DDR5 vs DDR4: Is DDR5 finally necessary?

2023-09-23 ATP Blogs

Double Data Rate 5 (DDR5), the next-generation random-access memory (RAM) specification, is poised to exceed DDR4 in every way.


DDR5 promises faster performance, higher memory bandwidth, higher densities, and a new power management structure that delivers better power efficiency. All of these advantages, and more, are expected to meet the ever-growing memory needs of present and future applications.


Both DDR4 and DDR5 dual-inline memory modules (DIMMs) have 288 pins, but with DDR5’s higher bandwidth, this means it can transmit data faster. While the pin count is the same, DDR5 DIMMs will not fit in DDR4 sockets as the alignment key is located differently and the pinouts have been changed to accommodate the new features.

                                                                     

DDR5 vs. DDR4 Alignment Keys

 

DDR5 Advantages Over DDR4

 

DDR5 vs. DDR4 Quick Comparison

 

Memory Bandwidth.

This refers to the theoretical maximum amount of data that can be transmitted (read/written) within a given time. Memory bandwidth is expressed in gigabits per second (Gbps). DDR5 memory bandwidth is initially at 4.8 Gbps per pin, compared with DDR4’s 3.2 Gbps. Future versions are expected to double DDR4’s, going up to a maximum of 6.4 Gbps.


Frequency / Transfer Rate.

Memory frequency refers to the number of commands or transfer operations that the memory module can handle per second. It is typically expressed in megahertz (MHz), but some manufacturers use express this in mega transfers per second (MT/s). The number follows the DDR version, so a DDR5-4800 DIMM, for example, has a frequency of 4800 MHz (or 4800 MT/s).


DDR4 frequency ranges from 1866 to 3200 MHz, while DDR5 ranges from 4800 to 6400 MHz initially, but may go as high as 8400 MHz.


Memory Density.

DDR4 maximum density is 16 Gb per die, so with 16 dies, this translates to 256 Gbit or a total of 32 GB. DDR5, in comparison, has 64 Gb per die, translating to 1024 Gbit or a total of 128 GB – this is 4X that of DDR4, enabling higher-capacity DIMMS!


Burst Length

This is the amount of data, which is input/output based on a single read/write command in DRAM. DDR5 doubles DDR4 burst length from 8 to 16, thus increasing the read/write efficiency.


Power Management and Consumption

The first power management IC (PMIC) on DIMM is introduced in DDR5. PMIC performs local voltage regulation on the module. Historically, voltage regulation has been done on the motherboard. PMIC on the module allows additional features such as threshold protection, error injection capabilities, programmable power-on sequence, and power management features (Source: Micron). DDR5's lower voltage of 1.1V compared with DDR4's 1.2V further reduces power consumption.

 

Summary: Important Spec Enhancements

The following table summarizes important enhancements of DDR5 from DDR4.

* VDD: Stands for Voltage Drain, which is the drain power voltage. * PMIC: Power Management Integrated Circuit


ATP Market Outlook

While many module houses started sampling 1st Gen. DDR5 to customers in 2021,the price gap at the functional level to justify the adoption for DDR5 over DDR4 is too wide to consider in ATP’s view.


The following table shows that in the early stage, the price gap between DDR4 and DDR5 is over 50%. The transition may be slower than expected, but adoption is gaining traction. DDR5 is expected to become the dominant memory in the coming years as demand for faster memory with greater capacity and consuming less power is expected to expand and will not slow down anytime soon.


ATP is expecting significant market growth when processors and platforms supporting DDR5 become prevalent. With the release of Intel’s 12th generation Core hybrid processors supporting both DDR4 and DDR5, adoption is expected to increase steadily, even though motherboards will support only one or the other.

DDR4 vs. DDR5 Price Gap Comparison


Insider Tips on Time-to-Market for DDR5

  • Price is key. Future die shrink and optimizer will lead to a better commercial situation for DDR5 adoption.

