Brite Semiconductor Now Provides a Total Solution of xSPI Controller and PHY for the Advanced Memory and SPI Device
Shanghai, China—Aug.5, 2022—Brite Semiconductor (“Brite”), a leading custom ASIC & IP provider, today announced providing xSPI/HyperbusTM/XcellaTM memory (Flash, PSRAM, MRAM…) controller and PHY solution for custom SoC. This solution is verified using memories from memory manufacturers such as GigaDevice, APMemory, Cypress (Infineon), Micron, Macronix, etc., which can support customers to develop better products faster in different fields.
The expanded Serial Peripheral Interface (xSPI) JESD251 standard, ratified by JEDEC in July 2018, defines a high-data throughput, serial interface for memory. It provides high data throughput, and low pin count and is primarily for use in computing, automotive, Internet of Things (IoT), embedded systems, and mobile systems, between host processing and peripheral devices. The xSPI electrical interface can deliver up to 400MT/s raw data throughput. It is mainly for nonvolatile memory devices for example NOR flashes and NAND flash, and a large number of memory vendors adopt it for PSRAM (Pseudo SRAM) or MRAM (Magnetic RAM). It is extensible for a higher data rate based on either a high data rate per bit or a wider data path, achieving 800MT/s.
Brite Semiconductor now can provide a total solution of xSPI controller and PHY for the advanced memory and also legacy Octal SPI device, QSPI device, and SPI device. Brite Semiconductor adopts auto-flow-control technology to minimize the FIFO/SRAM utilization. Also, another innovative feedback-sampling technology is used to increase the data rate which doesn’t have a DS, achieving a maximum of 400MT/s in 8D mode without DS. The solution has the following features:
Support Flash, PSRAM, and MRAM using SPI protocol
Support Single/Dual/Quad/Octal SDR/DTR(DDR) SPI
Support xSPI/HyperbusTM/XcellaTM specification
Support xSPI profile1 and profile2 (HyperbusTM)
Support XIP (eXecute-In-Place) for fast boot
Support AXI burst type INCR/WRAP and Fixed (single beat)
Support AXI data width 32/64/128… bit
Support AXI strobe width 4/8/16... bit
Support AXI maximum burst length of 256
Support AXI outstanding command, configurable outstanding capability
Support maximum 4 CSn
Support 3 Bytes or 4 Bytes address
Support single-ended or differential clock
Support with/without DS, no performance degradation without DS
Three clock domains: APB, AXI, xSPI clock
xSPI clock maximum frequency 200Mhz
Full digital PHY, 1x clock, small area, over-sampling is unnecessary
Maximum data rate 400MT/s (DDR, DTR) or 200MT/s (SDR)
Support arbitrary commands through the APB register interface (READ SFDP, ERASE, etc.)
Programmable READ/WRITE command code
Support 2x dummy cycles (extensible dummy cycles)
Note: HyperbusTM is a trademark of Cypress(Infineon), and XcellaTM is a trademark of Micron.
"There is a greater demand for high throughput and low pin count for Industrial IoT, Automotive, and Edge AI applications, the emergence of xSPI memory can meet such requirement,” said Yadong Liu, VP of Engineering at Brite Semiconductor. “In addition, Brite Semiconductor expands the DDR technologies to xSPI, adopting auto-flow-control and feedback-sampling technologies to achieve low area and high data rate, then provides the total solution of xSPI memory controller for the custom SoC."
- |
- +1 赞 0
- 收藏
- 评论 0
本文由一二没有三转载自Brite Semiconductor News,原文标题为:Brite Semiconductor provides xSPI/Hyperbus™/Xcella™ controller and PHY total solution,本站所有转载文章系出于传递更多信息之目的,且明确注明来源,不希望被转载的媒体或个人可与我们联系,我们将立即进行删除处理。
相关研发服务和供应服务
相关推荐
灿芯半导体与SaberTek合作开发WiSUN 和 802.11ah低功耗收发器芯片
灿芯半导体获得SaberTek公司授权,采用SBR6201 收发器 IP开发高性能、低成本的无线智能公用设施网络(Wi-SUN)和802.11ah射频芯片。所有主要的无线射频通信参数都是可编程的,支持高线性模式或者低功耗模式的动态配置,并且接收通路(RX)具有很大的动态范围和高灵敏度。
华进与灿芯半导体联手打造新一代SoC和SiP解决方案
华进与灿芯半导体双方在高性能倒装芯片球栅格阵列(Flip Chip Ball Grid Array,FCBGA)和高密度三维系统级封装(3D-SiP,包括TSV)等创新型系统级封装解决方案展开全面合作,旨在通过芯片设计、封装设计与仿真、先进工艺开发等方面的紧密结合,以及IC与封装的系统协同设计和整体优化,为终端客户实现最具竞争力的产品,实现多方共赢。
灿芯半导体多速率Serdes IP方案,具有优异性能、面积和功耗
灿芯半导体为客户提供1.25-12.5Gbps多速率SERDES IP方案。该方案平滑地集成了多SERDES通路,具有同级产品中最优的性能、面积和功耗。可编译的PHY可以支持众多主流接口。
灿芯半导体上线芯片设计/流片/封装服务
灿芯半导体的芯片设计、流片、封装服务已于8月上线平台,并支持IP采购和定制化服务。用户可以在平台定制14nm先进工艺的芯片、提交流片生产与对应的封测服务需求、采购灿芯自主开发的IP,包含YouPHY/YouRF/YouSiP/YouAnalog/YouIO/YouSecure/YouCrypto等七大系列,及其第三方合作伙伴的IP,有特殊需求的IP也可以进行定制。
Selection Guide for Automotive Relays
When selecting automotive relays, analysis and research can be carried out item by item according to the following points: shape and installation method, input parameters, output parameters, environmental conditions, electromagnetic compatibility, installation and use requirements.
