2412041594 ETRX Module, 2-to-1 Shield Change & Alternate Capacitor
■变更说明
▲Silicon Labs很高兴地宣布，ETRX系列模块的以下产品已成功通过资格认证：
◆单屏蔽（现有设计有两个屏蔽，顶部和底部）。单屏蔽将提高生产率
◆由于Taiyo Yuden发出停产通知，YAGEO电容器被选为替换组件
▲自本PCN生效之日起，Silicon Labs将在现有库存耗尽后履行单屏蔽和YAGEO电容器的订单
■变更原因
▲此次变更实现了向单屏蔽的过渡，以提高生产率，同时由于Taiyo Yuden电容器的停产（EOL）状态，对其进行了更换
■对形状、配合、功能、质量、可靠性的影响
★对形状、配合、性能、质量和可靠性没有影响
|
2412041594 ETRX模块，2对1屏蔽转换和备用电容器 |
|
|
ETRX357、ETRX357-CICIE-R310、ETRX357-LRS、ETRX357-LRS-R305C、ETRX357-LRS-R8、ETRX357-R305C、ETRX357-R8、ETRX357-*NL0015、ETRX357HR-LRS-P1639、ETRX357HR、ETRX357HR-EZSP-UART-454、ETRX357HR-HA-R310、ETRX357HR-LRS、ETRX357HR-LRS-R8、ETRX357HR-R8、ETRX357HR-R10、ETRX357-LRS-P1468、ETRX357-LRS-*NF6003、ETRX357*NF6102、ETRX357*NF6202、ETRX357-R10、ETRX3585-LRS、ETRX3587、ETRX3587-LRS、ETRX3587HR、ETRX3587HR-LRS、ETRX3588、ETRX3588-LRS、ETRX series、ETRX |
|
|
|
|
|
产品变更通知及停产信息,Process Change Notice,工艺变更通知单 |
|
|
|
|
详见资料 |
|
|
|
|
|
|
|
|
|
|
|
中文 英文 中英文 日文 |
|
|
Dec 04, 2024 |
|
|
|
|
|
|
|
|
2412041594;2024-12-04-1594 |
|
|
804 KB |
|
|
Mar 10, 2025 |
|
|
Assembly |
|
| 世强先进（深圳）科技股份有限公司 | |
| 世强硬创平台www.sekorm.com | |
| 世强硬创平台电子商城www.sekorm.com/supply/ | |
| 世强硬创平台www.sekorm.com | |
| 世强硬创平台www.sekorm.com |
- |
- +1 赞 0
- 收藏
- 评论 0
本文内容由SILICON LABS品牌授权世强硬创平台转载，旨在分享知识与信息，如有内容侵权或者其他违规问题，请及时与我们联系，我们将在核实情况后尽快删除或提供适当的版权信息。对于通过本网站上传或发布的内容，世强硬创平台不承担任何版权责任。
相关推荐
2201251131 BLE112模块停产通知（2022-01-18-1131）
Silicon Labs宣布BLE112模块的停产和最后购买（LTB）通知。最后订购日期为2022年7月22日，生效日期为2023年1月24日。由于蓝牙SIG撤销了BT4.0规范，导致此变更。所有在最后订购日期和生效日期之间的客户订单将不可取消和不可退货。Silicon Labs将不再接受生效日期之后的客户订单。
SILICON LABS - MODULES,模块,BGM220PC22WGA2R,BLE112-N-V1,BLE112-N-V1C,BLE112-E-V1,BLE112-A-V1,BLE112,BLE112-E-V1C,BGM220PC22WGA2,BGM220-EK4314A,BLE112-A-V1C
2408141563 MGM111A模块的新Crystal供应商工艺变更通知
Silicon Labs宣布为MGM111A模块成功认证了新的晶振供应商（NKG）。自PCN生效日期起，Silicon Labs将开始出货列出的带有新晶振供应商的模块。此次变更不影响产品的形态、尺寸、功能、质量或可靠性。客户需在30天内确认接受此变更，否则视为默认同意。如有进一步数据请求或查询，请联系Silicon Labs的销售代表。资格样本可供索取。
SILICON LABS - 模块,MODULES,MGM111A256V2,MGM111A256V2R,MGM111A
2405081530 XGM240P和XGM210P模块工艺变更通知的附加装配、测试和装运现场
Silicon Labs宣布STARS（STARS Microelectronics）成功通过资格认证，成为xGM240P和xGM210P模块生产的额外组装、测试和发货地点。此变更不影响产品形式、功能、质量或可靠性。自2024年8月14日起，Silicon Labs将从STARS开始组装、测试和发货xGM210P和xGM240P模块。
