PCIe® Gen 3 NVMe M.2 2280 / 2242 / 2230 SSD
●ATP的M.2 2280 NVMe固态模块基于NVMe™协议，并利用PCI Express®（PCIe®）Gen3 x4接口，可提供快速、可靠和持久的性能，以满足当今嵌入式和工业应用日益增长的数据存储需求。
●这些模块采用3D三电平单元（TLC）NAND闪存构建，容量从40GB到960GB不等，可满足各种数据存储需求。
●具有工业工作温度额定值的ATP NVMe SSD即使在-40°C至85°C的极端温度下也能提供稳定的性能。
●选择ATP M.2 2280 NVMe模块，采用可定制的热管理解决方案。这包括固件和硬件选项，如铜箔和翅片式散热器，以有效散热并确保最佳水平的持续性能。
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PCIe®Gen 3 NVMe M.2 2280/2242/2230固态硬盘 |
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N750Pi、N700Pi、N700Pc、N650Si、N650Sc、N600Si、N600Sc、N600Vi、N600Vc、FT120GP38AG8BPI、FT240GP38AG8BPI、FT480GP38AG8BPI、FT960GP38AG8BPI、FT120GP38AG8BPC、FT240GP38AG8BPC、FT480GP38AG8BPC、FT960GP38AG8BPC、FT120GP38ANDBFC、FT240GP38ANDBFC、FT480GP38ANDBFC、FT120GP34ANDBFC、FT240GP34ANDBFC、FT480GP34ANDBFC、FT960GP34ANDBFC |
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| 世强先进（深圳）科技股份有限公司 | |
| 世强硬创平台www.sekorm.com | |
| 世强硬创平台电子商城www.sekorm.com/supply/ | |
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ATP Electronics, the global leader in specialized storage and memory solutions, has announced the launch of its tiniest NVMe flash storage offering: the N700 Series PCIe® Gen3 x4 NVMe™ solid state drives (SSDs, which are available as M.2 Type 1620 heatsink ball-grid array (HSBGA) package.
M.2 2280 PSLC NVMe SSDs Break 3D TLC Limits wth 2000 MB/s Sustained Sequential Write Performance
ATP ELECTRONICS introduces its latest line of M.2 2280 NVMe solid state drives (SSDs) built on 3D triple level cell (TLC) NAND flash.
NVMe SSD Thermal Management: What We Have Learned from Marathons
NVMe solid state drives (SSDs) are known to run at blistering speeds. They are 4X faster than Serial ATA (SATA) drives! As such, they are prone to overheating, especially when installed in systems with limited airflow. This series of articles explores the considerations and thermal solutions offered by ATP, so NVMe SSDs can beat the heat and thus deliver reliable sustained performance over extended periods of time.
【产品】ATP Electronics宣布推出其最小的NVMe固态驱动器（SSD），HSBGA封装
2021年4月，专ATP Electronics宣布推出其最小的NVMe闪存产品：N700系列PCIe® 第3代x4 NVMe™ 固态驱动器（SSD），该产品采用了M.2 1620型散热器球栅阵列（HSBGA）封装。M.2 1620型HSBGA符合M.2规范，它支持高速PCIe 3.0接口x4通道和NVMe协议，以每通道8 Gb/s的速度提供高达32 Gb/s的带宽。
What is NVMe SSD and What are the Benefits?
ATP M.2 2280 NVMe SSDs are designed for a PCIe 3.0 x4 interface and comply with NVMe 1.2 specifications. Along with up to 1 TB memory capacity, sequential read speed of up to 2,540 MB/s, and sequential write speeds up to 1,100 MB/s, ATP M.2 NVMe SSDs exceed the SATA interface bandwidth 2x-3x, eliminate bottlenecks, and deliver a dramatic performance boost over AHCI standards. ATP M.2 2280 NVMe SSDs integrate 3D NAND MLC technology, enabling higher memory capacity, lower cost per bit, and increased longevity.
PCIe®Gen 3 NVMe M.2 1620 HSBGA固态硬盘专业存储和内存解决方案的全球领导者
该资料介绍了一种高性能的PCIe Gen 3 NVMe M.2 Type 1620 HSBGA固态硬盘（SSD）。该SSD具备高速PCIe 3.0接口和NVMe协议，提供高达32 Gb/s的带宽。采用pSLC模式，具有高可靠性和长寿命。适用于超便携和可靠性要求高的物联网设备和嵌入式系统。产品规格包括不同容量和性能选项，支持多种安全特性。
ATP - 固态硬盘,NVME HEAT SINK BALL GRID ARRAY SOLID STATE DRIVES,PCIE®GEN 3 NVME M.2型1620 HSBGA固态硬盘,NVME SOLID STATE DRIVES,PCIE® GEN 3 NVME M.2 TYPE 1620 HSBGA SSD,SSDS,NVME固态硬盘,NVME散热器球栅阵列固态硬盘,N600VI,N700PI,N700PC,N600VC,N700,N700 SERIES,超紧凑型物联网设备,SMART FACTORIES,智能工厂,采矿作业,航空航天,钢结构制造,ULTRA-COMPACT INTERNET OF THINGS DEVICES,TRANSPORTATION,STEEL FABRICATION,EMBEDDED SYSTEMS,交通运输,嵌入式系统,AEROSPACE,ULTRA-COMPACT IOT DEVICES,MINING OPERATIONS
ATP电子将出席2022慕尼黑国际电子元器件博览会，展示专业存储和内存解决方案
全球专业存储和存储解决方案领导者ATP公司将参加2022慕尼黑国际电子元器件博览会，除了ATP最新的工业存储解决方案外，ATP还将展示可定制的散热、高度耐用和安全解决方案，如PCIe第4代NVMe固态硬盘、CFexpress卡和DDR5内存模块。
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