRE MESH,模制安装保险杠,仪表板密封件,钩扣件和环扣件,HEAT SINK MOUNTING HARDWARE,STICKERS,THERMAL MODELING SOFTWARE,小键盘,DIE CAST HEAT SINKS,显示器垫圈,CORNER CAPS,HOOK FASTENERS LOOP FASTENERS,HEAT EXCHANGERS,隔离器,PROTECTIVE TAPES,LIQUID COLD PLATES,聚酰亚胺泡沫,隔振器,泡棉胶带,微粒过滤器,FAN,AIR COOLED CHASSIS,聚合绝缘子,BUTTON COVERS,垫片,CUSTOM HOSES,BUTTONS,定制线脚,HOME THEATER,ENTERTAINMENT,手持式,器具,消费电子,SMART WEARABLES,家庭影院,AIR COOLING,LIQUID COOLING,磨损保护,液体冷却,CONSUMER ELECTRONICS,内政部,智能家居类,APPLIANCES,SMART HOME,WEAR PROTECTION,娱乐,HOME OFFICE,游戏,空气冷却,HANDHELD,GAMING,智能可穿戴设备
3D Vapor Chambers: Revolutionary Heat Dissipation
As the field of AI continues to evolve, there is a growing need for more minor and more powerful semiconductor chips. However, upgrading semiconductor technology while keeping costs low has increased power consumption and heat generation in these chips. This has caused TDP rates to accelerate, making it increasingly challenging to manage heat in high-performance, compact electronics.To address this issue, a 3D Vapor Chamber has been developed, which can handle over 500 watts of power. This technology is ideal for servers, base stations, repeater stations, and data centers.
Energy Consumption in Data Centers: Air Versus Liquid Cooling
As the data center industry continues to evolve and address rising energy consumption challenges, investors have opportunities to support and capitalize on advancements in energy-efficient technologies that innovate and improve sustainability.
Thermal Management in Artificial Intelligence
As technology continues to evolve, more companies leverage Artificial Intelligence (AI) to improve existing offerings and generate new solutions to accelerate value creation for their customers.
超薄钛蒸气室:在移动设备中实现新的竞争优势
本文探讨了双相冷却技术,特别是超薄钛蒸汽腔的发展,如何为下一代移动和可穿戴设备提供新的竞争优势。随着电子化趋势的持续,可穿戴和移动设备市场正以前所未有的速度发展。文章指出,随着消费者对更小、更薄、更强大的设备的不断需求,工程师们正努力有效地处理过多的热量。双相冷却技术,如超薄热管和蒸汽腔,已成为管理小型应用中热量的最佳选择。文章强调了超薄钛蒸汽腔在提高性能和设计灵活性方面的优势,并介绍了Boyd Corporation在两相和超薄冷却技术方面的专业知识。
