Ventec to Showcase New Range of High-performance PCB laminates and Prepregs at IPC APEX Expo 2023
Ventec will be launching a range of new PCB laminate and prepregs at the IPC APEX Expo in San Diego, CA. Between January 24th and 26th, visitors to booth 419 will be invited to discover Ventec’s latest tec-speed materials and a next-generation metal base laminate with exceptional thermal conductivity at their North American debut. Ventec’s comprehensive range of high-reliability PCB laminate and prepreg solutions will also be highlighted to the US manufacturing industry at the annual expo.
Ventec’s expanding range of PCB materials is designed to meet the technology needs of the PCB manufacturing industry. With laminates specifically developed for use in demanding conditions, Ventec’s products provide reliability and high-performance, supported by Ventec’s fully controlled and managed global supply chain to ensure dependable delivery even in an unpredictable worldwide landscape.
US-Launch of new laminates and prepregs
With its US debut at APEX, Ventec will be showcasing new additions to its tec-speed and tec-thermal ranges.
tec-speed 30.0 - VT-6735 - With a thermal conductivity of 1.15 W/mK, this laminate provides excellent thermal performance in applications operating at elevated temperatures. It also features a low dielectric constant (Dk) of 3.5, good insulation resistance and high dimensional stability for reliable operation over time.
tec-speed 20.0 - VTM-1000i - a new hydrocarbon laminate with excellent thermal reliability and incredibly high Dk (9.8) and low Df (0.0023). The material can be supplied bonded with or without a metal (aluminium or copper) base plate heat sink. tec-speed 20.0 VTM-1000i represents the top-tier option for use with satellite communications systems, GPS antennas, and other RF and microwave circuitry.
tec-speed 6.0 H-PK - VT-770/VT-770 (LK) - a halogen free and high thermal grade laminate/prepreg material that offers excellent performance in high temperature and harsh environmental applications. It offers an extended temperature range, making it reliable and resistant to thermal cycling. VT-770 (LK) features a low dielectric constant which helps minimize crosstalk in high-speed signals and is halogen free, making it an excellent choice for lead-free and environmentally friendly products.
tec-speed 6.0 - VT-462SH NF/VT-462SH LF - an ultra-low loss No Flow/Low Flow material designed to meet environmentally friendly requirements. It has good bonding and thermal performance in heat sink bonding and rigid-flex board applications, and it has a small flow range with consistent lamination.
VT-4BC - a high thermal conductive metal base laminate designed for use in applications requiring excellent performance in thermal management. With excellent mechanical properties, dimensional stability, and superior dielectric properties, the material is resistant to impact, moisture, and chemicals, making it a reliable choice for the most demanding applications.
Further highlights at the show:
autolam - developed for the automotive industry
Ventec’s premier set of PCB base material solutions that are specifically curated for the diverse and unique requirements of automotive applications.
aerolam - working for aviation, aerospace, and defense applications
A dedicated portfolio developed by Ventec to cater for the complete spectrum of aviation, aerospace, and defense applications, aerolam offers high-quality solutions for these demanding industries.
Professional Development Sessions
Our Senior Director of Business Development, Paul Cooke will be presenting three Professional Development Sessions in the run up to the show on Sunday 22nd and Monday 23rd January. His subjects focus on “Process Flow and Associated Defects” and “PCB Design for High Reliability”.
With products that cater for very exacting markets, including the defense and aerospace sector, and the automotive industry, Ventec’s range includes options for multiple applications across a range of budgets.
“The US manufacturing industry is of prime importance to Ventec. We are expanding our specialist and dedicated team focused on delivering our world-class products with similarly world-class expertise and support,” said Mark Goodwin, COO EMEA & America. “Our recent growth includes two exciting appointments in recent months, with both Chad Wood and Paul Cooke having joined our team as Director OEM Sales and Business Development, and Senior Director of Business Development respectively. We look forward to welcoming visitors to our booth in San Diego to discuss all the latest developments in our laminates range.”
