SMART Modular Announces New Memory Solutions for Data Center Networking Applications
NEWARK, Calif., March 31, 2021 — SMART Modular Technologies, a subsidiary of SMART Global Holdings, Inc., (Nasdaq: SGH), has expanded its support for data center networking applications with the introduction of DuraMemory™ high-density, very low profile DIMMs and Mini-DIMMs for hyper-scale network switching. These products are ideal for maximizing network bandwidth and reliability, which is critical to data center networking requirements.
Network memory dictates the amount of data stored or transferred in switching and routing equipment. Low density, as well as poor quality memory, can disrupt the performance of a network by acting as a bottleneck to data transfer. The rating and attributes of memory can also greatly affect the data center network’s overall efficiency.
Propriety data center networking equipment, such as Network Interface Cards (NICs), routers, and switches have become highly specialized. Very dense compact equipment is being developed, and as 5G rollouts continue, a shift in network design is critical to support 5G service capabilities. Memory features contained in SMART Modular’s new DuraMemory low profile DIMMs and Mini-DIMMs, which include ultra-low latency and high capacities, enabling various networks to connect multiple devices and systems into one, seamless and automated complete system.
SMART Modular’s high-density DuraMemory VLP or ULP DIMMs and Mini-DIMMs are also used in hyper-scale data center networking applications to maximize data center connectivity and throughput. “We see tremendous opportunity in providing our customers with exact-fit networking memory solutions to support all types of data center networking equipment,” stated Arthur Sainio, Director, product marketing for DRAM for SMART Modular Technologies. He concluded, “SMART Modular maintains the highest quality levels to support customers’ mission-critical use-case requirements.”
Key benefits SMART Modular provides to data center networking equipment OEMs:
·End-to-end portfolio of memory products aligned to data center networking requirements
·Data center networking memory design expertise and support
·Long-term product support to OEMs to ensure equipment longevity and serviceability
- |
- +1 赞 0
- 收藏
- 评论 0
本文由Batman转载自SMART,原文标题为:SMART Modular Announces New Memory Solutions for Data Center Networking Applications,本站所有转载文章系出于传递更多信息之目的,且明确注明来源,不希望被转载的媒体或个人可与我们联系,我们将立即进行删除处理。
相关推荐
【部件】SMART新推16GB的DDR5和VLP ECC UDIMM,可最大限度减少占用空间和降低运行功耗
SMART是SGH的一个子公司,也是内存解决方案,固态硬盘和混合存储产品的全球领导者,近日宣布在其刀片式内存VLP模块产品系列中增加新的DDR5 16GB和32GB的VLP ECC UDIMM(矮板ECC无缓存DIMM)。
SMART Modular Expands DuraMemory™ Offerings with Proprietary DIMM Retention Device for Harsh Operating Environments
SMART Modular Technologies has expanded its DuraMemory™ product line with the introduction of SMART ARC™ (Anti-vibration Retention Clamp), a locking retention device designed specifically to secure memory modules used in harsh operating environments that require the utmost stabilization in the field.SMART ARC is compatible with SMART’s line of DuraMemory DRAM products plus it is available for DIMMs and SODIMMs.
【产品】SMART推出数据中心网通设备专用内存模块,大幅提升网络带宽及可靠度,满足大量数据处理需求
SMART Modular世迈科技推出数据中心网通设备专用内存模块,适用于大规模数据中心的网络交换应用,并能大幅提升网络带宽及可靠度,满足数据中心对网通设备的严苛需求,也持续展现耕耘数据中心网络应用市场的决心。
迷你DIMM
描述- SMART Modular Technologies提供的DDR4和DDR3 Mini-DIMM内存模块具有小型化设计,适用于多种应用场景,如网络、电信、工业和存储。这些模块采用额外的电源和接地引脚,提高了在电信、网络和工业应用中的可靠性和信号完整性。与SO-DIMM相比,它们可以节省多达三分之一的板空间,非常适合非常密集的系统主板。
型号- ST1027MU451893SFV,ST1027MU410893HEV,SP1027ML351816MPU,SP1027MV351816SEU,SP5127MR351893SEV,STI2047MU410872SCV,SP5127MR325838NJV,SP2567MU325838NJV,ST1027MR410893SCV,ST1027MU410893SCU,ST1027MR410893SCU,ST1027MU410893SCV,SP1027MV351816NE,SP5127ML351816SEV,SPI1027MV351816MPV,SP1027MV351816MPV,ST1027MU451893MFV,SP5127ML351816NEV,ST4097MU420825MFV,SP5127MV351816SEV,ST1027MU451893NEV,SPI5127ML351816NEV,ST1027MR451893SF,SP5127ML351816NE,SP5127MV351816NEV,ST5127MU451893SFV,SP1027ML351893NEU,SPI5127ML351816SEV,STI1027MU410872SCV,ST2047MR410893HE,ST5127MR451825SFV,SP1027ML351816SEU,SP1027MV351816SE,SP5127MV351816MPV,SPI1027ML351816SEU,ST2047MU420893SAV,ST5126MU451893SFV,ST2047MU410893SCV,ST2047MU410893HEV,SP5127ML351816SE,ST2047MR410893SC,ST1027MR410825SCV
SMART推出小尺寸的DDR4和DDR3 Mini-DIMM存储模组,可用于高速数据传输场合
SMART Modular Technologies的DDR4和DDR3 Mini-DIMM存储模组是小尺寸的存储模组,能够工作在高速数据传输场合。Mini-DIMMs的优势是它们用在广泛的不同行业,比如网络、通讯、工控和存储行业。
特殊DIMM类型产品线
描述- SMART Modular提供多种特殊类型DRAM内存模块,包括VLP、ULP、mini-DIMM、MIP、LRDIMM、XRDIMM和NVDIMM,以满足不同应用需求。这些模块适用于计算、网络、通信、存储、移动和工业市场。产品特点包括高可靠性、低功耗和优化系统性能。SMART Modular还提供Zefr技术,以提升内存可靠性。
【IC】SMART推出DuraMemory™ DDR5 VLP ECC UDIMM记忆体模组,体积及功耗大幅减少
近日, SMART宣布推出16GB和32GB DDR5 VLP ECC UDIMM记忆体模组,为刀锋伺服器专用VLP模组产品添增生力军,可大幅减少占用空间及功耗,满足次世代记忆体应用要求的高度、密度、功耗和性能规格。
SMART Modular Technologies Introduces DDR5 RDIMMs with Conformal Coating for Liquid Immersion Servers
SMART has launched a new line of DDR5 Registered DIMMs (RDIMMs) with conformal coating which are specifically designed for use in liquid immersion servers. This innovative product line combines the superior performance of DDR5 technology with enhanced protection, ensuring reliability and longevity in the most demanding data center environments.