BOYD - 蒸汽室,ULTRA-THIN TITANIUM VAPOR CHAMBERS,超薄钛蒸气室,VAPOR CHAMBERS,WEARABLE DEVICES,穿戴式设备,MOBILE DEVICES,移动设备
汽车解决方案
Boyd公司提供全面的汽车行业解决方案,包括密封件、声学吸收材料、内饰和外观附件系统、光学薄膜等。公司拥有从设计到制造、包装和物流的全服务能力,将创新理念转化为现实。产品应用范围广泛,涵盖光学薄膜、内饰和外观装饰、EMI/RF屏蔽、附件系统、表面保护、热导体和屏蔽、车身侧模具、软管/衬套/O型圈、垫片和密封件、声学隔音、BSR/NVH、徽标和铭牌、信息娱乐和远程信息处理系统的吸收、显示屏和传感器的导电和保护、光泄露和扩散等。Boyd在全球范围内拥有多个生产基地,提供清洁室制造、全球产能和全方位的客户服务。
BOYD - 吸声材料,完全定制的液体系统,HEAT SINKS,FULLY CUSTOM LIQUID SYSTEMS,光学薄膜,O-RINGS,完全定制的两相系统,ACOUSTICAL ABSORBERS,EXTERIOR ATTACHMENT SYSTEMS,SEALS,INTERIOR ATTACHMENT SYSTEMS,外部附件系统,散热片,垫片,密封件,内部附件系统,OPTICAL FILMS,GASKETS,FULLY CUSTOM TWO PHASE SYSTEMS,O型环,蒸汽室,NVH,软管,汽车,热管理,射频屏蔽,EXTERIOR TRIM,INTERIOR,INVERTERS,ADAS,电池模块冷却,DC/DC转换器,车充,LED模块,漏光,无线充电,SENSORS,光扩散,BSR,显示器,内部的,导航,BODY SIDE MOLDING,BATTERY CHARGING,信息娱乐,ACOUSTIC INSULATION,光学粘合剂,显示,THERMAL CONDUCTORS,LIGHT LEAK,AV,电磁波屏蔽,BUSHINGS,VEHICLE CHARGING,热导体,倒相器,AUTOMOTIVE,标志,LIGHT DIFFUSION,OPTICAL ADHESIVES,DC/DC CONVERTERS,热屏蔽,DISPLAYS,NAMEPLATES,EMI SHIELDING,BATTERY MODULE COOLING,隔音,HEAT PIPES,HUD,LED MODULES,热管,VAPOR CHAMBERS,EMBLEMS,表面防护,NAVIGATION,车身侧饰条,LIDAR,THERMAL MANAGEMENT,外部装饰,铭牌,WIRELESS CHARGING,HOSES,INFOTAINMENT,电池充电,THERMAL SHIELDING,SURFACE PROTECTION,衬套,传感器,RF SHIELDING,DISPLAY
智慧农业与建筑电气化技术
Boyd Corporation提供针对智能农业和建筑电气化的全面解决方案,涵盖热管理、精密转换解决方案等。公司利用传统冷却技术和突破性技术,如液冷系统、热管等,满足高功率、极端热负荷和空间限制的应用需求。此外,Boyd还提供快速原型制作、高效旋转模切转换、层压、切割、3D建模、CNC加工、钎焊、焊接等多种制造技术,以满足客户多样化的需求。
BOYD - 蒸汽室,LIQUID COOLING SYSTEMS,SURFACE PROTECTORS,定制软管,THERMAL INTERFACE MATERIALS,SCREEN PROTECTORS,显示文件,ENHANCEMENT FILMS,环保垫圈,隔热层,GRAPHITE HEAT SPREADERS,ENVIRONMENTAL SEALS,HMI FILMS,导电泡棉,HMI文件,HEAT PIPES,石墨热撒布器,增强膜,表面保护器,ATTACHMENT SYSTEMS,热管,VAPOR CHAMBERS,附着系统,屏幕保护器,O型环,BONDING SYSTEMS,DISPLAY FILMS,热界面材料,LIGHT CONTROL FILMS,HEAT SHIELDING,CONDUCTIVE