  • ATP is projecting that the DDR5 ecosystem will start building up within the first half of 2022 and new products will roll out.

  • While first usage will be in consumer applications, contract manufacturers (CMs) and electronic manufacturing services (EMS) will soon develop relevant platforms initially for approved vendors list (AVL).

  • By 2023, better adoption is expected, and speed will upgrade to 5600 MT/s. More new product introductions will focus on DDR5 and the price gap with DDR4 narrows down to 15-20%.

  • Finally, 2024 will be sweet spot for DDR5 products.The following table provides a summary of the DDR5 time frame.

DDR5 Time Frame

ATP Electronics is committed to meeting the most rigid memory requirements of varied industries. The next-generation DDR5 memory modules are expected to deliver performance and reliability improvements over the previous generation, especially for critical computing applications.



授权代理商:世强先进(深圳)科技股份有限公司
技术资料,数据手册,3D模型库,原理图,PCB封装文件,选型指南来源平台:世强硬创平台www.sekorm.com
现货商城,价格查询,交期查询,订货,现货采购,在线购买,样品申请渠道:世强硬创平台电子商城www.sekorm.com/supply/
概念,方案,设计,选型,BOM优化,FAE技术支持,样品,加工定制,测试,量产供应服务提供:世强硬创平台www.sekorm.com
集成电路,电子元件,电子材料,电气自动化,电机,仪器全品类供应:世强硬创平台www.sekorm.com
  • +1 赞 0
  • 收藏
  • 评论 0

本文由涂抹转载自ATP Blogs,原文标题为:Is DDR5 finally necessary?,本站所有转载文章系出于传递更多信息之目的,且明确注明来源,不希望被转载的媒体或个人可与我们联系,我们将立即进行删除处理。

相关研发服务和供应服务

评论

   |   

提交评论

全部评论(0

暂无评论

相关推荐

【技术】解析DDR4与DDR3模块的差异和优势

​ATP ELECTRONICS第四代双倍数据速率(DDR4)是一种内存标准,旨在更好,更快,更可靠地替代DDR3。本文介绍DDR4与DDR3模块相比的差异和优势。

2023-01-01 -  技术探讨 代理服务 技术支持 批量订货

The Important Role of DRAM in the Internet of Things

DRAM as a Key Component in Data Processing. ATP DRAM products are capable of meeting the escalating memory requirements of the IoT/IIoT age. Designed, tested, validated and built to exacting industry standards, these modules are built to perform dependably for a long time, delivering trustworthy performance that translates to high return on investment and low total cost of ownership.

2023-09-05 -  技术探讨 代理服务 技术支持 批量订货

The Advantages of High-Density VLP RDIMMs for Edge/5G/IIoT Applications

DDR4 remains the essential memory standard even in the face of emerging advances in edge, 5G, and IIoT technologies. ATP continues to improve upon its DDR4 offerings with its new higher-density VLP RDIMMs. Data generation and processing will remain unabated in the coming years, and the new 64 GB VLP RDIMMs are poised to tackle the faster, more intelligent, memory-intensive future.

2023-11-01 -  技术探讨 代理服务 技术支持 批量订货

【经验】什么是常见内存错误类型?ECC DIMM如何工作?

损坏的主内存可能会因性能下降或硬件崩溃而中断业务运营,从而导致代价高昂的停机时间。动态随机存取存储器(DRAM)模块通常具有解决存储器错误的内置机制。这篇文章回答了有关计算机内存错误的最常见问题,以帮助您确保关键任务系统中安装的DRAM的高实用性和最大的可靠性。ATP 可提供软错误可纠错的DRAM产品。

2020-01-05 -  设计经验 代理服务 技术支持 批量订货

Momentum DRAM系列:DDR4专业存储和内存解决方案的全球领导者

描述- 该资料介绍了ATP电子公司的Momentum DDR4内存模块系列。这些模块提供8GB至32GB的密度,最大带宽为3200MT/s(DDR4),采用1.2V电压标准,具有低功耗和高数据传输速率的特点。它们符合JEDEC标准,并利用高级DRAM芯片提供高可靠性和兼容性。适用于网络存储系统、嵌入式系统、边缘人工智能、工业个人电脑和零售与数字标牌等领域。

