New THERM-A-GAP GEL 75 Thermal Gel Offers High Thermal Conductivity and Reliability
PARKER CHOMERICS has recently released THERM-A-GAP™ GEL 75, a 7.5 W/m-K thermal conductivity, single-component, dispensable thermal interface material. THERM-A-GAP GEL 75 is the latest from the THERM-A-GAP family of dispensable thermal materials from Parker Chomerics to be released to the market.
When applied to a heat-generating component, THERM-A-GAP GEL 75 provides minimal stress and pressure due to its low compression force. It is form stable in horizontal or vertical applications and allows for lower assembly costs when compared to multiple thermal gap pads in higher volume applications.
3x faster flow rate, highest thermal conductivity
THERM-A-GAP GEL 75 represents the highest thermal conductivity dispensable available from Parker Chomerics. With a flow rate of 30 grams per second, it is nearly 3x faster than the next closest performing material in the THERM-A-GAP family.
The gel-like consistency enables superior performance and long-term thermal stability and is designed to be dispensed in applications requiring low compressive forces and minimal thermal resistance for maximal thermal performance.
Superior, reliable performance in the field
Parker Chomerics has conducted a detailed examination of the thermal reliability of this high-performance gap filler after being subjected to long-term environmental aging under dry heat, heat and humidity conditions, and temperature cycling from -40°C to 125°C.
The thermal performance of THERM-A-GAP GEL 75 was examined, and the findings were reported in the THERM-A-GAP GEL 75 Reliability Report TR1104. After being subjected to multiple environmental stress tests, the thermal impedance of the aged samples did not experience a significant increase after any of the treatments studied.
After a 1,000-hour dwell at 125°C, 1,000 hours at 85°C/85% relative humidity, and 1,000 temperature cycles from -40°C to 125°C, there was no statistically significant increase in impedance according to one-way ANOVA with the Tukey method for multiple comparisons.
NASA outgassing results
The National Aeronautics and Space Administration (NASA) criteria for low-volatility materials limits the total mass loss (TML) to 1.0% and collected volatile condensable material (CVCM) to 0.10%. Outgassing results for GEL 75 are 0.18% TML and 0.05% CVCM. Independent laboratory results indicate THERM-A-GAP GEL 75 passes the NASA outgassing criteria for low-volatility material.
Based on these results, THERM-A-GAP GEL 75 demonstrates the ability to withstand long-term aging without a reduction in thermal performance. THERM-A-GAP GEL 75 is best suited for high volume, automated production, specifically found in telecommunication applications, base stations, power supplies, and memory and power modules.
- |
- +1 赞 0
- 收藏
- 评论 0
本文由董慧转载自Park Chomerics,原文标题为:New THERM-A-GAP GEL 75 Thermal Gel Offers High Thermal Conductivity and Reliability,本站所有转载文章系出于传递更多信息之目的,且明确注明来源,不希望被转载的媒体或个人可与我们联系,我们将立即进行删除处理。
相关推荐
QSFP-DD Optical Transceiver Thermal Interface Materials with Greater Density, Greater Heat
High performance QSFP-DD optical modules must use thermal interface materials to help dissipate heat efficiently and effectively to ensure the optimum operating performance, reliability and dependability of the high-speed transceiver. The introduction of QSFP-DD, or Quad Small Form Factor Pluggable Double Density optical modules, have now doubled of the number of high-speed electrical interfaces that the module supports compared with a standard QSFP28 module.
原厂动态 发布时间 : 2021-07-22
满足MIL-STD-810防霉要求,可压制成多种形状的Parker Chomerics(派克固美丽)的导电橡胶
Parker Chomerics(派克固美丽)的导电橡胶是一种具有高耐腐蚀性的EMI电磁屏蔽材料,在很宽的温度范围内具有优良的抗压缩设定特性,连续使用年限长,全部满足MIL-STD-810对防霉的要求,还提供环境或压力密封,可模制、模切、和挤压成多种形状和尺寸,品类丰富多样。推荐:导电橡胶圈CHO-SEAL®S6305和CHO-SEAL®1285系列。
原厂动态 发布时间 : 2019-08-30
导热率达1~7W/mk的Parker Chomerics(派克固美丽)导热界面材料,最快交期4周
Parker Chomerics(派克固美丽)可提供多种功用和规格可选的优质的导热界面材料,如导热凝胶,导热垫片,相变材料,导热绝缘垫,导热硅脂等,导热率达1~7W/mk,厚度为0.5-5mm,最快交期4周,具有高导热,低热阻的特性。
原厂动态 发布时间 : 2019-08-27
Parker Chomerics(派克固美丽)热界面材料(热传导性凝胶/在位灌封材料/润滑脂)选型指南
描述- Parker Chomerics thermal interface material dispensable products are ideal solutions for today’s electronic packages. Thermally conductive, dispensable materials have the ability to cover a variety of gaps and form complex geometries.