- |
- +1 赞 0
- 收藏
- 评论 0
本文由玄子转载自Ventec，原文标题为:New range of PCB laminates at IPC APEX Expo 2023，本站所有转载文章系出于传递更多信息之目的，且明确注明来源，不希望被转载的媒体或个人可与我们联系，我们将立即进行删除处理。
相关推荐
Ventec新系列PCB层压板将首次亮相2023年美国IPC APEX博览会，可提供优异导热性能
Ventec不断扩大PCB材料范围，旨在满足PCB制造行业的技术需求，将在圣地亚哥举办的2023 IPC APEX博览会上推出一系列新的PCB层压板和预浸料，提供优异导热性能。
Ventec Builds Global Inventory of High-Speed/Low-Loss Materials to Deal with Laminate Material Supply Issues
In response to high demand and laminate material supply issues affecting some producers of low transmission loss and high-frequency laminates and prepregs, Ventec International Group Co., Ltd. (6672 TT) has implemented material inventory ＆ supply chain measures with favorable order requirements. In doing so, Ventec ensures that customers can continue to rely on uninterrupted material delivery through the company’s fully controlled and managed global supply chain.
Minebea Built New Facility for Defense-related and Aerospace Components at Its Matsuida Plant
Minebea Co., Ltd. built a new production facility as part of its strategy to expand operations geared toward the defense and aerospace markets. The new facility, with a total floor area of 9,000㎡, was constructed on the premises of Minebea‘s Matsuida Plant in Annaka, Gunma Prefecture. Minebea‘s plans also included closing its Omori Plant in Tokyo due to a lack of sufficient space.
射频印刷电路板的真实世界
型号- RO4830™,TC350,RO4360G2™,CLTE-MW™,RO3000,CLTE,RO3003G2,SPEEDWAVE®300P PREPREG,RO4533™,RO4350B,CLTE-MW,RO3003G2™,RT/DUROID 6002,MAGTREX™ 555,RT/DUROID 6000,RO4000®,RO3003™,RO4003C™,RO4725JXR™,TC600,RO4835™,TC350™,TMM®,CLTE-AT™,CLTE SERIES,TC350 PLUS,RO4835T™,RO4000,RO4350B™,RO3000®,RT/DUROID 6035HTC,MAGTREX 555,RT/DUROID® 6035HTC,AD300D™,CLTE-XT™,RT/DUROID 5000,RO4730G3™,RO4350B LOPRO®,RO3010™,CLTE SERIES®,TC600™,RO4835,TC350™ PLUS
【材料】导热系数10W/m·K的金属基层压板VT-4BC，陶瓷填充，可燃性UL94 V-0
腾辉电子推出金属基层压板，型号为VT-4BC，导热系数：10W/m·K，无卤素，陶瓷填充，可燃性UL94 V-0，MOT 155℃，高Tg 180℃，适用于高温应用，可应用于超亮照明、功率模块（IGBT）、控制器、电机驱动器、整流器、电源和电源转换。
Ventec Launches New Highest Thermal Conductive Metal Base Laminate VT-4BC for IGBT ＆ Power Markets with a Thermal Conductivity of 10W/mK
With high electrical breakdown strength, VT-4BC is designed to provide unparalleled reliability and improved performance over competing materials. It exhibits a thermal conductivity of 10 W/mK, offering superior heat dissipation even under the most demanding conditions.
腾辉电子为IGBT和电力市场推出高导热金属基层压板VT-4BC，导热系数达10W/mK
腾辉电子宣布推出其最新的高导热金属基层压板VT-4BC，该产品具有高电击穿强度，可提供无与伦比的可靠性和优于竞争材料的性能。它还具有优异的机械性能，尺寸稳定性和优越的介电性能。新产品适用于需要卓越热管理性能的应用。
Ventec New launches flex-rigid material tec-speed 4.0 (VT-462(L) PP NF/LF) for critical military ＆ aerospace applications
Ventec has added to its flex-rigid No Flow / Low Flow prepreg range with the introduction of tec-speed 4.0 (VT-462(L) PP NF/LF), a next-generation no ＆ low flow FR 4.0 prepreg material that offers high-Tg, low Dk, low loss, and excellent thermal reliability.
Ventec Launches tec-speed 20.0 VTM1000i Hydrocarbon Laminate, with High Dk of 9.8 and Low Df of 0.0023
Ventec has launched the new tec-speed 20.0 VTM1000i hydrocarbon laminate that offers impressive thermal reliability and exceptionally high Dk (9.8) and lows Df (0.0023) typically seen only in PTFE materials.
