From 400G to 800G: Redefining Data Transmissions
The dawn of the 800G era is upon us, signifying a monumental shift in networking technology. This leap brings the challenge of accommodating more advanced technology within definitive size constraints. The pivotal elements of this transition include increased power consumption, enhanced thermal resilience, and the incorporation of sophisticated components like heatsinks.
NVIDIA's DGX A100, featuring the ConnectX-6 network card and M8700 switch, and the sought-after DGX H100 with the ConnectX-7 card and QM9700 switch, have garnered significant attention. Combined with NVLink and NVSwitch connecting GPUs at 600Gb/s, the ConnectX cards are pivotal in unifying the AI infrastructure.
With the DGX H100's significant adoption of the 400G OSFP ports, there's an anticipated rise in the use of OSFP connector and QSFP connectors, especially as demand for the H100 increases from 2023H2 onwards.
As the industry moves towards harnessing dual 400G interfaces to achieve the 800G milestone, network operators are confronted with essential choices between form factors like QSFP-DD and OSFP. This shift emphasizes the urgent need for strategic vendor partnerships to adeptly navigate the evolving landscape.
OSFP: Redefining High-Speed Networking
OSFP has marked the beginning of a new era in high-speed networking, data centers, and telecommunications. The more prominent form factor of OSFPs enables superior thermal performance, allowing these transceivers to handle bandwidth-intensive applications without the risk of overheating. Importantly, their forward compatibility potential prepares the industry for future applications demanding up to 800G rates.
Differences in Design: QSFP-DD vs. OSFP
Both QSFP-DD and OSFP modules support up to 400 Gbps. However, OSFP, with its superior thermal performance and larger size, is better equipped for high-performance applications.
With the introduction of OSFP1600 and OSFP-XD, the potential of OSFP is further accentuated. Specifically, OSFP-XD offers double the front panel density compared to QSFP-DD.
Ｗith the continuous advancements of transceivers, they are not only reshaping current practices but also pioneering future possibilities, holding promising potential in shaping the future of the infrastructure of the digital realm.
Pioneering 800G Challenges with Nextron
Transitioning from 400G to 800G presents intricate challenges, with advanced thermal management at its core. Network operators require partners well-versed in the latest thermal solutions.
Nextron excels in high-speed I/O port development, aligning with transceiver standards and prioritizing efficient heat dissipation. Nextron offerings, from QSFP+ connectors, and QSFP28 connectors, to QSFP-DD connectors, embody superior heat design and support diverse applications with 56G PAM-4 certification, progressing towards 112G PAM-4 evolution.
Looking forward, the imminent release of our 800Gb/s SmartNIC underlines Nextron's dedication to advancing connectivity solutions. As we navigate the digital future, partnering with Nextron is pivotal for those seeking to lead in high-performance computing.
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本文由Vicky转载自Nextron News，原文标题为:From 400G to 800G: Redefining Data Transmissions，本站所有转载文章系出于传递更多信息之目的，且明确注明来源，不希望被转载的媒体或个人可与我们联系，我们将立即进行删除处理。
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目录- Company Profile and Test Capabilities Connector Application Connector Customized-Solutions High Speed I/O Connector Overview SFP series High Speed Connector QSFP series High Speed Connector MiniSAS HD series High Speed Connector Dust/EMI Covers
型号- Z-H03B0011**000,Z-8420011**0001,Z-855**10000*10,Z-834B***P****1,Z-834E***P****1,Z-861E0**00**01,Z-828***000D0*0,Z-844E0**P0***1,Z-861T0**00**01,Z-8560**1000000,Z-8350011**0001,Z-840B000020000,Z-828***000**00,Z-848T***P****1,Z-8670011**0001,Z-868**0***0**0,Z-830B000100000,Z-83220S00****0,Z-848B***P*00*1,Z-848E***P*00*1,Z-H02R0111**0R0,Z-8270000*0*000,Z-H02R0111**1R0,Z-85020S******0,Z-824**1000***0,Z-844T0**P0**01,Z-S892000*0B22,Z-854***000***0,Z-834T********1,Z-S891000*0B22
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德普福（Dloorplf）射频微波信号连接产品选型指南（英文）
描述- Dloorplf is committed to providing high-quality mmWave test and measurement components that are widely utilized in the semiconductor, optical communication, and mmWave measurement industries.
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可定制TX线圈的尺寸/形状/特性参数,Q的最小值为90，最大值为120,符合WPC和Qi标准。电感的最小值、典型值、最大值依次为21.6μH、24.0μH、26.4μH，偏差为10%.DCR（最大值）为75mΩ。
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可定制位移传感器量程范围10~600mm，该YWD型位移传感器表面有带刻度的透明窗☐，每毫米的变化量误差不超过3ue/mm，可在静态、准静态和低频动态下工作。主要指标：非线性<0.2%；供桥电压<10v；测试精度：0.01mm。
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