型号- T636,T647,T635,T646,CIP 35,GEL 30,T642,TC 50,GEL 25NS,1642,1641,GEL 8010,T630,GEL 75,T650,GEL 45,T660,T670,GEL 37
What is Thermal Pad?
Thermal pads are essential components in modern electronic devices, designed to facilitate efficient heat transfer from heat-generating components to heat sinks or other cooling solutions. Understanding what thermal pads are and their importance can help you choose the right material for your specific application.
技术探讨 发布时间 : 2024-08-03
THERM-A-GAP™ GEL 75 High Performance Fully Cured Dispensable GEL
型号- 65-02-GEL75-0180,65-00-GEL75-0300,THERM-A-GAP GEL 75,THERM-A-GAP™ GEL 75,GEL 75,65-1P-GEL75-2500,65-5P-GEL75-7500,65-02-GEL75-0010,65-02-GEL75-0030
Product Environmental Quality Certification
型号- CHO-SHIELD 571,THERM-A-GAP 569PT,CHO-SEAL 1285,SOFT-SHIELD 3500,SOFT-SHIELD 5000,CHO-SEAL 1401-S,CHO-SEAL V6433,CHO-SEAL 0862,THERMFLOW T725,CEL-XX-5103-XXXX,CHO-SEAL 1278,CHO-SEAL 0860,THERM-A-GAP T652,CHO-SEAL 1291,CHO-SEAL 1290,CHO-FORM 5575,CHO-THERM 1641,CHO-THERM 1646,THERM-A-GAP GEL 40,THERM-A-GAP T654,THERMATTACH T491,CHO-BOND 320,CHO-SEAL 1287,THERM-A-GAP 579KT,CHO-FORM 5560,CHO-SHIELD 596,CHO-MUTE 9000,THERM-A-GAP PAD70TP,SOFT-SHIELD 4850,FPCV-14244,THERM-A-GAP PAD30PN,CHO-FOILCCD,FPCV-13701,THERM-A-GAP F174,CHO-SHIELD 4076,THERMFLOW PC07DM-7,THERM-A-GAP GEL 40NS,CHO-SEAL 1298,CHO-SEAL 6503,CHO-SEAL 6502,CHO-MASK II CMT,CHO-THERM T609,THERM-A-GAP T630,CHO-FORM 5550,THERM-A-GAP T636,CHO-SEAL S6304,THERM-A-GAP G580,THERM-A-GAP T635,CHO-SEAL S6305,CHO-THERM T290,THERM-A-FORM 1641,THERM-A-FORM 1642,THERM-A-GAP G574,CHO-BOND 584,THERM-A-GAP 569PB,THERM-A-GAP G579,CHO-SEAL 1501,THERM-A-GAP PAD30G,THERMFLOW T710,THERM-A-GAP PAD30A,THERMAL GREASE T660,CHO-MUTE 9025,CHO-MUTE 9020,CHO-FORM 5541,CHO-FORM 5542,CHO-SEAL 6372,CHO-SEAL 6371,CHO-SEAL 6370,CHO-LUBE E117,THERM-A-GAP A580,SOFT-SHIELD 1000,THERM-A-GAP G570,THERM-A-GAP PAD60,CHO-FAB CFT,CHO-SEAL 1358,CHO-SEAL 1236,CHO-SEAL 1239,CHO-SEAL L6303,CHO-THERM T500,CHO-SEAL 1250,THERMAL GREASE T650,CHO-FOIL CCD,CHO-FOIL CCE,THERM-A-GAP T174,THERM-A-GAP A574,CHO-FOIL CCH,CHO-FOIL CCJ,CHO-FOIL CCK,THERM-A-GAP A570,THERM-A-GAP A515 RFA,CHO-FORM 5538,THERM-A-PAD-579PN,CHO-MUTE 9005,CHO-SHIELD 1091,THERM-A-GAP PAD60A,THERM-A-GAP A569,CHO-SEAL 1260,CHO-FORM 5526,CHO-FORM 5528,THERM-A-GAP GEL 8010,CHO-BOND 1099,CHO-FORM 5519,THERM-A-GAP 6579,THERM-A-GAP F574,THERM-A-GAP TPS60,THERM-A-GAP 579PN,FPCV-14832,THERM-A-GAP GEL 