Smiths Interconnect Has Invested in A Comprehensive Range of Environmental Tests at Dundee Facility to Replicate Deep Space Environment
The equipment required to simulate the rigors of launch and operational use in deep space, however, requires significant investment in facilities and highly skilled labor that most companies do not have. Companies may either have to rely on external test services, adding to costs, extending development and delivery schedules; or attempting to negotiate away certain critical test needs.
Many certification organizations and government agencies require impartial third-party laboratories to perform these tests for integrity assurance. Smiths Interconnect, a global supplier of cutting-edge connectivity solutions, has invested in a comprehensive range of environmental tests at their Dundee facility. This offers an important capability to customers not prepared to negotiate on fundamental reliability and insist on demonstrable compliance.
Dundee site qualification and test laboratory general purpose test area.
Types of environmental tests
Critical flight hardware malfunctioning when exposed to severe environmental conditions can lead to system degradation and catastrophic mission failure. For unmanned missions, this is unfortunate and expensive; however, with the expected increase in manned space exploration, this could result in human tragedy. Once launched, it is usually impractical to repair or replace flight hardware, so several layers of redundancy must be added to mitigate such failure. This increases costs, reduces overload payload capacity, and is not always possible. In this case, any single-point failure area is subject to additional scrutiny to identify potential design flaws or limitations. These tests cannot be used for every part and are thus reserved for a sample set, with the remainder of the manufactured lot exposed to reduced levels of similar tests still stringent enough to screen for failures and risks.
Launch vibro-acoustics
During initial ascent, the launch vehicle engines develop high-level acoustic noise and vibrations. In fact, acoustic levels during launch of the space shuttle approached almost 200 decibels, which could produce pressure waves that could flatten structures in the launch pad’s immediate vicinity. When the launch vehicle reaches a certain point, aerodynamic loads develop high acoustic levels on the payload fairing that can generate dynamic pressure loads in excess of 4 psi. These can excite launch vehicle vibrations damaging flight hardware. For this reason, products or systems are tested at Smiths’ Dundee Test and Qualification laboratory by mounting the flight hardware onto electrodynamic shakers that apply high-level vibrations over a wide spectrum in all three axes (Figure 2).
Figure 2. Electrodynamic shaker system.
Shock and deployment loads
During the initial stages of ascent, ejecting the launch vehicle and payload boost stages is accomplished using explosive devices to shear bolts and allow springs to propel the expended stage safely away from the payload. Once the payload is on-orbit, pyrotechnic charges deploy antennas, solar panels, and other appendages. Each time a pyrotechnic device is used, it produces severe short-duration impulses or shocks, which can damage sensitive instruments, optics, and electronics. Pyrotechnic shocks are simulated with shakers and shock impulse tables programmed to simulate precise shock response spectra (SRS). This involves fixing the unit to a table and impacting the table with a massive hammer-like object. The shock waves are transmitted to the product; slow-motion imagery occasionally observes the effects as the energy is absorbed and dissipated.
Figure 3. SRS mechanical shock test system.
Thermal and vacuum loads
When a space payload is in orbit around the Earth, it passes from direct sunlight to darkness in a precise and calculable period. Depending on the orbit, this could range from once per day to every 90 minutes. In the vacuum of space, the lack of atmosphere prevents temperature control through natural convective heating and cooling. As a result, temperature loads can be extreme, cycling over a wide range from -160℃ to +120℃, causing differential thermal strain and outgassing of electronic components, connectors, and other materials. Outgassing can result in a locally conducted “atmosphere” aboard a spacecraft and, unless avoided or passed into space, can cause a unique set of issues.
Thermal and vacuum loads are simulated using specially designed chambers (Figure 4) that subject the hardware to mission-appropriate thermal and vacuum. In some tests, the product can even be subjected to bursts of radiation to simulate what would happen if a charged particle emanating from the Sun impacted the product.
Figure 4. Thermal vacuum chamber
Voltage breakdown phenomena
A subset of RF products that are used in satellite communication systems and space missions, including filters, multiplexers and isolators, can be subjected to high power levels. In vacuum or low-pressure environments, these high-power levels can lead to voltage breakdown phenomena that include corona and multipaction events. A corona event can block or partially block RF signals or RF power transmissions and can ultimately damage critical hardware. To assess corona susceptibility performance, products under development or manufacturing phases are subjected to atmospheric pressure tests under high RF power conditions in a thermal vacuum chamber (TVAC) while monitoring key performance parameters. This testing typically includes cycling the product repeatedly through a critical pressure range often referred to as the Paschen Curve.