电磁集成解决方案
描述- API Technologies提供全面的同轴EMI电磁频谱管理解决方案，包括从元器件到复杂组装的完整产品线。公司自1968年以来一直是全球领先的定制应用特定EMI滤波器解决方案提供商。API提供灵活的EMI滤波解决方案，包括在电源、I/O连接、屏障墙或PCB上滤波。产品线包括电感器、玻璃和树脂密封滤波器、SMT滤波器、滤波板、滤波连接器、电源入口和电源线滤波器以及军用/航空航天多节滤波器。API还提供设计和支持服务，包括广泛的EMC和环境测试，以及800多种标准QPL产品和DSCC零件号。产品应用范围广泛，包括电源、信号线、医疗设备、电信设备、航空航天应用、工业控制系统、直流电机、微波滤波器、国防应用等。
Eaton Bussmann（伊顿巴斯曼）Power Defense™塑壳断路器选型指南
目录- Introduction Technical overview Engineering Dimension Ordering
型号- PDC4XMCI,PXR FAMILY,PDG3XFPMC3P,PDC2X3T250RC,PDC1XHMCEK,PDG2XIPPB,PDG2XHMCSK,PDC719308,PDC719307,PDC2XFPMC3P,PDC2X4TA250CW,PDC3XPIBB4P630A,PDC1XHMCEP,PDG2XIB3P,PDC1XUV24DCV,PDC1XHMCEN,PDG3XPHB,PDC719309,PDC719421,PDG2XTC4P,PDC3XLZM3ADP4P,PDC719423,PDC719422,PDG4XHMCSNP,PDG2XPLKROFF,PDC1X4TA160CW,PDG4XHMCSNK,PDG2XUV440ACV,PDE46XXXXXTAAS,PDC4X4T1000RC,PDG2XHMCSN,PDC2XFPMC4P,PDE1XROP240AC,PDG2XHMCSP,PDG2XIB4P,PDC719310,PDC1X4T160,PDE43XXXXXB1NS,PDG4X4TA800CW,M22-K10,300374-MK,PDC3X3T630RC,PDC4XIPDB3P,PDC1XHMDEK,PDG2XHMDSK,PDC719209,PDC719208,PDC1XHMDEP,PDC719207,PDC719201,PDC719200,PDE1XRCD4P100F030,PDC719203,PDE44XXXXXSNNS,PDC719202,PDC710408,PDE1XRCD3P100,PDC710407,M22-K01,PDC710406,PDC710405,PDG3X3TA630CW,PDG2XST250ACDCT,PDG4XUV24DCV,PDC4XIPDB4P,PDC3X4TS630,PDG2XHMDSP,PDG2XLZMADP3P,PDC4XWDR3P1000A,PDC710402,PDC710401,PDC710400,PDC719210,PDG2XTC3P,PDG4XUV240ACV,PDC3XLZM3ADP3P,PDC719215,PDE2XROP24DC,PDG3XROPXMCI,PDG4XPHB,PDE23XXXXXB1NS,PDC719470,PDC710414,PDC1XIPDBRH,PDC2XIB,PDG3XST24ACDCT,PDE1XRCD4P100,PDC710413,PDC719223,PDC710412,PDC719222,PDC710411,PDC719221,PDC719220,PDC719469,PDC719468,PDE23XXXXXSNNS,PDC710309,PDC710308,PDC710307,PDG3XPLKTOFF,PDC710428,PDC710306,PDC710305,PDC710426,PDE24XXXXXB8NS,PDC710304,PDC710425,PDC9XPIBB3P160A,PDC9X3EHTS160,PDC2XPIBB4P250A,PDE2XROPT24DC,PDC1X3T160,PDC710303,PDC710424,PDC710302,PDC710423,PDE1XRCD4P160F300S,PDC710301,PDC710300,PDE1XRCD3P100F300,PDC1XIPDB3P,PDC9XPIBK4P160A,PDC710319,PDC710318,PDE2XRCD4P250,PDC710317,PDC710438,260154,PDC710316,PDC710315,PDC12XIPDBRO,PDC710436,PDE33XXXXXVAAS,PDC1XPIBB3P160A,PDE,PDG3XWDR3P630A,PDE24XXXXXVAAS,PDC1XUV24ACV,PDC710314,PDC710313,PDC719002,PDE2XROP240AC,PDC710312,PDC710433,PDC719001,PDC710311,PDC710310,PDC710431,PDC710430,PDC719006,PDC719005,