8017,CHO-BOND 1091,CHO-SIL 1485,CHO-JAC CJ-022-26,THERM-A-GAP 579PB,THERM-A-GAP 579,CHO-SEAL 1273,THERM-A-GAP PAD30,THERMAL GREASE T670,CHO-SIL 1356,CHO-FOIL CAD,THERM-A-GAP T274,CHO-SEAL 1270,CHO-FORM 5513,SOFT-SHIELD 2000,THERM-A-GAP 579PT,CHO-FORM 5515,CHO-SORB,THERM-A-GAP 6569,CHO-BOND 1088,TECKNIT 72-0008,THERM-A-GAP G174,CHO-LUBE4220,CHO-BOND 584-29,CHO-BOND 1083,CHO-SEAL 1265,THERM-A-GAP PAD80,CHO-BOND 1085,CHO-BOND 1086,THERMATTACH T405,CHO-SEAL 6452,CHO-SEAL 6330,THERMATTACH T404,CHO-SHRINK TUBES,CHO-LUBE 4220,CHO-BOND 360-208,CHO-SEAL 2561Y,CHO-FAB CRS,CHO-FORM 5506,THERM-A-GAP GEL 45,CHO-BOND 1076,CHO-BOND 2165,FPCV-13444,CHO-BOND 1077,CHO-SHIELD 608,THERM-A-GAP GELAB,CHO-BOND 1072,CHO-SEAL 1310,CHO-BOND 1073,CHO-SHIELD 604,CHO-BOND 1075,THERMATTACH T418,THERMATTACH T412,THERMATTACH T413,THERMATTACH T414,CHO-SEAL 6460,THERM-A-GAP 575NS,CHO-SEAL S6600,THERM-A-GAP G515 RFA,CHO-STRAP,CHO-BOND 1067,CHO-BOND 1069,THERM-A-GAP PAD70TPF,THERM-A-GAP TC60,THERMATTACH T410,THERMATTACH T411,THERMATTACH T428,CHO-SHIELD 2056,CHO-SHIELD 4916,CHO-SHIELD 4914,CHO-BOND 1055,CHO-BOND 1056,CHO-THERM T444,CHO-THERM T441,THERM-A-GAP TC50,THERM-A-FORM CIP35,CHO-SEAL 1215,CHO-SHIELD 2052,CHO-SEAL 1217,CHO-BOND 1053,CHO-SEAL 1212,CHO-SEAL 1350,THERM-A-FORM T644,THERM-A-FORM T646,THERM-A-GAP GEL 30,CHO-SHIELD 2044,THERM-A-FORM T647,CHO-SHIELD 4900,CHO-SHRINK BOOT,THERMFLOW T310,THERM-A-GAP G974,CHO-SHIELD 2040,CHO-SHIELD 610,CHO-SEAL 2557,THERMFLOW T557,CHO-SEAL 1221,CHO-SEAL 1224,THERM-A-FORM T642,THERMFLOW T558,CHO-BOND 360-20,SOFT-SHIELD 3700,CHO-SEAL 2542,THERM-A-FORM T644G,THERM-A-GAP T580,CHO-BOND 1029,THERM-A-GAP GEL20,THERM-A-GAP T630G,CHO-BOND 1035,CHO-BOND 1038,CHO-BOND 4669,CHO-BOND 592,THERMFLOW T766,CHO-BOND 1030,CHO-BOND 4660,THERM-A-GAP GEL 4517,THERM-A-GAP T574,CHO-JAC,CHO-THERM 1680,THERM-A-GAP T570,SOFT-SHIELD 4008,SOFT-SHIELD 4800,CHO-BOND 1018,CHO-BOND 1019,CHO-THERM 1684,THERM-A-GAP A174,SOFT-SHIELD 4004,SOFT-SHIELD 4002,THERM-A-GAP T579,SOFT-SHIELD 4000,SOFT-SHIELD I,TECKNIT 72-08116,CHO-BOND 1024,CHO-BOND 1027,CHO-SEAL 1401,THERM-A-GAP A579,THERMFLOW T777,THERM-A-GAP TPS60G,CHO-SEAL 6313,TECKNIT 0005,CHO-THERM 1671,TECKNIT 0002,CHO-SIL 1401,THERM-A-GAP GEL60HF,CH0-SEAL 0860,CHO-THERM 1674,CHO-THERM 1679,THERM-A-GAP T569,CHO-THERM 1677,THERM-A-GAP G274,CHO-THERM 1678,CHO-BOND 1016,THERM-A-GAP GEL37,CHO-SEAL 6308,THERM-A-GAP 976,THERM-A-GAP PAD30KT,CHO-SEAL 6307,CHO-SEAL 1651,CHO-SHIELD 2002,THERM-A-GAP GEL 75,CHO-SHIELD 2003,THERM-A-GAP 974,CHO-SHIELD 2001,CHO-THERM 1661,THERM-A-GAP A274,THERM-A--FORM CIP35,CHO-BOND 1121,THERM-A-GAP HCS,CHO-SEAL1285,CHO-SEAL 6435
