Smiths Interconnect Has Invested in A Comprehensive Range of Environmental Tests at Dundee Facility to Replicate Deep Space Environment

2023-08-01 Smiths Interconnect Blogs

The equipment required to simulate the rigors of launch and operational use in deep space, however, requires significant investment in facilities and highly skilled labor that most companies do not have. Companies may either have to rely on external test services, adding to costs, extending development and delivery schedules; or attempting to negotiate away certain critical test needs.

Many certification organizations and government agencies require impartial third-party laboratories to perform these tests for integrity assurance. Smiths Interconnect, a global supplier of cutting-edge connectivity solutions, has invested in a comprehensive range of environmental tests at their Dundee facility. This offers an important capability to customers not prepared to negotiate on fundamental reliability and insist on demonstrable compliance.


Dundee site qualification and test laboratory general purpose test area.



Types of environmental tests

Critical flight hardware malfunctioning when exposed to severe environmental conditions can lead to system degradation and catastrophic mission failure. For unmanned missions, this is unfortunate and expensive; however, with the expected increase in manned space exploration, this could result in human tragedy. Once launched, it is usually impractical to repair or replace flight hardware, so several layers of redundancy must be added to mitigate such failure. This increases costs, reduces overload payload capacity, and is not always possible. In this case, any single-point failure area is subject to additional scrutiny to identify potential design flaws or limitations. These tests cannot be used for every part and are thus reserved for a sample set, with the remainder of the manufactured lot exposed to reduced levels of similar tests still stringent enough to screen for failures and risks.


Launch vibro-acoustics

During initial ascent, the launch vehicle engines develop high-level acoustic noise and vibrations. In fact, acoustic levels during launch of the space shuttle approached almost 200 decibels, which could produce pressure waves that could flatten structures in the launch pad’s immediate vicinity. When the launch vehicle reaches a certain point, aerodynamic loads develop high acoustic levels on the payload fairing that can generate dynamic pressure loads in excess of 4 psi. These can excite launch vehicle vibrations damaging flight hardware. For this reason, products or systems are tested at Smiths’ Dundee Test and Qualification laboratory by mounting the flight hardware onto electrodynamic shakers that apply high-level vibrations over a wide spectrum in all three axes (Figure 2).


Figure 2. Electrodynamic shaker system.


Shock and deployment loads

During the initial stages of ascent, ejecting the launch vehicle and payload boost stages is accomplished using explosive devices to shear bolts and allow springs to propel the expended stage safely away from the payload. Once the payload is on-orbit, pyrotechnic charges deploy antennas, solar panels, and other appendages. Each time a pyrotechnic device is used, it produces severe short-duration impulses or shocks, which can damage sensitive instruments, optics, and electronics. Pyrotechnic shocks are simulated with shakers and shock impulse tables programmed to simulate precise shock response spectra (SRS). This involves fixing the unit to a table and impacting the table with a massive hammer-like object. The shock waves are transmitted to the product; slow-motion imagery occasionally observes the effects as the energy is absorbed and dissipated.


Figure 3.  SRS mechanical shock test system.



Thermal and vacuum loads

When a space payload is in orbit around the Earth, it passes from direct sunlight to darkness in a precise and calculable period. Depending on the orbit, this could range from once per day to every 90 minutes. In the vacuum of space, the lack of atmosphere prevents temperature control through natural convective heating and cooling. As a result, temperature loads can be extreme, cycling over a wide range from -160℃ to +120℃, causing differential thermal strain and outgassing of electronic components, connectors, and other materials. Outgassing can result in a locally conducted “atmosphere” aboard a spacecraft and, unless avoided or passed into space, can cause a unique set of issues.

Thermal and vacuum loads are simulated using specially designed chambers (Figure 4) that subject the hardware to mission-appropriate thermal and vacuum. In some tests, the product can even be subjected to bursts of radiation to simulate what would happen if a charged particle emanating from the Sun impacted the product.


Figure 4. Thermal vacuum chamber



Voltage breakdown phenomena

A subset of RF products that are used in satellite communication systems and space missions, including filters, multiplexers and isolators, can be subjected to high power levels. In vacuum or low-pressure environments, these high-power levels can lead to voltage breakdown phenomena that include corona and multipaction events. A corona event can block or partially block RF signals or RF power transmissions and can ultimately damage critical hardware. To assess corona susceptibility performance, products under development or manufacturing phases are subjected to atmospheric pressure tests under high RF power conditions in a thermal vacuum chamber (TVAC) while monitoring key performance parameters. This testing typically includes cycling the product repeatedly through a critical pressure range often referred to as the Paschen Curve.