【产品】灿芯半导体新推出xSPI/Hyperbus™/Xcella™控制器和PHY整体解决方案
日前,灿芯半导体日前宣布推出xSPI/Hyperbus™/Xcella™存储器(闪存、PSRAM、MRAM 等)的控制器和PHY解决方案,适用于客制化SoC;采用自动流量控制和反馈采样技术等创新技术来达到小面积和高速率。
灿芯半导体发布通用高性能小数分频锁相环IP及相关解决方案,支持24bits高精度小数分频
灿芯半导体(上海)股份有限公司宣布成功研发出一款通用高性能小数分频锁相环(fractional-N PLL)IP,支持24bits高精度小数分频,最高输出频率4.5Ghz,另外还支持扩频时钟(SSC)功能,可以为客户提供多功能的小数分频 PLL解决方案。
灿芯半导体USB 2.0 OTG PHY通过USB-IF的认证
灿芯半导体基于0.11微米工艺平台而开发的USB 2.0物理层设计(PHY)已通过USB-IF的高速产品测试程序,并取得了USB-IF的高速产品商标 。该USB 2.0物理层设计同时支持器件和主机应用的On-The-Go(OTG)规范,可以用于所有需要USB 2.0的相关产品,比如实现数据存储的桥应用程序接口,以及移动手持设备的SoC整合等。
灿芯半导体推出由USB控制器和PHY构成的USB IP完整解决方案,助力系统制造商设计高质量的ASIC/SoC产品
2022年9月9日,一站式定制芯片及IP供应商——灿芯半导体日前宣布推出可用于ASIC/SoC的USB IP完整解决方案。该解决方案由一系列USB控制器和PHY构成,可以助力系统制造商、个人电脑原始设备制造商和IC公司等设计高质量的ASIC/SoC产品。
Sierra Wireless Announces AirLink® RX55 Cellular Router Optimized for the Rapidly Expanding Industrial IoT
A new ultra-low-powered cellular router solution powered by AirLink OS enables next-generation networking capabilities for industry 4.0 applications. Sierra Wireless’ AirLink® RX55 LTE cellular router solution is expected to be available commercially in Q4 of 2022.
采用灿芯半导体SoC平台解决方案的智能电表芯片量产,为客户提供更加可靠、稳定及高性价比的优质解决方案
采用灿芯SoC平台解决方案以及40nm及0.13μm工艺研发、可实现RF和PLC通信的两颗芯片进入量产阶段,展示了灿芯不断为客户提供更加可靠、稳定及高性价比的优质解决方案和服务的承诺。
Horizon Journey 5 automotive processor obtains ASIL-B certification
Horizon‘s high-performance Journey 5 automotive processor received its ASIL-B certificate from SGS TUV SAAR on August 19, 2022. Journey 5 is currently used by multiple customers in single, dual, or quad-chip configurations and will be in production in Q4-2022.
Automotive chip supplier Horizon Robotics receives strategic investment from Chery Automobile
Horizon Robotics announced that it has received a strategic investment from Chinese auto manufacturer Chery Automobile and has completed the funding settlement. The funds will be used for the R&D and mass production of Horizon Robotics’ new smart automotive chips.
灿芯半导体DDR4 IP在40纳米工艺上实现了2400 Mbps速率
灿芯半导体YouPHY-DDR系列DDR4,DDR3/LPDDR3子系统通过了40纳米低漏电工艺流片验证。根据实测数据,YouPHY-DDR子系统为客户带来了低功耗、小面积的高速DDR方案,其传输速率成功地在DDR4标准上实现了2400 Mbps,在DDR3/LPDDR3标准上实现了2133 Mbps。
登录 | 立即注册
提交评论