SILICON LABS - MODULES,模块,MM21PA3IP1613A2,MGM210PA22JIA2R,MGM210PB22JIA2R,BGM210PA32JIA2R,MGM240PB32VNN3,MM21PA3IP1612A2R,BGM210P,BGM240PA22VNA3R,BGM240PB22VNA3R,XGM210P,BGM210PB32JIA2R,BGM210PB22JIA2,MGM240PA32VNA3,BGM210PA22JIA2,BGM210PA22JIA2R,BGM240PB32VNA3,XGM240P,BGM240PA22VNA3,MGM210PB32JIA2R,MGM210P,BGM210PB32JIA2,BGM240PB32VNN3,BGM210PBPRD1A2R,BGM240PA32VNN3R,BGM240PB32VNA3R,MGM210PB22JIA2,BGM210PBPRD1A2,MGM240PB32VNN3R,MM21PA3IP1612A2,BGM240PA32VNA3,MGM240PA32VNA3R,MGM240PB32VNA3R,BGM240PB22VNA3,BGM240PA32VNN3,MGM210PA32JIA2,BGM240P,MGM240PA32VNN3,MGM240PA22VNA3,MGM210PA32JIA2R,MGM240P,BGM210PB22JIA2R,MGM210PA22JIA2,MM21PA3IP1613A2R,MGM210PB32JIA2,MGM240PA22VNA3R,BGM210PA32JIA2,BGM240PB32VNN3R,MGM240PB32VNA3,BGM240PA32VNA3R,MGM240PA32VNN3R
Silicon Labs（芯科科技） 物联网无线产品选型指南
Company and product overview Bluetooth Modules Bluetooth Modules Overview Bluetooth Modules Bluetooth Low Energy Kits Bluetooth Modules Blue Gecko Wireless Modules Bluetooth Modules Bluetooth Xpress Modules Bluetooth Modules Blue Gecko Wireless SoCs Bluetooth Modules Bluetooth BR/EDR Kits Bluetooth Modules Bluetooth BR/EDR Modules proprietary wireless devices proprietary wireless devices Proprietary Kits Proprietary Wireless Sub-GHz and 2.4 GHz Dual Band Devices Proprietary Wireless Sub-GHz Devices Wi-Fi Modules Wi-Fi Modules Wi-Fi Kits Mighty Gecko Modules Mighty Gecko Modules Mighty Gecko Development Kit Mighty Gecko Modules Mighty Gecko Mesh Networking Wireless SoCs Z-Wave Modules Z-Wave Modules Z-Wave Reference Designs Z-Wave Modules Z-Wave Development Kits
SILICON LABS - 射频发射器,DUAL BAND DEVICES,低功耗蓝牙套件,RF TRANSMITTER,Z-WAVE串行接口模块,ISM BAND RECEIVERS AND TRANSMITTERS,MIGHTY GECKO入门套件,蓝牙远程模块,8位微控制器,MESH NETWORKING WIRELESS SOCS,WI-FI套件,WIRELESS MCUS,蓝牙开发套件,RF MODULES,BLUETOOTH BR/EDR KITS,BLUETOOTH MODULES,BLUETOOTH CLASS 2 MODULE,蓝牙5 PCB模块,32位微控制器,BLUETOOTH XPRESS MODULES,Z-WAVE MODULES,WI-FI KITS,CONTROLLER DEVELOPMENT KIT,射频SOC,蓝牙BR/EDR模块,Z-WAVE DEVELOPMENT KITS,BLUETOOTH AUDIO MODULE,BLUETOOTH BR/EDR MODULESBLUETOOTH BR/EDR MODULES,BLUE GECKO BLE SIP模块入门套件,WI-FI MODULES,MIGHTY GECKO模块,WI-FI XPRESS STARTER KIT,区域发展工具包,PROPRIETARY WIRELESS SUB-GHZ DEVICES,BLUETOOTH BR/EDR