A multipaction effect can also render a device useless and degrade the satellite's reliability. This event can be triggered in space by a combination of cosmic radiation, high RF power levels, high vacuum levels typical of deep space (e.g., International Space Station orbit height and higher), and gaps between product surfaces that are created within a critical range proportional to the RF frequency used. The type of material used for the product wall constructions can also have a major influence on the susceptibility to multipaction phenomena. Testing for simulated multipaction breakdowns in a laboratory requires a sophisticated and expensive test setup, as well as considerable test expertise. It typically comprises the combination of a TVAC, high-power amplifier, and RF source (for each test frequency band required), plus sophisticated multipaction detection means, including harmonic content monitoring and electron charge detection.
Due to the significant and costly impact of a multipaction event in deep space, multipaction analysis, and testing typically requires very large margins of safety. This requires laboratory testing at high-power levels – often four times higher than nominal hardware operating power levels – and leads to very expensive power amplification for laboratory testing which increases significantly at the higher GHz levels (beyond K-band).
Figure 5: Typical multipaction test setup in Dundee test and qualification laboratory
Electromagnetic environments
Electromagnetic waves from the space environment and other onboard electronics can disrupt the operation of electronic devices by causing voltage changes, excessive noise, or faults in electronic circuitry. To mitigate these effects, some product classes are designed to incorporate electromagnetic shielding. The effectiveness of this shielding is evaluated during the design and manufacturing phases by exposing the products to artificially induced levels of microwave radiation in an electromagnetic compatibility (EMC) test chamber (Figure 6).
Figure 6. EMC test chamber
Terrestrial environments
Space-bound products and systems may be subjected to a variety of handling, transportation, and storage environments over their operational lifetimes. These environments include shock, vibration, temperature, humidity, moisture, and corrosive environments. Testing usually includes worst-case terrestrial environments and is often performed in the same facilities used for operational testing.
Dundee test facility
Since 2019, Smiths Interconnect has built and commissioned a dedicated, state-of-the-art 300 square meter qualification and test laboratory at their Dundee, Scotland location. This facility represents a significant financial investment and today includes multipaction, corona, and high-power thermal vacuum testing from the UHF band through to the K band, dynamic stress screening including vibration and classical mechanical shock testing to levels approaching 225 g, with SRS mechanical shock to levels of over 5000 g. The EMC test capability, the latest addition, comprises a two-chamber reverberation test system calibrated to 40 GHz. Additionally, investments in microscope imaging and RF VNA testing up to 110 GHz have expanded the site’s specialized test capabilities.
This facility, while normally used for Smiths Interconnect’s projects, is made available to development partners and customers who require independent third-party environmental testing to support Smiths Interconnects process and new product development. This is a key capability that vastly reduces cost and time to complete certain classes of process and product development, especially where refined through iteration to optimize performance and increase design margins.
- |
- +1 赞 0
- 收藏
- 评论 0
本文由涂抹转载自Smiths Interconnect Blogs,原文标题为:One-stop-shop laboratory replicates deep space environment,本站所有转载文章系出于传递更多信息之目的,且明确注明来源,不希望被转载的媒体或个人可与我们联系,我们将立即进行删除处理。
相关推荐
The Anatomy of a Microstrip Isolator and Circulator: Understanding the Basics of Microwave Microstrip Isolator and Circulator Technologies
Smiths Interconnect has produced almost 700,000 microstrip isolators and circulators over the past 2 decades from 300 portfolio products. The innovation continues and on average 12 new designs being added to the portfolio each year. Today automation is used to produce a large proportion of the devices supplied with robot assembly working had in hand with human operators to bring unheard of device consistency and quality.
设计经验 发布时间 : 2023-09-11
Design Concepts for EMI/EMP Filter Connector
The heart of an EMI/RFI filter connector is the monolithic planar capacitor array. This is a barium-titanate ceramic disc, which provides a common substrate for capacitance on each line of a connector. The capacitance values can be mixed including ground and feed-thru lines.
设计经验 发布时间 : 2024-04-03
Smiths Interconnect 微波元器件 选型指南
描述- Smiths Interconnect is a leading provider of technically differentiated electronic components, subsystems, microwave and radio frequency products that connect, protect and control critical applications in the Defence and Aerospace, Communications and Industrial markets.
