【应用】Parker Chomerics 定制T-WING散热片,助力计算机硬盘快速散热
计算机硬盘制造商需要冷却电路板上两个相邻的读/写芯片的外壳温度,以确保MTBF(平均故障间隔时间)超过500k小时。
散热设计要求
•两元件表面以上须有约50 mils的低净空高度
•两个读/写芯片须与热敏感元件紧邻
•相邻元件表面之间的高度公差要宽(+ - 0 .020英寸)
•最小气流
•解决方案不能造成电气短路的危险
•经济且具有成本效益
关键客户的使用要求
•复杂的机械约束
•气流低
•热敏感元件
•低成本,高性能
结论
PARKER CHOMERICS 推出的T-WINGTM散热片解决了硬盘的散热问题,这是一个被一系列复杂的机械约束困难化的问题,包括要求低净空,紧邻热敏元件,有限气流和不同的元件高度等等。 散热设计工程师对T-WINGTM散热片的简单性、低成本和高性能印象深刻。
T-WING散热片的实物图
解决方案
Parker Chomerics推出了了一种定制的T-WINGTM散热片,尺寸约为1.5英寸x 4英寸使用耐高温硅胶压敏粘合剂(PSA)直接贴装在发热的元件上。 使用后初步测试结果显示外壳温度下降了17℃,且对邻近的组件无不利影响。
T-WINGTM的灵活性能够使其紧密地粘附在不同高度的多芯片表面。当元件地总体厚度小于14mils时, 将不存在低净空问题。 从性能和成本的角度来看,该解决方案被证明是理想的选择。
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全部评论(6)
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大王小王 Lv7 2019-05-10不错,收藏。
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duanmaxie Lv8. 研究员 2019-03-21可以
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maomao Lv8. 研究员 2019-03-21不错~
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沉浮 Lv7. 资深专家 2019-03-21不错~~~
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行行摄摄 Lv7. 资深专家 2019-03-21学习一下
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好运常伴吾 Lv8. 研究员 2019-03-21很好
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【技术】一文解析散热器的作用
源阳散热器的种类繁多,所散热的方式不同,分别的用途也不一样,那么散热器的作用是什么呢?本文就让源阳热能为您解答一下。
Parker Chomerics 产品概述
型号- CHO-TOUCH™,CHO-STRAP®,CHO-SEAL®,STREAMSHIELD OMNI-CELL® SHIELD-CELL,T-WING®,CHO-MUTE®,CHO-MASK®,SPRING-LINE®,DURALAN™,CHO-BOND®,CHO-FAB®,THERM-A-GAP™,WIN-SHIELD®,CHO-SORB®,THERM-A-FORM™,CHO-THERM®,THERMFLOW®,CHO-SHRINK®,THERMATTACH®,METALASTIC®,PREMIER™,CHO-FOIL®,CHO-LUBE,SOFT-SHIELD®,CHO-FORM®,POLA®,TECKFILM™,CHO-SHIELD®
【产品】完全固化的可点胶导热填隙凝胶THERM-A-GAP™ GEL 45,具有极高的性价比
Parker Chomerics推出一款完全固化的可点胶导热凝胶THERM-A-GAP™ GEL 45,产品可省去耗时的手工安装,降低安装成本以及为客户减少了制造和采购(物流)上的麻烦。 这些产品无需混合或固化,具有卓越的设计灵活性。为薄或者厚的间隙提供低热阻的填充,兼容于常规散热片•在非常低的压缩力下能够轻松绕曲,减小对组件的应力从而减少组件故障
Thermal Interface Materials
型号- 9025,WIN-SHIELD G,CHO-TOUCH™,CHO-STRAP®,9005,CHO-SEAL®,HO-MUTE 9025,T-WING®,CHO-MUTE®,CHO-MASK®,THERM-A-GAP™ GELS,SPRING-LINE®,DURALAN™,CHO-BOND®,THERM-A-GAP™,WIN-SHIELD®,CHO-SORB®,STREAMSHIELD OMNI-CELL® SHIELD-CELL,DURALAN G XL,THERM-A-FORM™,MESH STRIP,CHO-THERM®,THERMFLOW®,CHO-SHRINK®,DURALAN G,THERMATTACH®,CHO-FAB,METALASTIC®,PREMIER™,CHO-FOIL®,SHIELD WRAP,SOFT-SHIELD®,CHO-LUBE,CHO-FORM®,POLA®,TECKFILM™,CHO-MUTE 9005,CHO-SHIELD®
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【应用】“热翼”型T-WING®系列散热薄片为独立IC提供散热解决方案,支持与不平整表面接近100%粘接
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Parker Chomerics Thermal Interface Materials
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