型号- R48G00SD328ACSC,R416G0SD3282CSC,R416G0UD328BCSC,R432G0SD3282ASC,R48G00UD328ACSC,R432G0UD328BASC

082024  - ATP  - 数据手册  - v1 代理服务 技术支持 批量订货

【选型】DDR4与DDR3模块相比的差异和优势

ATP ELECTRONICS第四代双倍数据速率(DDR4)是一种内存标准,旨在更好,更快,更可靠地替代DDR3。DDR4具有288个引脚,而DDR3具有240个引脚。DDR4 SO-DIMM具有260个引脚,而不是DDR3中的204个引脚。本文还介绍了其他DDR4与上一代模块相比的差异和优势。

2019-12-10 -  器件选型 代理服务 技术支持 批量订货

ATP(华腾国际)DRAM存储模块和NAND闪存产品选型指南(英文)

目录- Company Profile    Segment Challenges and Solutions    Thermal Solutions    Endurance Solutions    Security Solutions    CFexpress & USB 3.0    Value Line SSDs    DDR5    DRAM SOLUTIONS    FLASH SOLUTIONS    Flash Products Naming Rule    Solutions & Technologies    Flash Technology Overview table    Complete Flash Spec Overview & Product Dimensions   

型号- A750PI,E650SC SERIES,S600SC,B800PI,S750 SERIES,S600SI,S600SCA,E750PC SERIES,B600SC,N700PC,S700SC,E650SC,A750 SERIES,E600VC,S800PI,A750PI SERIES,I800PI,A600VC,A650SI,A650SC,N700 SERIES,S650SI,N750,N750PI,A800PI,A700PI,N700SI,N650 SERIES,E600SAA,N700SC,A750,N600SC,A600VC SERIES,E600SA,E650SI,E650SI SERIES,N750 SERIES,E700PIA,TR-03153,N600SI,S650,S650SC,E700PAA,N650SIA,E600SI,B600SC SERIES,S750SC,S600SIA,I700SC,N650SI,N600VI,E600SIA,E750PI,N650SC,N750PI SERIES,N600VC,I600SC,E750PC,S700PI,A650 SERIES,N650,N600 SERIES,N600VC SERIES,S650 SERIES,A650,AES-256,E700PI,A600SI,E750PI SERIES,N700PI,E700PA,S750,S750PI,E700PC,A600SC

012023  - ATP  - 选型指南  - v1.0 代理服务 技术支持 批量订货

提供I-TEMP/C-TEMP可操作型号的无DRAM超值系列固态硬盘

描述- 该资料介绍了ATP Electronics的Value Line固态硬盘(SSD)系列,包括N600Vi/Vc和A600Vi/Vc两款产品。这些SSD专为工业/嵌入式应用设计,提供可靠的性能、多种容量选项和长期供应承诺。它们采用无DRAM配置,以降低功耗和热量产生。产品适用于读密集型或读写混合型应用,如网络服务器、盒式PC、自助服务亭/销售点系统(POS)和其他需要可靠性和低成本投资的工业/嵌入式启动驱动器。

型号- A600VC SERIES,N600VI,A600VI,A600VI SERIES,A600VC,N600VC SERIES,N600VC,N600VI SERIES

2024/7/23  - ATP  - 数据手册 代理服务 技术支持 批量订货

国产的DDR3或DDR4有没有8Gb或者16Gb的,请给个厂家和具体型号?

目前世强代理的国产品牌ATP,有DDR3内存条,但不是存储芯片,存储芯片,ALLIANCE这边有,DDR3,1.5V的只有4G的,如AS4C256M16D3B-12BCN;DDR3L,1.35V的有8G的如:AS4C512M16D3L-12BxN,AS4C1G8MD3L-12BCN。

2019-12-24 -  技术问答

【经验】DRAM的可靠性受什么因素影响?ATP DRAM为何具备高可靠性?

