EMI SHIELDING AND THERMAL MANAGEMENT SOLUTIONS
●传感器和其他对电磁干扰敏感的设备继续激增，涌向自动驾驶汽车、5G互联城市、智能家居、医疗设备等。信号干扰不仅对用户造成困扰，而且与过热相结合，会对产品性能产生毁灭性的影响。
●对于许多新的创新，目前的设计流程根本行不通。不断上升的热负荷与更高频率的产品混合在一起，在空气中产生了更多相互冲突的信号，给当今的产品工程师和设计师带来了新的挑战。
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EMI屏蔽和热管理解决方案 |
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共模扼流圈、低高度板级屏蔽、垫片、无硅，符合，高性能材料、多层铁氧体功率电感器、泡沫垫圈上的织物、结构材料、特克斯热、高性能一次性填缝剂、柔软的，两部分可分配的填隙材料、软填缝剂、精密金属、柔软、低偏转力的填隙材料 |
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[ 电信 ][ 数据通信 ][ 热管理 ][ 物联网 ][ 大功率应用 ][ 高频应用 ][ 低延迟通信 ][ 共模扼流圈 ][ 低高度板级屏蔽 ][ 智能汽车 ][ 电动车辆 ][ 自动驾驶系统 ][ 信息娱乐系统 ][ LED组件 ][ 电动汽车动力总成电子设备 ][ 笔记本电脑 ][ 平板电脑 ][ 连接的设备 ][ 增强现实 ][ 虚拟实境 ][ 耳机 ][ 眼镜 ][ 可穿戴游戏设备 ][ 智能电表 ][ 传感器 ][ 工业自动化 ][ 医疗器件 ][ 血糖监测 ][ 医疗监护设备 ][ 疼痛管理设备 ][ 疼痛科 ][ MRI仪器 ][ 医疗器械 ][ 监视器 ][ 打印机 ][ 键盘 ][ 自动驾驶汽车 ][ 5G连接城市 ][ 智能家居 ][ 医疗设备 ] |
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解决方案,应用及方案,SOLUTIONS |
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详见资料 |
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中文 英文 中英文 日文 |
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2021/10/21 |
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2.4 MB |
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| 世强先进（深圳）科技股份有限公司 | |
| 世强硬创平台www.sekorm.com | |
| 世强硬创平台电子商城www.sekorm.com/supply/ | |
| 世强硬创平台www.sekorm.com | |
| 世强硬创平台www.sekorm.com |
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LAIRD - THERMAL GAP FILLER,导热垫片,TFLEX HD340,HD300,TFLEX HD300,TFLEX HD380TG,TFLEX HD3160TG,TFLEX HD3100TG,TFLEX HD320TG,TFLEX™ HD300TG,TFLEX HD3120TG,TFLEX HD300TG,TFLEX HD380MTG,HD3XXX,TFLEX HD340TG,TFLEX™ HD300,TFLEX HD360TG,TFLEX HD300MTG,TFLEX HD3200TG
TFLEX™SF10系列散热填隙片
Tflex™ SF10系列是一种创新的、高性能的热填充材料，属于Laird公司热填充产品组合的一部分。该材料不含硅酮，具有低导热系数（10 W/mk）和优异的变形性能，在变形过程中对组件施加的压力最小。它具有以下特点和好处：无硅酮配方、低峰值和残余压力、出色的表面润湿以实现低接触电阻、极低的导热阻力和环保解决方案。
LAIRD - THERMAL GAP FILLER,GAP FILLER,垫片,HIGH PERFORMING THERMAL MATERIAL,高性能热材料,导热垫片,TFLEX™ SF10 SERIES,SF10,TFLEX SF10,TFLEX™ SF10,SF10 SERIES
Tflex SF4–Tflex SF7–Tflex SF10无硅酮导热填隙材料初步数据表
Tflex SF4、Tflex SF7和Tflex SF10是Laird公司推出的创新型、高性能的无硅热间隙填充材料。这些产品采用无硅技术，具有优异的挠曲性能，对组件施加的压强最小，达到最低热阻所需的压强非常小。产品厚度从0.5mm到4mm，以0.5mm为增量提供标准尺寸。