FOAM,O-RINGS,热接口材料,ENVIRONMENTAL GASKETS,GASKETS,环境密封件,光控胶片,SEALS,垫片,CUSTOM HOSES,液体冷却系统,密封件,粘接系统,THERMAL INTERFACE MATERIAL,自主技术,DC/DC CONVERTERS,AUTONOMOUS FARMING,远程信息处理系统,SELF-DRIVING COMPUTERS,计算机系统,INVERTERS,电池模块,DC/DC转换器,IGBT,COMPLEX MULTI-STACK APPLICATIONS,BATTERY MODULE,SENSORS,NAVIGATION,导航,LIDAR,AUTONOMOUS TECHNOLOGY,LED LIGHTING,自动驾驶计算机,LED照明,显示,TELEMATICS SYSTEMS,COMPUTER SYSTEMS,倒相器,自主耕作,传感器,复杂的多堆栈应用程序,DISPLAY
热解决方案和技术
该资料详细介绍了多种热解决方案和技术,包括从散热片到完全集成的系统,适用于高热负载冷却。涵盖了液体冷却冷板、液体冷却系统、热交换器和循环冷却器等。还包括空气冷却、自然对流散热片、风扇、风扇散热片、吹风机和风扇托盘等。此外,还提到了两相冷却解决方案、液体冷却解决方案、石墨和高级导热技术、软件以及先进技术和研发等。
BOYD - 蒸汽室,BOARD LEVEL HEAT SINK,强制对流组件,翅片组件,HEAT SINKS EXTRUDED,风扇托盘,高级鳍,BOARD LEVEL COOLING,围栏,FAN TRAYS,散热片,鼓风机,EXTRUDED ALUMINUM,自然对流散热器,制造的组件,HEAT PIPE ASSEMBLIES,RECIRCULATING CHILLERS,冷板,STAMPINGS,冲压散热片,NATURAL CONVECTION HEAT SINKS,挤压型材切削翅片,液态冷板,热界面材料,挤压铝,EMBEDDED HEAT PIPES,COLD PLATES,BLOWERS,THERMAL ACCESSORIES,THERMOSIPHONS,FORCED CONVECTION ASSEMBLIES,热管组件,散热器,热虹吸,液体冷却系统,BLOWER,板级散热器,HEAT SINKS,ENCLOSURES,FABRICATED ASSEMBLIES,EXTRUSION PROFILES SKIVED FIN,FAN HEAT SINKS,FIN ASSEMBLIES,CHASSIS,冲压件,FANS,LIQUID COOLING SYSTEMS,THERMAL INTERFACE MATERIALS,压铸,FOLDED FIN,BOARD LEVEL HEAT SINKS,FORCED CONVECTION HEAT SINKS,板级冷却,拉链,VAPOR CHAMBERS,ADVANCED FIN,散热配件,DIE CAST,HEAT EXCHANGERS,扇子,LIQUID COLD PLATES,风扇散热器,底盘,强制对流散热器,ZIPPER,LIQUID SYSTEMS,散热器挤压成型,HEAT SPREADERS,液体系统,循环式冷水机组,预埋热管,折叠鳍,STAMPED HEAT SINK,换热器,高热负荷冷却,HIGH HEAT LOAD COOLING,AIR COOLING,LIQUID COOLING,空气冷却,液体冷却
蒸汽室简介
该资料主要介绍了 Boyd Corporation 在热管理领域的解决方案,包括各种热解决方案,如散热片、安装硬件和设施级冷却系统。资料重点介绍了超薄蒸汽腔技术,其在薄型格式中提供更高的热导率,并具有不同的材料选项,如铜、不锈钢和钛。此外,资料还讨论了蒸汽腔的设计选项、性能基准、与多功能解决方案的集成以及其在不同应用中的价值。
BOYD - 蒸汽室,超薄蒸汽室,ULTRATHIN VAPOR CHAMBERS,VAPOR CHAMBERS,ULTRA-THIN VAPOR CHAMBERS,INVERTER,LAPTOP,伺服器,SERVER,GRAPHICS CARD,游戏机,GAMING CONSOLE,移动电话,显卡,逆变器,IGBT,TELECOM BASE STATION,电信基站,笔记本电脑,MOBILE PHONE
移动电子设备