ATP的DRAM模块经过两个级别的测试,以确保最大的可靠性:1、先进的IC级集成电路测试;2、增强的模块水平测试:老化测试(TDBI)和自动测试设备(ATE)确保模块达到甚至超过合格参数。同时具有工业额定温度,采用密封涂层,使用使用抗硫电阻器(基于项目)和厚度为30µm的金手指镀层。

2019-12-12 -  设计经验 代理服务 技术支持 批量订货

ATP(华腾国际)固态硬盘选型指南

描述- Since 1991, we have consistently distinguished ourselves as one of the world’s leading original equipment manufacturers (OEM) of high-performance, high-quality and high-endurance NAND flash products and DRAM modules.

型号- A750PI,S600SC,B800PI,S750 SERIES,S600SI,B600SC,N700PC,A750 SERIES,E650SC,N601,N651SI,A600VI,S800PI,E600VC,I800PI,A600VC,A650SI,A650SC,N651SC,N750,S650SI,A600VI SERIES,N750PI,N651SIE,A800PI,N601 SERIES,A700PI,N651SIA,N650 SERIES,E600SAA,A750,A600VC SERIES,N600SC,E600SA,E650SI,N750 SERIES,E700PIA,N600SI,S650,S650SC,N651SI SERIES,E700PAA,B600SC SERIES,E600SI,N600VI SERIES,I700SC,N600VI,N650SI,E600SIA,N650SC,E750PI,N600VC,I600SC,E750PC,N651,S700PI,A650 SERIES,N650,N751PI,S700PC,N600VC SERIES,N651 SERIES,S650 SERIES,A650,N601SC,S750PC,E700PI,A600SI,N700PI,E700PA,S750,S750PI,E700PC,N651SCE,A600SC

022024  - ATP  - 选型指南  - v1.0 代理服务 技术支持 批量订货

ATP(华腾国际)DRAM存储模块和NAND闪存产品选型指南(中文)

目录- 公司简介    细分市场挑战和解决方案    热管理解决方案    TSE闪存解决方案    DRAM解决方案    闪存解决方案    闪存解决方案-固态驱动器和模块    闪存解决方案-存储卡    闪存解决方案-托管NAND    闪存产品命名规则    闪存规范概述和产品尺寸   

型号- A750PI,S600SC,N750PI系列,B800PI,S750 SERIES,S600SI,S600SCA,B600SC,N700PC,S700SC,N600,E650SC,E750,E750PC系列,E600VC,S800PI,I800PI,E750 SERIES,A600VC,A650SI,N600系列,A650SC,N700 SERIES,S650SI,N750,N750PI,A800PI,A700PI,N700SI,E600SAA,N700SC,A750,N600SC,A600VC SERIES,E600SA,E650SI,E700PIA,N600SI,S650,S650SC,E700PAA,N600VC系列,N650系列,N650SIA,N750系列,E600SI,S750系列,E650,N700,S750SC,S600SIA,I700SC,N650SI,N600VI,E650SI系列,E600SIA,E650SC系列,E750PI,N650SC,S650系列,N600VC,I600SC,E750PC,A600VC系列,A650系列,S700PI,N700系列,N650,N600 SERIES,N600VC SERIES,A750PI系列,S650 SERIES,A650,E700PI,E750PI系列,A600SI,N700PI,A750系列,E700PA,E650 SERIES,S750,S750PI,E700PC,A600SC

012023  - ATP  - 选型指南  - v1.0 代理服务 技术支持 批量订货

ATP Exhibits at Embedded World 2024

Participants should not miss a visit to ATP’s Booth in Hall 1-210, where ATP once again demonstrates its commitment to redefine memory and data storage reliability, scalability, and efficiency. Attendees to Embedded World 2024 can expect to see a new breed of flash storage solutions with ATP’s 176-layer NAND flash innovation, industrial enterprise-readiness for Edge computing and artificial intelligence, and latest DDR5-5600 memory offerings.