THERMFLOW® T777 Low Thermal Resistance THERMFLOW® Phase Change Pad Polymer Solder Hybrid (PSH) Thermal Interface Material
型号- T725,T558,T777,T766,T710,T557,THERMFLOW® T777,WW-XX-YYYY-ZZZZ
How to Protect Robotic Surgery Systems from Electromagnetic Interference (EMI)
With proven solutions in EMI shielding and critical thermal management, Parker Chomerics gives you a wealth of integrated, multi-technology systems and components that meet or exceed your specifications and expectations.
应用方案 发布时间 : 2021-07-22
21-655-0350 Thermal Interface Material Synthetic Graphite
型号- 21-660-0350,21-655-0350-YYYY,21-655-0350,21-660-0350 SERIES
【应用】单组分导热凝胶THERM-A-GAP GEL 75用于反无人机雷达,助力解决FPGA芯片散热问题
THERM-A-GAP GEL 75是一款兼具高导热、低挥发、易操作、易返修、高绝缘、低应力、耐温好、可靠性高等一系列应用优势的单组分导热凝胶,其填充于反无人机雷达FPGA芯片与散热模组之间,可将FPGA芯片的温升有效控制在15℃以内,满足散热设计目标。
应用方案 发布时间 : 2022-12-20
Parker Chomerics(派克固美丽)Thermm-A-Gap™TPS60S高导热间隙填充垫数据手册
描述- Thermal Putty TPS60 is a thermal interface material with exceptional thermal conductivity and very low deflection force designed for effective heat dissipation in telecommmunication.
型号- TPS60X,61-10-1015-TPS60X,61-04-1015-TPS60X,TPS60F,TPS60G,TPS60,61-07-1015-TPS60X,61-08-1015-TPS60X,61-04-1015-TPS60G,THERM-A-GAP™ TPS60,61-16-1015-TPS60X,61-06-1015-TPS60X,61-20-1015-TPS60X,61-20-1015-TPS60XC
Synthetic Graphite 6-55 Series Thermal Interface Material
型号- 21-655-XXXX-0516,21-655-XXXX-0506,21-655-XXXX-0517,6-55-0150,21-655-XXXX-0569,21-655-XXXX-0514,21-655-XXXX-0515,6-55-0350,21-655-XXXX-0507,21-655-XXXX-0518,6-55-0100,21-655-XXXX-0519,6-55-0200,6-55-XXXX-YYYY,6-55,21-655-XXXX-0581,21-655-XXXX-0582,21-655-XXXX-0512,21-655-XXXX-0513,6-55 SERIES,21-655-XXXX-0510,6-55-0070,21-655-XXXX-0511
Parker Chomerics(派克固美丽)TPS55高导热间隙填料热腻子数据手册
描述- Thermal Putty TPS55 is a thermal interface material with high thermal conductivity and very low deflection force designed for effective heat dissipation in telecommmunication.
型号- 61-20-1015-TPS55X,61-06-1015-TPS55F,TPS55X,TPS55F,61-04-1015-TPS55X,TPS55,61-06-1015-TPS55X,61-08-1015-TPS55X,61-16-1015-TPS55X,THERMAL PUTTY TPS55,61-20-1015-TPS55,61-04-1015-TPS55F,61-10-1015-TPS55X,61-07-1015-TPS55X
电子商城
服务
使用FloTHERM和Smart CFD软件,提供前期热仿真模拟、结构设计调整建议、中期样品测试和后期生产供应的一站式服务,热仿真技术团队专业指导。
实验室地址: 深圳 提交需求>
登录 | 立即注册
提交评论