curamik® CERAMIC SUBSTRATES Product Information

时间： 2017-11-21

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●curamik®高温/高压基板由与陶瓷基板（如铝）结合的纯铜构成₂O₃ AlN（氮化铝）、HPS（氧化锆）₂ 掺杂）或硅基硅₃N₄ （氮化硅）。

●curamik提供了两种技术来连接基板和铜。DBC（直接连接铜）——将纯铜连接到陶瓷上的高温熔化和扩散过程，以及AMB（活性金属钎焊）——将纯铜钎焊到陶瓷基板上的高温过程。

●铝的高导热性₂O₃ （24瓦/平方公里）、氮化铝（170瓦/平方公里）和硅₃N₄ （90 W/mK）以及厚铜包层（127–800μm）的高热容量和热扩散使我们的基板成为电力电子不可或缺的。直接安装在基板（板上芯片）上的硅芯片的机械应力非常低，因为与使用金属或塑料基的基板相比，陶瓷基板的热膨胀系数（CTE）与硅的CTE更匹配。curamik以5“x 7”和5.5“x 7.5”的主卡格式生产高温/高压基板。单个零件可以保留为主卡格式，以支持更高效的组件组装和安装，然后再拆分成单独的零件。我们还提供单件组装。

●优势：

■高导热性和耐温性，适用于高性能和高温应用
■高绝缘电压
■高热蔓延
■芯片和基板之间热膨胀系数的调整
■主卡和单张卡的高效处理

中文标题（翻译）:	curamik®陶瓷基板产品信息
厂牌:	ROGERS
型号:
品类:	陶瓷基板、高温/高压基板查看更多
应用:	查看更多
资料类型:	商品及供应商介绍查看更多
安规/环境规范:	查看更多
工作温度:	详见资料
应用等级:	查看更多
等级认证标准:	查看更多
封装:	查看更多
语言:	中文英文中英文日文
生成日期:	2016/12/01
过期日期:
版本号:	Version 2.16 en
文档编码:	Publication # 135-003
文件大小:	651 KB
授权代理商	世强先进（深圳）科技股份有限公司
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