型号- 82 7013TC,32 1209,83 7017TC,33 1052,HPR2F,D3PP20F,CR0402D,33 1050,DS15D10,42WXX.00F,SMT2010TALN,32 1200,82 3003TC,32 1201,81 7042,32P7201F,31 7021,81 3012B,KTVA SERIES,HE298MF,12-0101,12-0102,13-125-T,82 7001TC,81 7021TC,83 7006TC,33 1041,4113P,33 1042,QTVA,8485 SERIES,82 3038TC,32 1212,SMT2010*A,42UW SERIES,32 1213,81 3001B,81 3001A,81 3033TC,42TVA,CR1010D50,5W2,SXUXXXX3F,DS15D20,SMT3737*ALN,CA0505D T,4112P,42KA,P2D50J,DN05W20F,811,812,49XX,83 1001TC,4111P,SD055-055-4-A,82 7025TC,SD055-055-4-B,SD065-035-3-B,5654 XXX,5,TS0710S,82 3039TC,CR1010D50,5TB,81 7031,32 1111,32 1117,81 3011B,81 3011A,5308 XXX,5,81 7028,31 7008,31 7006,5660 XXX,5,32-7172F,823,827,82 7002TC,HPP2F,HN05W03F,HRM,32 1002,32 1123,32 1121,HRT,SD130-105-4-040,83 3005TC,32 1001,32 1122,D3PPXXF,32 1006,32 1007,32 1004,82 7166TC,82 3001TC,32 1005,81 3001TC,CT3725,33 1009,33 1005,33 1006,33 1003,12-250-T,CA0505DXXFT,33 1004,SMT2010*ALN,CT2335TALN,4110J,33 1001,33 1002,SD055-055-3-B,SD065-035-4-A,32P7204F,SD065-035-4-B,83 8999,HRTVA,83 3016TC,TVA SERIES,32 1014,81 3035TC,HR03,32 1138,32 1017,HR05,32 1137,81 3012TC,CT1310D,11-125-T,32 SERIES,D2PL05F,841X SERIES,CT3737,841,842,843,HD064M3F,83-7027-10.00F,846,CT2525,AN7 SERIES,83 7999,ETVA SERIES,12-250-TP,83 3006TC,QFA,32 1026,CT3725_ALNS,CT1206,AN11 SERIES,CT3737TALN,33 1021,TS07,TS06,83 1003TC,TS05,TS04,TS03,CT2335*ALN,5653,42TVA SERIES,32 1035,32 1156,81 3034TC,32 1036,32 1157,32 1034,DN15D10F,32 1039,32 1158,32 1037,TS09,CT0505DT,32 1160,WH0825F,CA0505D,32 1161,32 1041,32 1162,QTVA03N0SMTF,SXXXX-XXX-X-XXX,33 1017,81 7043TC,CR0402D SERIES,QFAXX0XSMTF,81 3008B,TS0620F,31AZ021-050-5F,81 3003TC,CT0505D SERIES,82 7187TC,81-Z008TC-100-5F,SD055-055-4-015,8482 SERIES,32 7037,83 3994TC,875,HRMTVA,D2PLXXF,5657,5659,CR0603D,SD065-035-4-025,CT2010*A,SMT3725,QTVA SERIES,81 7108TC,82 3019TC,5 SERIES,CT3725F,82 7176TC,CT0505DTB,83 3999,32 7163,12-5061,SD045-025-4-A,83 3998,32 7164,SD045-025-4-B,32 7165,SD050-020-3-B,83 3995,CA0505D FT,5307,843X SERIES,CT1206*ALN,AN5 SERIES,81 3006A,82 3008TC,CR0505D,5323,HR0520AW3S,81 3006B,SXU15203F,83 1996TC,81 3002TC,823X SERIES,82 3213TC,SD120-080-5-A,XPDF,31 1099,12-5050,31 1098,12-5051,32 7176,32 7172,8488 SERIES,81 7109TC,CT1005TALN,XFMRF,MTVA0300N05W3S,SXU00203F,SD105-105-4-035,811X SERIES,12-5042,SD045-025-3-B,32 7187,12-5049,81 3123TC,73-0160-100,5310 XXX,5,82 3005TC,12-5032,81 3036,WTVA0300N05SMTF,SMT252503ALN2F,32 7196,42S,81 3032,81 3031,42W,82 7030TC,TS0410S,32 7195,SXU20103TF,83 7011TC,83 7034TC,SMT2525*A,TS0910SMTF,32 7191,81 3039,AN3,AN5,CR040W2 SERIES,AN7,81 3005B,81 3005A,31 7110,83 1006TC,CT0505,12-5021,812X SERIES,31 7109,CR040W2,31 7108,41 SERIES,XPMRF,31 