【产品】填充银片的单组分丙烯酸导电涂料CHO-SHIELD 2040,适用于塑料EMI/RFI屏蔽
PARKER CHOMERICS推出的CHO-SHIELD 2040是一种填充银片的单组分丙烯酸导电涂料,它专门为在塑料上的应用提供卓越的EMI/RFI屏蔽性能。该涂料配方稳健,适用于大小体积的涂装过程。
CHO-SHIELD 2040导电涂层为各种应用提供了优越的性能,包括强悍的电磁干扰屏蔽,防静电保护和电气接地。CHO-SHIELD 2040是电子外壳和组件的理想选择。涂层的组成支持传统设备,只需简单、标准地处理,就能得到非常短的干燥和处理时间。此外,CHO-SHIELD 2040还是医疗电子设备外壳和组件的不二之选。这些外壳和组件需要高水平且可靠的EMI屏蔽性能,并且由于具有银片填充,可以获得抗菌性能。
CHO-SHIELD 2040单组分丙烯酸导电涂料的特点及优势
•单组分
•热塑性丙烯酸
•银片填料
•优秀的流平性
•使用便利。CHO-SHIELD 2040固体重量占40%,可使用MEK溶剂按需稀释。可与标准喷涂设备配合使用,不需要额外设备。
•材料在室温下干燥,无需高温固化,效率高。对各种塑料有良好的粘附性,非常耐用。
•优越的导电性和EMI屏蔽。
•银涂层具有抗菌性能,是医院环境下的不二选择。
•在干膜厚度较薄的情况下提供良好的覆盖范围,从而最大限度地降低材料成本并缩短油漆循环时间。
CHO-SHIELD 2040订购信息
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【经验】用于塑料外壳电磁屏蔽的喷涂导电涂料的技巧
用于塑料外壳电磁屏蔽的导电涂层随着对军事,航空,汽车,电信,医疗和半导体市场中各种EMI应用的增加而日益普及。本文Parker Chomerics教你用于塑料外壳电磁屏蔽的喷涂导电涂料的技巧。
设计经验 发布时间 : 2019-03-31
CHO-BOND® 1018 & CHO-BOND® 1019 Instructions for Painting & Powder Coating
型号- 50-01-1018-0000,CHO-BOND 1018,CHO-BOND 1019,50-01-1019-0000,CHO-BOND® 1019,50-02-1018-0000,CHO-BOND® 1018
Key Facts About Parker FY2019
型号- CHO-FORM 5550,SOFT SHIELD 4850,CHO-FORM 5552,CHO-BOND® 584-29,THERM-A-GAP GEL,CHO-FORM 5538,CHO-MUTE 9025,CHO-MUTE 9005,SOFT-SHIELD 3700,SOFT-SHIELD 4800,CHO-BOND® 1075,CHO-BOND® 580-208,SOFT-SHIELD 4850,CHO-FORM® 5528,CHO-SEAL 2557,CHO-SEAL 2532,SOFT-SHIELD 3500,CHO-BOND® 1038,CHO-SEAL 2542
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使用FloTHERM和Smart CFD软件,提供前期热仿真模拟、结构设计调整建议、中期样品测试和后期生产供应的一站式服务,热仿真技术团队专业指导。
实验室地址: 深圳 提交需求>
可定制UV胶的粘度范围:150~25000cps,粘接材料:金属,塑料PCB,玻璃,陶瓷等;固化方式:UV固化;双固化,产品通过ISO9001:2008及ISO14000等认证。
最小起订量: 1支 提交需求>
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