MODULES,BLUE GECKO WIRELESS SOCS,控制器开发工具包,Z-WAVE模块,PROPRIETARY WIRELESS DEVICES,BLUE GECKO BLUETOOTH LOW ENERGY SIP MODULE WIRELESS STARTER KIT,PROPRIETARY KITS,嵌入式开发工具包,BLUETOOTH LONG RANGE MODULE,BLUETOOTH DEVELOPMENT KIT,射频模块,Z-WAVE开发套件,RF SOCS,BLUE GECKO无线SOC,BLUE GECKO WIRELESS MODULES,8-BIT MICROCONTROLLER,无线入门套件,BLUE GECKO BLE SOC入门套件,MIGHTY GECKO STARTER KIT,BLUE GECKO无线模块,ISM频段接收机和发射机,32-BIT MICROCONTROLLER,智能蓝牙开发套件,BLUETOOTH LOW ENERGY KITS,MIGHTY GECKO MESH NETWORKING WIRELESS SOCS,BLUE GECKO BLE SIP MODULE STARTER KIT,BLUETOOTH SMART DEVELOPMENT KIT,EMBEDDED DEVELOPMENT KIT,WI-FI MODULE WIRELESS STARTER KIT,MIGHTY GECKO MODULES,WI-FI XPRESS入门套件,BLUETOOTH 5 PCB MODULE,WI-FI模块无线启动套件,PROPRIETARY WIRELESS SUB-GHZ AND 2.4 GHZ DUAL BAND DEVICES,WI-FI模块,BLUETOOTH CLASSIC AUDIO DEVELOPMENT KIT,MIGHTY GECKO DEVELOPMENT KIT,WIRELESS STARTER KIT,蓝牙经典音频开发套件,WIRELESS SUB-GHZ DEVICE,蓝牙CLASS 2模块,BLUE GECKO低功耗蓝牙SIP模块无线入门套件,蓝牙XPRESS模块,REGIONAL DEVELOPMENT KITS,BLUE GECKO BLE SOC STARTER KIT,Z-WAVE SERIAL INTERFACE MODULE,无线MCU,蓝牙音频模块,EBWT41U,ZDB5202,SLEXP8027A,EFR32FG13P233F512GM48,EFR32™,SLWSTK6061B,MGM12P,EZR32WG,EFR32FG13P231F512GM32,EFR32BG12P232F1024GM68,EFR32MG13P733F512GM48,EFR32BG13P532F512GM32,WT12,AMW007-E04,EFR32,WT32I,EZR32™,BGM121,BGM11S,WT11U,EFR32FG,EFR32FG14P233F256GM48,SLWSTK6062B,RBK-ZW500DEV-CON2,SLWSTK6120A,SLWSTK6063B,RBK-ZW500,EFR32BG12P132F1024GL125,SI4XXX,ZM5101,ZM5304,ZDB5101,ACC-UZB3-U-BRG,BGM111,EBWT11U,EFR32FG14P233F128GM48,ACC-UZB3-U-STA,MGM111,ZDB5304,SLWSTK6000B,SLWSTK6020B,WT32,SI10XX,SLWSTK6101C,EFR32MG13P632F512GM32,AMW037,EFR32FG12P433F1024GM48,DKWT32I-A,EFR32MG12P132F1024GL125,EFR32MG1P133F256GM48,BGM13S,EZR32HG,BGM13P,BGX13P,EZR32LG,MGM13P,WT41U,EFR32BG13P733F512GM48,BGX13S,SLWSTK6060B,MGM13S,SLWSTK6065B,WGM110,RBK-ZW500DEV-EMB2,EFR32BG12P433F1024GL125,EBWT12-A,ZM5202,AMW007,SLTB004A,EFR32MG14P733F256GM48,资产追踪,安全解决方案,便携式健身器材,器具,照明,便携式医疗设备,SECURITY,RETAIL,UTILITIES,CONSUMER,监测,家庭自动化,病人监护系统,ASSET TRACKING,物联网,METERING,PORTABLE FITNESS EQUIPMENT,IP摄像机,IP CAMERAS,INFUSION PUMPS,BUILDING AUTOMATION,HOME AUTOMATION,REMOTE MOBILE ACCESS,SMART HOME,POINT-OF-SALE SCANNERS,ASSET TRACKING,商业的,OCCUPANCY SENSORS,CONSUMER