Boyd公司提供一系列针对移动电子产品的解决方案,包括精密转换解决方案。公司专注于生产高质量、高精度的组件,涵盖从显示屏密封胶到光学透明屏幕粘合剂和传感器与摄像头保护等。产品应用范围广泛,包括防眩光与隐私膜、边框粘合、按钮与键盘盖、组件识别与跟踪标签、显示屏与光学透明粘合剂、EMI与RFI管理、图形覆盖层与LED死面、散热片与石墨散热器、集成显示屏密封胶、LED扩散器/扩散膜、光控制与增强膜、麦克风与扬声器网罩、保护膜、水与湿度指示器等。此外,Boyd还提供热解决方案,包括标准散热器到定制双相或液体系统,以及超薄解决方案,满足移动设备的热控制需求。公司拥有全球生产能力,并在清洁室环境中制造高级显示组件,确保敏感应用中的组件不受环境危害。
BOYD - 蒸汽室,LIQUID COOLING SYSTEMS,THERMAL INTERFACE MATERIALS,热界面材料,低轮廓鼓风机,集成显示屏垫片,EMI SHIELDING,RFI SHIELDING,STANDARD HEAT SINKS,光学透明屏幕粘合剂,LOW PROFILE BLOWERS,HIGH PERFORMANCE MATERIALS,射频干扰屏蔽,HEAT PIPES,电磁波屏蔽,液体冷却系统,显示器垫圈,INTEGRATED DISPLAY GASKETS,热管,高性能材料,标准散热器,VAPOR CHAMBERS,DISPLAY GASKETS,OPTICALLY CLEAR SCREEN ADHESIVES,PROTECTION FILMS,隔热板,BEZEL BONDING,MOBILE PHONE APPLICATIONS,HIGH CAPACITY BATTERIES,GRAPHITE HEAT SPREADERS,键盘盖,BUTTON,CHARGING SYSTEMS,LED死区,增强膜,EMI管理,SENSORS,SENSORS & INPUT DEVICES,高级相机,传感器和输入设备,MOBILE ELECTRONICS INDUSTRY,大容量电池,WIRELESS & HIGH SPEED CHARGING SYSTEMS,手机应用,WATER & MOISTURE INDICATORS,图形叠加,LED DIFFUSERS,LED ADVANCED DISPLAYS,LIGHT CONTROL,OLED ADVANCED DISPLAYS,水和湿度指示器,高密度PCB组件,ANTI GLARE,保护膜,显示,防眩光,EMI MANAGEMENT,ADVANCED CAMERA,部件标识,HEAT SHIELDS,扬声器金属丝网,扩散膜,输入设备,CHASSIS,无线和高速充电系统,MICROPHONE,TRACKING LABELS,ENHANCEMENT FILMS,COMPONENT IDENTIFICATION,麦克风,石墨热撒布器,住房,LED扩散器,LED DEADFRONT,跟踪标签,PRIVACY FILM,HIGH DENSITY PCB ASSEMBLIES,SPEAKER WIRE MESH,钮扣,底盘,面板粘合,RFI管理,RFI MANAGEMENT,DIFFUSERS FILMS,LED高级显示器,HOUSING,充电系统,KEYPAD COVERS,INPUT DEVICES,灯光控制,隐私片,移动电子产业,OLED高级显示器,GRAPHIC OVERLAYS,传感器,DISPLAY
钛超薄蒸汽室
钛超薄蒸汽腔利用被动两相热传递技术,在导热效率上比固态铜高出10到40倍。这种技术无需风扇或泵等主动组件,因此非常可靠。钛的高强度允许制造更薄、更轻的蒸汽腔结构,其内部蒸气空间最大化,提高了有效传热系数。Boyd公司提供高度定制的毛细结构优化蒸汽腔性能,并开发了高效的大规模生产方法。
BOYD - 钛超薄蒸汽室,TITANIUM ULTRA-THIN VAPOR CHAMBERS,手机,移动应用,MOBILE,EMOBILITY APPLICATIONS,消费电子产品,CONSUMER ELECTRONIC PRODUCTS
热管理技术
本文介绍了多种热管理技术,包括散热片、热管、蒸汽腔、3D蒸汽腔、热虹吸、振荡/脉动/循环热管、液体辅助空气冷却、直接液体冷却和沉浸式冷却。每种技术都有其特点和适用场景,如散热片用于基础热解决方案,热管用于高效热传输,蒸汽腔用于快速均匀散热,沉浸式冷却则适用于数据中心服务器。文章还提供了不同热管理技术的性能比较,包括热阻、功率处理、热传输距离、系统级功耗、重量、系统依赖性和成本等因素。