7107,11-250-TP,12-5029,42UW,81 7008TC,12-5028,83 7023TC,SMT2525*ALN,CT1005*A,P4L35G,AN SERIES,8750,82 3006TC,82 3029TC,81 3027TC,81 3002A,HPK2F,82 7163TC,D3MDXXF,D15D20,COAX TVA,81A7042_-100-5F,83 3997TC,12-5014,12-5012,12-5013,CT3725*ALN,81 3003B,81 3003A,81 7107TC,842X SERIES,KTVA,12-5007,42S SERIES,12-5005,CT0402,KTVA0300N052F,8750 SERIES,TVA,HR0320AW3S,81 3028,D2PK02F,81 7001B,D3PV30F,32P7196F,HRM030AN05W3S,AN5-XNXF,SMT1206 *ALN,31 1033,31 1035,31 1034,31A7021-050-5F,P3S35J,P3S35L,8487 SERIES,RPD0212F,TRP 4-12,82 7172TC,SMT3725*ALN,82 3030TC,12 SERIES,41XXPCD,SD105-105-4-A,8XXX,SD105-105-4-B,81 7006TC,81 3006TC,SMT3737*A,WTVA SERIES,KFA,SMT SERIES,KFAXX.00-5SMTF,31 1010,841X,D2PJXXF,TRM4-12_XXX,5,33 7023,CTVA0300N05W3F,5326 XXX,5,83 SERIES,83 7044,WTVA,83 7046,83 7047,SMT3725*A,DN05Z15F,82 7150TC,82 3031TC,HPCA5410.00W3S,SXU10203TF,827X SERIES,31 1021,42 SERIES,842X,CT0402D,SMT3725TALN,42TVA0300N05F,HE128MF,12-3022,42,CR1010D,4112PLC,HLB2F,31 1086,SXU00303F,CT0603D SERIES,33-7XXX-XX.XXF,31 1076,33 7002,843X,33 7001,33 7004,CR0603D SERIES,33 7005,D2PJ30F,12-3007,P4L50G,31 1094,TRM 4-12,5318 XXX,5,82 3051TC,MTVA,31 1089,82A7176TCF,HPX2F,SMT372501AIN2MF,BD064M3F,12-3005,P2S35D,CT0505D,12-3002,SD045-025-4-015,12-3001,SMT3737,81 3008TC,SMT2525,CTVA,846X,D2DL20F,32P7198F,HRTVA SERIES,83 3021TC,D3PVXXF,HPG2F,42KA SERIES,82 3040TC,31 1059,32-1003,31 1054,83 8054,CT1310D SERIES,8487,8485,823X,8488,TRP 6-12,32P7197F,31 1075,12-125-T,31 1074,8482,TRP 6-18,SXU15303F,846X SERIES,81AZ042-100-5F,32 7024,32 7025,CT2525*ALN,32 7027,13-250-T,5653ALN,32 7023,TVA0300N05W3S,5318XXX5,42W SERIES,CT0402D SERIES,82 7017TC,812X,XPRF,5309L,32 1046,32 1047,32 1168,HPD2TF,82 3045TC,HD128M3F,CTVA SERIES,32 1050,AN11,32 1051,SD130-105-3-B,CT2335*A,811X,81-SERIES,4111PCD,82 7005TC,13-125-TP,TS0320W1S,11-250-T,32 1055,CR0505DT2,SMT372503ALN2F,TRM 8-18,81 3075TC,CR0505D SERIES,32 1184,D3FUXXF,CR0505DTB,81 3002BV,HPCA,32 1068,HDC2F,82 3023TC,HE450M2F,CT2525TALN,5307ALN,33 700,32 1070,32 1191,SD130-105-4-B,32 1196,SD130-105-4-A,32 1074,HG064M2F,82 SERIES,CT0603D,RPDXXXXF,CT1005,CT2335,HRMTVA SERIES,827X,RPD0412F,CR0402D W2,82 3209TC,KTVA0300N055SMTF,83 7009TC,82 7192TE,32 1198,32 1199,82 3012TC,81 3074TC,32M7200,12-0001SF,4915,CA0505DXX,32P7197,HRT030AN05W3S,4910,HDS2F,TS0520W1S,83 7014,ETVA0300N05S,82 7015TC,81-7008TC-1005F,RPD0312F,
Smiths Interconnect Offered Isolators to Support NASA’s Europa Clipper Mission to Explore Jupiter’s Moon
Smiths Interconnect is proud to support NASA and the Johns Hopkins Applied Physics Laboratory in providing key components for use in the forthcoming Europa Clipper mission to explore one of Jupiter’s moons.