PDE26XXXXXTAAS,PDE3XRCD4P630,PDC710209,PDC710328,PDC710449,PDC710327,PDC710448,PDC710326,PDC710447,PDC2X4TS250,PDE46XXXXXVAAS,PDG2XUV18DCW,PDC4X4TS1000,PDC719019,PDC710325,PDC710446,PDC710324,PDC710445,PDE13XXXXXTAAJ,PDC710323,PDC710444,PDC710322,PDC710443,PDC710321,PDC719018,PDC710320,PDC719017,PDG3XIB4P,216378,216376,PDC710339,PDC710338,PDG2XALMBC,PDC710337,PDC2X3TA250CW,PDC2X3T160,PDG2XHMDS,PDC710457,PDC710334,PDC710455,PDC2XMCI,PDC710333,PDC710454,PDC710212,PDC710332,PDC710453,PDC719029,PDC710211,PDC710331,PDC710452,PDC719028,PDC710210,PDE44XXXXXVAAS,PDC710451,PDC719027,PDC710450,PDC1XROPXMCI,PDE26XXXXXVAAS,PDC1XST24ACDCT,PDG2XROPXMCIS,PDC1XROPXMCIS,PDC710349,PDC710469,PDG4XST440ACT,PDC710348,PDG2XUV24ACV,PDC1XIB,PDG4XHMCEN,PDG4XHMCEP,PDC9X3T100,PDG4XHMCEK,PDC710460,PDG2XROPXMCI,PDG3XUV18DCW,PDC710468,PDC710346,PDC710345,PDC710465,PDC710344,PDC710464,PDC710343,PDC710463,PDC719039,PDC710462,PDC719038,PDE23XXXXXB8NS,PDC710461,PDC719037,PDC710340,PDE13(4)G..16 A,PDC710359,PDG4XHMDS,PDE36XXXXXVAAS,PDC1X4TS160,PDC710471,PDC710470,PDE1XRCD4P160F030S,PDC1XPLKTOFF,PDC719047,PDC710358,PDC4XLZM4ADP4P,PDC710357,PDC710477,PDC710356,PDC710476,PDC710355,PDC710475,PDC710474,PDC719049,PDC719048,PDC719061,PDC719060,PDC710009,PDG2XHMDE,PDC719063,PDC710129,PDC719062,PDC710128,PDC710361,PDC710360,PDC710481,PDC710480,PDE11XXXXXTFFJ,PDE34XXXXXVAAS,PDC3XPIBB3P630A,PDG2XST440ACT,PDG2XHMCS,PDC1XST440ACT,PDC710369,PDC719058,PDG2XHMCE,PDC710368,PDC710489,PDC719057,PDC4XLZM4ADP3P,PDC710367,PDC710488,PDE1XRCD4P100F300,PDC719056,PDC710366,PDC710365,PDC710364,PDC710485,PDC710363,PDC710484,PDC710362,PDC719059,PDE1XRCD4P160S,PDC2XPIBB3P250A,PDG3XHMDEP,PDC1X4T160RC,PDC2XTC4P,PDE3XROP440AC,PDG2XFP4P,PDE24XXXXXTAAS,PDC2XIB3P,PDE33XXXXXSNNS,PDC3XMCI,PDG2XHMCENK,PDC710130,PDE14XXXXXTAAJ,PDC710491,PDC710490,PDC710259,PDG2XFP3P,PDC710258,PDC710257,PDG3XHMDEK,PDC710499,PDC710498,PDE13(4)F..16 