超高可靠性ZeFR™存储器
描述- 该资料介绍了SMART Modular Technologies推出的Zefr Memory技术,旨在提高内存模块的可靠性。Zefr Memory通过特殊工艺处理,将符合行业标准的RDIMM缺陷率从每百万件3000个降低至200个以下,显著提升在高需求应用场景下的稳定性。资料还展示了SMART提供的DDR4和DDR5注册型内存模块(ZDIMMs)的产品规格和应用优势,包括减少停机时间、最大化产量和提高维护效率等。此外,提供了SMART公司的联系方式和版权声明。
型号- SRZHG8RD5648-SP,SRZ1637RD440444-SM,SRZ4G8RD5448-SP,SRZ2047RD410825-SE,SRZ8G8RD5448-SP,SRZ4G8RD5288-SP,SRZ4097RD420825-SC,SRZ8197RD440425-SC,SRZ4097RD440425-SC,SRZAG8RD5848-SB
用于工业应用的SMARTDRAM存储器
描述- SMART Modular Technologies提供适用于工业应用的DRAM内存产品,具备耐极端环境特性。产品包括SODIMM、MIP、VLP和ULP Mini-DIMMs等,支持DDR4-3200至32GB的内存容量。这些内存模块经过严格的测试,可针对高温、振动、湿度和恶劣环境进行特殊加固。SMART还提供针对国防和工业应用的长期产品支持。
采用英特尔®Optane™PMEM DIMM的Kestral™FPGA加速器:数TB的PCIe连接内存,位于DRAM和NAND闪存之间
描述- 该资料介绍了SMART Modular推出的新型PCIe附加卡——Kestral™ FPGA加速器,它利用Intel Optane™ PMem DIMM和Intel FPGA提供内存扩展和加速功能。该产品具有FHHL(全高半长)双插槽设计,支持高达2TB的PCIe Gen4-x16或PCIe Gen3-x16接口内存扩展,并配备ARM A53四核处理器和专用DDR4内存。
型号- STPE62TINA4DM2X,STPE6XXINA4DM2X,STPE61XINA4DM2X
采用Intel®Optane™DIMM的Kestral™FPGA加速器:在DRAM和NAND闪存之间分层的TB级PCIe连接内存
描述- SMART Modular推出了一款名为Kestral™的FPGA加速器,该产品利用Intel® Optane™ DIMMs实现内存扩展和加速。该加速器采用FHHL(全高半长)双插槽设计,支持PCIe Gen3/Gen4 x16接口,配备4个独立通道的DIMM插槽,可容纳高达2TB的Intel Optane™ PMem DIMMs或DDR4 LR DIMMs。Kestral具备Intel Stratix® 10 DX FPGA,支持多种IP,可定义定制解决方案。该产品提供高达2TB的PCIe内存扩展,支持多种内存技术,并可实现算法加速。
型号- STPE6XXINA4DM2X*,STPE61XINA4DM2X*,STPE62TINA4DM2X*
DuraMemory™微型DIMM
描述- SMART Modular Technologies提供的DDR4和DDR3 Mini-DIMM内存模块,具有小型化设计,适用于多种应用,如网络、电信、工业和存储。这些模块具有额外的电源和接地引脚,提高了可靠性和信号完整性,适用于电信、网络和工业应用。与SO-DIMM相比,Mini-DIMM在垂直或22.5°倾斜的插座中使用时,可节省多达三分之一的板空间,非常适合非常密集的系统板。
型号- ST4097MR420825MFU,ST4097MU420825MFV,ST1027MU451893NEV,SPI5127ML351816NEV,SP5127ML351816NE,ST1027MU451893SGV,SP1027ML351816MPU,ST5127MU451893SFV,SP1027ML351893NEU,SP2567MU325838NJV,ST2047MR410893HE,ST5126MU451893SFV,ST2047MR410893SG,ST2047MU420825SCV,ST2047MR420825SCV,ST1027MR410825SGV,SP5127ML351816NEV
电子商城
服务
使用FloTHERM和Smart CFD软件,提供前期热仿真模拟、结构设计调整建议、中期样品测试和后期生产供应的一站式服务,热仿真技术团队专业指导。
实验室地址: 深圳 提交需求>
针对电子系统中的详细传热和流体流动模拟进行优化,可准确分析复杂的两相冷却组件(如热管/均热板),量化利用率,并警告是否干涸。
实验室地址: 深圳 提交需求>
登录 | 立即注册
提交评论