LAIRD - SILICONE FREE THERMAL GAP FILLERS,不含硅酮的热填隙材料,SILICONE FREE THERMAL GAP FILLER,无硅热隙填料,TFLEX SF7,TFLEX SF10,TFLEX™ SF4,1.00,TFLEX™ SF7DF,1.00,TFLEX SF4,AUTOMOTIVE ELECTRONICS,电信系统,TELECOM SYSTEMS,光学模块,DATACOM SYSTEMS,CAMERAS,OPTICAL MODULES,汽车电子,摄像机,数据通信系统
Tflex™HD400 Series Thermal Gap Filler
Laird Tflex HD400是一款高导热填充材料，适用于宽制造公差情况。它具有4.0 W/mK的热导率，低压力变形特性，良好的表面润湿性以降低接触电阻，并最小化电路板和组件应力。该产品提供多种厚度选项，从0.5毫米到5.0毫米，并且可以通过认证的分包商和分销网络提供不同形式的转换。
LAIRD - THERMAL GAP FILLER,4.0 W/MK GAP FILLING MATERIAL,4.0 W/MK填隙材料,导热垫片,TFLEX™ HD440,TFLEX HD400,TFLEX™ HD4100DC1
Tflex™ B200热间隙填料
Tflex™ B200是一种可靠的热界面材料，具有良好的热性能和易于处理的特点。它提供多种表面和加固选项，适用于各种应用。该填充剂具有低模量接口和柔软度，可以缓解机械应力，有效填补间隙并降低热阻。Tflex™ B200有助于吸收冲击，从而在长期内提高设备可靠性。它还具有高介电绝缘性，可防止器件之间的击穿。
LAIRD - THERMAL GAP FILLER,导热垫片,TFLEX™ B200FG,TFLEX B280,TFLEX B260,TFLEX B2180,TFLEX B240,B200FG,TFLEX B2140,TFLEX B2160,TFLEX B2200,TFLEX B2100,B200,TFLEX B2120,B2XXX,TFLEX B220FG,TFLEX™ B240,B200MFG,TFLEX™ B200,TFLEX B200,TFLEX™ B200MFG
The Next Generation of Thermal Gap Filler Pad: THERM-A-GAP PAD 80LO, with a Thermal Conductivity of 8.3 W/m-K
By addressing the shortcomings of current gap pads, PAD 80LO represents the next generation of gap pads to address modern electronics design and thermal managements. With a thermal conductivity of 8.3W/m-K, PAD 80LO is designed for high heat-output components.
Tflex™ HD700系列热间隙填料
Tflex™ HD700 系列热间隙填充材料结合了 5 W/mK 的导热率和优异的压力与变形特性。该产品能够在最小化组件应力同时提供低热阻，减少设备内的机械和热应力。Tflex™ HD700PI 可提供带有集成聚酰亚胺薄膜的一面，具有电隔离、装配方便和撕裂阻力等优点。厚度范围从 0.5mm 到 5mm，颜色为浅粉色或深灰色。
LAIRD - THERMAL GAP FILLER,导热垫片,HD7100PI,HD740,HD7100,HD7200,HD700PI,HD700 SERIES,HD7100,DC1,HD780,HD7140,HD7120,GR,HD700,HD720
Tflex™ HD300系列热间隙填料
Laird TflexTM HD300系列是一种高导热填充材料，适用于制造公差较大的情况。该产品具有优异的表面润湿性和高挠曲性能，能降低接触电阻并提供更低的总体热阻。Tflex HD300提供多种厚度选项，从0.5毫米到5毫米不等，并可通过认证的分包商和分销网络提供多种转换格式。
LAIRD - THERMAL GAP FILLER,GAP FILLER MATERIAL,间隙填充材料,导热垫片,TFLEX HD340,TFLEX HD300,TFLEX HD3100DC1,TFLEX™ HD300 SERIES,TFLEX™ HD300
Tflex™HP34系列导热填隙材料
Laird推出的Tflex™ HP34系列热间隙填充材料是一种高性能的热管理解决方案。该产品由石墨纤维精确排列而成，具有极高的体积热导率，能够在施加压力的情况下保持其热性能。
LAIRD - THERMAL GAP FILLER,高性能填隙材料,HIGH PERFORMING GAP FILLER,导热垫片,TFLEX HP34,TFLEX™ HP34 SERIES,TFLEX™ HP34
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