A multipaction effect can also render a device useless and degrade the satellite's reliability. This event can be triggered in space by a combination of cosmic radiation, high RF power levels, high vacuum levels typical of deep space (e.g., International Space Station orbit height and higher), and gaps between product surfaces that are created within a critical range proportional to the RF frequency used. The type of material used for the product wall constructions can also have a major influence on the susceptibility to multipaction phenomena. Testing for simulated multipaction breakdowns in a laboratory requires a sophisticated and expensive test setup, as well as considerable test expertise. It typically comprises the combination of a TVAC, high-power amplifier, and RF source (for each test frequency band required), plus sophisticated multipaction detection means, including harmonic content monitoring and electron charge detection.

Due to the significant and costly impact of a multipaction event in deep space, multipaction analysis, and testing typically requires very large margins of safety. This requires laboratory testing at high-power levels – often four times higher than nominal hardware operating power levels – and leads to very expensive power amplification for laboratory testing which increases significantly at the higher GHz levels (beyond K-band).


Figure 5: Typical multipaction test setup in Dundee test and qualification laboratory



Electromagnetic environments

Electromagnetic waves from the space environment and other onboard electronics can disrupt the operation of electronic devices by causing voltage changes, excessive noise, or faults in electronic circuitry. To mitigate these effects, some product classes are designed to incorporate electromagnetic shielding. The effectiveness of this shielding is evaluated during the design and manufacturing phases by exposing the products to artificially induced levels of microwave radiation in an electromagnetic compatibility (EMC) test chamber (Figure 6).


Figure 6. EMC test chamber


Terrestrial environments

Space-bound products and systems may be subjected to a variety of handling, transportation, and storage environments over their operational lifetimes. These environments include shock, vibration, temperature, humidity, moisture, and corrosive environments. Testing usually includes worst-case terrestrial environments and is often performed in the same facilities used for operational testing.


Dundee test facility

Since 2019, Smiths Interconnect has built and commissioned a dedicated, state-of-the-art 300 square meter qualification and test laboratory at their Dundee, Scotland location. This facility represents a significant financial investment and today includes multipaction, corona, and high-power thermal vacuum testing from the UHF band through to the K band, dynamic stress screening including vibration and classical mechanical shock testing to levels approaching 225 g, with SRS mechanical shock to levels of over 5000 g. The EMC test capability, the latest addition, comprises a two-chamber reverberation test system calibrated to 40 GHz. Additionally, investments in microscope imaging and RF VNA testing up to 110 GHz have expanded the site’s specialized test capabilities.

This facility, while normally used for Smiths Interconnect’s projects, is made available to development partners and customers who require independent third-party environmental testing to support Smiths Interconnects process and new product development. This is a key capability that vastly reduces cost and time to complete certain classes of process and product development, especially where refined through iteration to optimize performance and increase design margins.

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SMITHS INTERCONNECT  - 数据手册 代理服务 技术支持 采购服务

国防连接解决方案

描述- Smiths Interconnect 提供一系列高可靠性连接解决方案,服务于军事和国防、医疗、半导体测试和工业市场。其产品包括集成微波组件、方向寻找器、卫星通信、数据链路、天线、光收发器和连接器解决方案等。公司技术品牌(如EMC、Hypertac、IDI、Lorch等)以其高性能和高品质解决方案而闻名,适用于安全关键应用和环境苛刻条件。产品线涵盖了高可靠性电气连接器、坚固嵌入式收发器、天线系统解决方案以及广泛的创新射频和微波解决方案。此外,Smiths Interconnect 还提供定制设计和全球支持服务。

2024/4/9  - SMITHS INTERCONNECT  - 商品及供应商介绍  - Version 3.2 代理服务 技术支持 采购服务 查看更多版本

L、S和X波段高功率环行器和隔离器

型号- IA10001200P3KS,CB800012000P300S,CA31003500P3KS,IB800012000P300S,CA10001200P3KS,IA31003500P3KS

2023/1/6  - SMITHS INTERCONNECT  - 商品及供应商介绍  - Version 1.0 代理服务 技术支持 采购服务

K波段无源元件空间合格的同轴和WR51隔离器、循环器和ISO适配器、波导负载和微带隔离器

描述- Smiths Interconnect提供一系列K波段无源组件,专为卫星通信有效载荷在GEO/MEO和LEO轨道上使用而设计。这些组件包括隔离器、环行器、终端、转换器和混合器等,覆盖从S波段到Ka波段的频率范围。产品经过内部测试和认证,确保在极端环境下稳定可靠。特点包括宽带、温度稳定、低插入损耗和高功率处理能力。

型号- 19TE110,I190220/A,I233236/A,I190220/B,19HD353,I177220/H,I255270/A,C173202/C,19TE111,I173220/A,19TM107,19TM106,I173220/C,I235240/A,19TE109,19CD328,19HD359,19HD358,I178202/J,I178202/H

2021  - SMITHS INTERCONNECT  - 商品及供应商介绍  - Version1.0 代理服务 技术支持 采购服务
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