应用方案 发布时间 : 2024-11-15
RF ang MEI/EMC COILS and TOROIDS & OTHER TYPES Products Brochure
型号- SMB201209,PK3W1012,SMI201209,TC3726,SMTLF632,SMTSC0703,TC8026,SMB302540,SMTSC0504,SMB302585,PK3W0912,ET24,LFU9.8H,ET28,SMTTC30,SMI160808,SMDCHGR0805,SMC10050,SMDCHGR0603,SMTTC38,SMDFSR0603,SMI321611,LFUT20,SMB321611,SMB 302540,TC13026,LFU10,TC9026,TC4426,SMDFSR0805,TC5026,SMB160808,SMTSC1006,SMI201212,SMDCHGR0402S,SMI252010PE,LFD707010,SMTTC44,SMI201210PE,LFD648075,WBRH-35608,TC10626,SMDFSR1008,SMDWCM3216,TC6026,SMTSC0403,TC3026,LFU16,WBRH-354708,SMTTC50,PK3W0810,SMDCHGR1210,SMBM5H,SMDWCM2012,TC2026,TCT-XXX-45153,ET35,SNTSC0703,PK3W0608,TR-02,SMI201610PE,TR-03,LFU9.8,PK3W1016,SMDCHGR1008,WBRH-35908
Smiths Interconnect Has a Very Large Portfolio of Existing Coaxial Isolators and Circulators for Space or Defence Applications
As it is impractical to solder the piece parts externally and pass the assembly into the cavity, Smiths Interconnect uses a contactless induction soldering and inspect the resultant solder joints using a Smiths Interconnect in-house 3D x-ray machine, whose 160keV beam makes short work of up to 5mm of steel.
原厂动态 发布时间 : 2023-04-27
K-BAND PASSIVE COMPONENTS Space Qualified Coaxial and WR51 Isolators, Circulators and Iso-adapters, Waveguide Loads and Microstrip Isolators
型号- 19TE110,I190220/A,I233236/A,I190220/B,19HD353,I177220/H,I255270/A,C173202/C,19TE111,I173220/A,19TM107,19TM106,I173220/C,I235240/A,19TE109,19CD328,19HD359,19HD358,I178202/J,I178202/H
Space Connectivity Solutions
型号- HC SERIES,K2TVA,AURORA,MWC,KU SERIES,AURORA SERIES,MWC SERIES,QT SERIES
SWaP challenges in the defence industry: How Smiths Interconnect rises to the challenge
The defence industry has exceptionally high connectivity demands, especially when it comes to size, weight and power (SWaP). Smiths Interconnect is an industry-leading provider of cutting-edge connectivity solutions to the defence sector for applications such as guidance systems, data links, manpack radios, radar systems (ground, air and shipboard), antenna systems and drones.
原厂动态 发布时间 : 2024-02-28
Keys to Choosing the Right Integrated Microwave Assembly Partner for the Future
As Size, Weight, and Performance (SWaP) issues drive more and more of today’s platform design decisions, supply chain managers and engineering directors alike must see further into the future on the issues that will determine ultimate success. With IMAs, decisions around the microwave and digital transmit/ receive functions in your block diagram are critical. Should you design separate TX and RX modules, or one transceiver?
技术探讨 发布时间 : 2024-06-04
CTX SMT series High Frequency Surface Mountable Chip Terminations
型号- CTH0603ALN1SMTF,CTX SMT,6035HTC
电子商城
品牌:荣湃半导体
品类:LED EMULATOR INPUTOPEN COLLECTOR OUTPUT ISOLATORS
价格:¥1.7500
现货: 165
现货市场
登录 | 立即注册
提交评论