HEALTHCARE,BLOOD PRESSURE DEVICES,THERMOSTATS,INDUSTRIAL,PORTABLE MEDICAL EQUIPMENT,恒温器,订购按钮,SECURITY SOLUTIONS,销售点摄像机,IOT,PATIENT MONITORING SYSTEMS,HOME AUTOMATION,LIGHTING,智能计量,销售点扫描仪,MONITORING,工业,占用传感器,SMART METERING,ALARMS,楼宇自动化,零售,警报,血压装置,公用事业,COMMERCIAL,智能家居类,APPLIANCES,POINT OF SALE CAMERAS,ORDERING BUTTONS,OCCUPANCY SENSORS,THERMOSTATS,输液泵,消费保健,远程移动访问
Silicon Labs‘ Breakthrough Ultra-Low Power Wi-Fi 6 and Bluetooth LE 5.4 Modules SiWx917Y Supercharge Device Deployment
Silicon Labs announced the SiWx917Y ultra-low power Wi-Fi® 6 and Bluetooth® Low Energy (LE) 5.4 modules. these modules are designed to help device makers streamline the complex development and certification process for Wi-Fi 6 devices.
New Silicon Labs Modules Provide Pre-Certified Wireless Connectivity for A Broad Range of IoT Applications
Silicon Labs today announced a portfolio expansion of pre-certified wireless modules specifically designed to address modern needs of IoT application development.
Silicon Labs安全公告A-00000506
Silicon Labs发布安全通告，指出Gecko OS HTTP服务器存在多个漏洞，包括拒绝服务（DoS）和远程代码执行（RCE）。受影响的WGM160P模块运行所有已发布版本的Gecko OS。CVE ID列表提供了详细的技术描述和CVSS评分。由于Gecko OS已进入生命周期的结束阶段，因此不会提供修复方案。
SILICON LABS - 模块,MODULES,WGM160P
2.4GHz SiP Modules Is Ideal for Miniaturized Designs | Silicon Labs
SiP modules provide space and cost savings but their built-in antennas are prone to detuning in real applications.Proper design can help minimize adverse effects to some degree. The method described here based on the use ofthe copper clearance area for compensating antenna detuning is a simple and economical, yet an extremely powerful solution for detuning compensation.
8 High-Power Bluetooth LE Modules and Their Applications
Bluetooth Low Energy (BLE) technology is renowned for its low power consumption and ease of use in short-range wireless communication. High-power BLE modules are essential for applications requiring extended range and robust connectivity. They integrate advanced wireless technologies and offer flexible output options, making them ideal for smart homes, industrial automation and more. This article introduces 8 high-power bluetooth LE modules and their applications.