2024-03-29 -  原厂动态 代理服务 技术支持 批量订货

用于Intel®Xeon®可扩展和第8代Intel®Core的ATP DDR4-2666模块™ 处理器

描述- ATP Electronics推出针对英特尔至强可扩展处理器和第八代英特尔酷睿处理器的DDR4-2666内存模块,旨在提升企业级计算性能。这些模块支持高密度、大规模内存密集型工作负载,提供高速数据传输速率,同时实现低功耗,有助于降低系统温度和能源成本。产品线包括RDIMM、ECC UDIMM和ECC SODIMM,支持不同容量和电压配置,满足未来扩展需求。

型号- DDR4-2666

2017/12/21  - ATP  - 技术文档 代理服务 技术支持 批量订货
展开更多

电子商城

查看更多

品牌:ATP

品类:DDR4

价格:¥1,094.4382

现货: 2

品牌:ATP

品类:DDR3

价格:¥293.6538

现货: 2

品牌:ATP

品类:DDR3

价格:¥502.4086

现货: 2

品牌:ATP

品类:DDR3

价格:¥238.0711

现货: 2

品牌:ATP

品类:DDR3

价格:¥479.2902

现货: 2

品牌:ATP

品类:DDR3

价格:¥230.3977

现货: 2

品牌:ATP

品类:DDR4

价格:¥597.4403

现货: 2

品牌:ATP

品类:DDR3

价格:¥564.1891

现货: 2

品牌:ATP

品类:DDR3

价格:¥285.9804

现货: 2

品牌:ATP

品类:DDR3

价格:¥261.9765

现货: 2

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

现货市场

查看更多

品牌:TE connectivity

品类:连接器

价格:¥1.9300

现货:11,386

品牌:华邦电子

品类:存储IC

价格:¥4.5000

现货:10,970

品牌:MICRON

品类:芯片

价格:¥58.3110

现货:9,471

品牌:SKhynix

品类:随机存储器

价格:¥43.2169

现货:6,720

品牌:西安紫光国芯

品类:DRAM

价格:¥25.0100

现货:4,344

品牌:MICRON

品类:芯片

价格:¥45.5487

现货:3,365

品牌:MICRON

品类:IC

价格:¥31.0906

现货:1,680

品牌:MICRON

品类:芯片

价格:¥80.2689

现货:1,278

品牌:FORESEE

品类:NAND Flash

价格:¥17.3000

现货:1,080

品牌:ISSI

品类:IC

价格:¥12.8840

现货:1,080

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

品牌:

品类:

价格:

现货:

服务

查看更多

ATP半导体冷板制冷器定制

可定制ATP TE Cooler的冷却功率:40~200W;运行电压:12/24/48V(DC);控温精度:≤±0.1℃; 尺寸:冷面:20*20~500*300;热面:60*60~540*400 (长*宽;单位mm)。

最小起订量: 1 提交需求>

查看更多

授权代理品牌:接插件及结构件

查看更多

授权代理品牌:部件、组件及配件

查看更多

授权代理品牌:电源及模块

查看更多

授权代理品牌:电子材料

查看更多

授权代理品牌:仪器仪表及测试配组件

查看更多

授权代理品牌:电工工具及材料

查看更多

授权代理品牌:机械电子元件

查看更多

授权代理品牌:加工与定制

世强和原厂的技术专家将在一个工作日内解答,帮助您快速完成研发及采购。
我要提问

954668/400-830-1766(工作日 9:00-18:00)

service@sekorm.com

研发客服
商务客服
服务热线

联系我们

954668/400-830-1766(工作日 9:00-18:00)

service@sekorm.com

投诉与建议

E-mail:claim@sekorm.com

商务合作

E-mail:contact@sekorm.com

收藏
收藏当前页面