BOYD - 蒸汽室,无源,两相元件,PULSATING HEAT PIPES,3D蒸汽室,3D VAPOR CHAMBERS,PASSIVE, TWO-PHASE COMPONENTS,THERMOSIPHONS,热虹吸,HEAT PIPES,散热片,振荡热管,HEAT SINKS,热管,回路热管,VAPOR CHAMBERS,OSCILLATING HEAT PIPES,LOOP HEAT PIPES,脉动热管,SERVER,A&D应用,手机,伺服器,A&D APPLICATIONS,MOBILE PHONES,自主计算模块,超级计算机安装,情绪化,LAPTOP,冷却高功率企业芯片,GPU,公司研发研究,SERVERS,GOVERNMENT,TELECOM APPLICATIONS,HIGH POWER COMPONENTS,ELECTRIC DRIVETRAIN,ROUTERS,工业,AI设备,CORPORATE R&D STUDIES,电信应用,GAMING CONSOLE,AI DEVICES,SUPER COMPUTER INSTALLATION,高功率元件,AUTONOMOUS COMPUTE MODULE,路由器,平板,医学应用,游戏机,电动传动系统,LARGER INDUSTRIAL,高性能混凝土,GAMING CONSOLES,MEDICAL APPLICATIONS,政府,INDUSTRIAL,COOLING HIGH-POWER ENTERPRISE CHIPS,EMOBILITY,较大的工业,服务器,HPC,笔记本电脑,TABLETS
电子移动产品解决方案
Boyd公司提供全面的e-Mobility解决方案,涵盖精密转换、热管理、连接性等多个领域。公司拥有丰富的经验,提供从设计到制造、包装和物流的全服务解决方案,将创新理念转化为现实。产品应用包括高效旋转模切、热界面材料、石墨散热器、屏幕和表面保护、声学绝缘、粘合和附着系统、电池模块冷却、逆变器、计算机系统、热管理、传感器和激光雷达、信息娱乐、高级驾驶辅助系统(ADAS)、导航、抬头显示(HUD)、远程信息处理系统、无线充电、电池/车辆充电等。Boyd在全球范围内设有多个生产基地,提供设计中心、快速原型制作、组装、包装、客户服务以及及时交付和物流服务。
BOYD - 蒸汽室,LIQUID COOLING SYSTEMS,SURFACE PROTECTORS,封印,THERMAL INTERFACE MATERIALS,DC/DC CONVERTERS,显示文件,环保垫圈,SEALING,INVERTERS,HEAT SINKS,DC/DC转换器,光学薄膜,LED模块,PRECISION CONVERTER,CUTTING EDGE HEAD-UP DISPLAYS,HEAT PIPES,LED MODULES,散热片,表面保护器,热管,OPTICAL FILMS,VAPOR CHAMBERS,SENSORS,精密转换器,DISPLAY FILMS,热界面材料,尖端平视显示器,ENVIRONMENTAL GASKETS,GASKETS,光学透明粘合剂,OPTICALLY CLEAR ADHESIVES,SEALS,垫片,电气绝缘,液体冷却系统,密封件,倒相器,ELECTRICAL INSULATION,传感器,NVH,远程信息处理系统,SCREEN,DISPLAYS,ADAS,电池模块冷却,情绪化,BATTERY MODULE COOLING,人机界面,车充,COMPLEX MULTI-STACK APPLICATIONS,DISPLAY CONDUCTIVITY,CUTTING EDGE HEAD-UP DISPLAYS,HUD,无线充电,BSR,远程信息处理,显示电导率,显示器,NAVIGATION,HMI,导航,BATTERY CHARGING,LIDAR,信息娱乐,尖端平视显示器,屏幕,WIRELESS CHARGING,INFOTAINMENT,显示,EMOBILITY,电池充电,AV,TELEMATICS SYSTEMS,VEHICLE CHARGING,TELEMATICS,复杂的多堆栈应用程序,DISPLAY
电子商城
登录 | 立即注册
提交评论