Silicon Labs New 2.4GHz Wireless PCB Modules Bring Faster, Simplified Development to IoT Device Makers
Silicon Labs’new BGM240P and MGM240P PCB modules have been designed to provide faster time to market and simplify these challenges. The modules are designed to provide industry-leading RF performance, low power, and extensive regulatory certifications so developers can get devices to market faster.
Silicon Labs Launched New Si823Hx Gate Driver Board Optimized for High-power Modules
Silicon Labs introduced the new Si823Hx Gate Driver Board, an all-in-one isolation solution perfectly suited for the recently launched Wolfspeed WolfPACK power module. Wolfspeed power modules are used across numerous power applications, including EV chargers and motor drives in the industrial and automotive markets. Featuring the Si823Hx isolated gate driver and Si88xx digital isolator with integrated dc-dc converter, the board delivers excellent performance in a compact and cost-effective design, optimized for a wide range of modules.
2407031534 XGM13P、MGM12P、BGM113、BGM111A模块的新晶体供应商工艺变更通知
Silicon Labs宣布，为BGM13P、MGM12P、BGM113和BGM111A模块成功认证了新的晶振供应商（NKG）。自PCN生效日期起，Silicon Labs将开始使用新的晶振供应商发货。此次变更不影响产品的外形、尺寸、功能、质量及可靠性。受影响的产品编号包括BGM111A系列、BGM113系列、BGM13P系列和MGM12P系列等。最后更改产品的日期为2024年10月9日。
SILICON LABS - 模块,MODULES,XGM13P,BGM13P22F512GE-V2,MGM12P22F1024GE-V4,MGM13P12F512GA-V2R,BM13P22HGA-V2-P1605,MGM13P02F512GE-V2,BGM13P22F512GA-V2,MGM12P,BM13P22HGA-V2-P1605R,BGM113A2-V2-P1550,MGM12P22F1024GE-V4R,BGM113A2-V2-P1158,MGM12P32F1024GE-V4R,BGM111A256V2R,MGM13P12F512GA-V2,BGM113A256V21R,BGM113A256V2,BGM113A256V2R,BGM13P32F512GE-V2R,BM13P22HGA-V2-P1654,MGM13P12F512GE-V2,MGM13P02F512GE-V2R,BGM13P22F512GE-V2R,BGM13P32F512GA-V2,BM13P22HGA-V2-P1638R,BGM113A2-V2-P1446R,BGM13P32F512GE-V2,BGM111A,BGM111A256V21R,MGM12P02F1024GE-V4R,BGM113A2-V2-P1446,BGM113A2-V2-P1550R,MGM13P02F512GA-V2,BGM113A2-V2-PZ034R,MGM12P22F1024GA-V4,BGM111A256V21,BGM113A256V21,MGM12P22F1024GA-V4R,MGM12P32F1024GA-V4R,BGM113,MGM12P02F1024GA-V4R,MGM12P32F1024GA-V4,MGM12P32F1024GE-V4,BGM111A2-V2-P1394,BGM13P32F512GA-V2R,MGM12P02F1024GA-V4,BGM113A2-V2-PZ034,BGM111A2-V2-P1071,BM13P22HGA-V2-P1654R,MGM13P12F512GE-V2R,MGM12P02F1024GE-V4,BGM13P22F512GA-V2R,BM13P22HGA-V2-P1638,BGM13P,MGM13P,MGM13P02F512GA-V2R,BGM111A2-V2-P1071R,BGM111A256V2,BGM111A2-V2-P1394R
2305171456 FGM230S和ZGM230S V1.1规格书发布
Silicon Labs发布FGM230S和ZGM230S模块数据手册v1.1版本，主要更新包括支持Secure Debug功能，以及ZGM230S的绝对最大额定值表更新。用户需查阅数据手册修订历史以获取完整变更列表。
SILICON LABS - 模块,MODULES,FGM230SA27HGN3R,FGM230S,FGM230SA27HGN3,ZGM230S,FGM230SB27HGN3R,ZGM230SA27HGN3R,ZGM230SB27HGN3,ZGM230SA27HGN2R,ZGM230SB27HGN2,ZGM230SB27HGN2R,ZGM230SA27HGN2,ZGM230SB27HGN3R,ZGM230SA27HGN3,FGM230SB27HGN3
2212141357 ETRX数据表和标记更新
Silicon Labs发布ETRX系列模块的资料更新，包括修订版1.22至r9不等，主要更新内容为合规性更新和订购信息更新。同时，针对英国新规，ETRX模块将添加UKCA标志。资料更新涉及多个型号，包括ETRX35x、ETRX35x-LRS、ETRX3585-LRS和ETRX358x-LRS等。
SILICON LABS - 模块,MODULES,ETRX357HR-LRS,ETRX357-R8,ETRX357-LRS-R305C,ETRX357B*,ETRX35X-LRS,ETRX358X,ETRX357HR-R*,ETRX357-LRS-P*,ETRX3588,ETRX3587,ETRX35X,ETRX357,ETRX357HR-LRS-R8,ETRX357-CICIE-R310,ETRX,ETRX357-R*,ETRX357-P*,ETRX3585-LRS,ETRX357-LRS-R8,ETRX357-LRS-B*,ETRX3587HR-D*,ETRX357HR-E*,ETRX357-E*,ETRX357-C*,ETRX3587HR-LRS,ETRX357HR-LRS-P*,ETRX357-R305C,ETRX358X-LRS,ETRX357HR,ETRX3588-LRS,ETRX3587HR,ETRX357HR-HA-R310,ETRX357-S*,ETRX357-LRS-E*,ETRX357-LRS,ETRX357HR-R8,ETRX3587-LRS
2406261560 XGM210P的数据表版本V1.4和BGM210L模块的数据表版本V1.3工艺更改通知
Silicon Labs发布xGM210P模块的datasheet版本1.4和BGM210L模块的版本1.3，主要变更包括：将“Secure Element”更改为“Secure Engine”，更新蓝牙版本信息，添加绝对最大额定值规格，更新通用工作条件，更改RF接收器特性中的符号，更新蓝牙资格信息。针对BGM210L、BGM210P和MGM210P的具体变更细节请参考文档。
SILICON LABS - MODULES,模块,MM21PA3IP1612A2,MM21PA3IP1613A2,MGM210PA22JIA2R,MGM210PB22JIA2R,BGM210PA32JIA2R,MM21PA3IPZ095A2,BGM210LA22JNF2,BGM210LA22JIF2,MM21PA3IP1612A2R,BGM210P,BGM210L,XGM210P,MM21PA3IPZ095A2R,BGM210PB32JIA2R,MGM210PA32JIA2,BGM210PB22JIA2,BGM210LA22JIF2R,BGM210PA22JIA2,BGM210PA22JIA2R,MGM210PA32JIA2R,BGM210PB22JIA2R,MGM210PA22JIA2,MGM210P,MGM210PB32JIA2R,MM21PA3IP1613A2R,BGM210PB32JIA2,MGM210PB32JIA2,BGM210PA32JIA2,BGM210PBPRD1A2R,MGM210PB22JIA2,BGM210PBPRD1A2,BGM210LA22JNF2R
电子商城
现货市场
品牌：SILICON LABS
品类：Switch Hall Effect Magnetic Position Sensor
价格：￥2.2924
现货：126,000
授权代理品牌：集成电路
授权代理品牌：分立元件
授权代理品牌：接插件及结构件
授权代理品牌：部件、组件及配件
授权代理品牌：电源及模块
授权代理品牌：电子材料
授权代理品牌：仪器仪表及测试配组件
授权代理品牌：电工工具及材料
授权代理品牌：机械电子元件
授权代理品牌：加工与定制
我要提问
登录 | 立即注册
提交评论