A,PDG4XHMCE,PDC710495,PDC710010,PDC710494,PDC710131,PDE2,PDE1,PDE4,PDE3,PDE710034,PDE710035,PDG2XALMEC,PDC2XIB4P,PDC1XPIBK3P160A,PDE710036,PDE710037,PDE710030,PDE9,PDE710031,PDE710032,PDG2XHMCENP,PDG4XHMCS,PDC2XPIBK4P250A,PDE710033,PDC710262,PDC9X3TS160,PDE34XXXXXTAAS,PDC710261,PDC710260,PDC3X4TSP630,PDG2XDIN75,PDC710269,PDC710268,PDE13XXXXXVAAJ,PDC710267,PDC710266,PDC710265,PDC710264,PDG4XHMDE,PDC710263,PDG3XUV440ACV,PDE23K0016TAAS,PDG3XHMCEP,PDE710023,PDE710024,PDE710025,PDE710026,PDE710020,PDE710021,PDE710022,PDC710394,PDC710273,PDC710272,PDE1XRCD3P160F300S,PDC3X3TSP630,PDC710271,PDC710270,PDE710027,PDE710028,PDE710029,PDG3XHMCEN,PDC1X3T160RC,PDC710279,PDG3XHMCEK,PDC710278,PDC710399,PDC710398,PDC710277,PDC710035,PDC710397,PDC710276,PDC710034,PDC710396,PDC1XDIN35,PDC710275,PDC710033,PDC710395,PDC710274,PDC710032,PDG2XHMCEP,PDC1XUV18DCW,PDC2XTC3P,PDE43XXXXXSNNS,PDG3XFPMC4P,PDE710012,PDG12XHMS507,PDE710013,PDG4XPLKTOFF,PDE710014,PDE710015,PDG4XIB,PDG4XHMDEP,PDE710010,PDE710011,PDC710284,PDC710283,PDC710282,PDC710281,PDG4XHMDEK,PDC710280,PDE710016,PDE710017,PDE710018,PDE4XROP24DC,PDE710019,PDG2XHMCEK,PDC710289,PDC710047,PDC710288,PDC710046,PDC710287,PDG4X3TA800CW,PDC710045,PDG2XHMCEN,PDC710286,PDC710044,PDC710285,185149,PDC2XFP3P,PDE36XXXXXTAAS,PDGXNN,PDE710001,PDG3XST440ACT,PDE710002,PDE710003,PDE710004,PDG34XHMS445,PDC710295,PDC710174,P
用于航空航天和国防的ARINC 801光纤互连
描述- Cannon公司提供ARINC 801光纤互连解决方案，包括连接器、端子和电缆束，适用于航空航天和防务领域。这些解决方案支持高速数据、视频和信号传输，适用于极端环境。产品特点包括高速度、轻便、可靠，并具备全面的制造能力，包括测试、检验和抛光。Cannon公司提供全球服务和支持，致力于创新和客户合作。
型号- ARC 38999,12F5C2,20F12Q8,ARINC 801,195-1021-000,ARC/T-1-PP125A,36F36,17Q2,BKARD2QF203M30001*F0,195-3001-107,195-3001-106,195-3001-105,195-3001-104,ARC38999-STYLE,195-3001-103,195-3001-102,ARC38999-STYLE/26FD6PNXXXX,195-3001-101,20F12T8,195-3001-100
SMART Modular Introduces Ruggedized, High-Speed, High Capacity, High Security T6EN SSDs for Aerospace, Defense and Industrial Applications
SMART Modular Technologies announced its new ruggedized T6EN PCIe/NVMe flash drives for aerospace, defense, and industrial applications. This new family of SSDs is available in U.2, E1.S and M.2 2280 form factors, enabling flexibility for end users based on their specific application and configuration needs.
用于射频和微波应用的Sivolam SV260-30-H/H PCB层压板
描述- 本资料介绍了Sivolam公司的SV260-30-H/H射频与微波应用PCB覆铜板。该产品基于Sivolam成熟的保护层压技术，采用专有的聚丙烯树脂混合物制成。资料提供了详细的典型规格值，包括介电常数、损耗因子、剥离强度、吸湿率、体积电阻率、表面电阻率、击穿电压、拉伸强度、热导率、CTE（膨胀系数）、阻燃性、工作温度范围、加工温度、耐热变形温度、熔融温度、蚀刻后基材收缩率和RoHS无铅兼容性等。
型号- SV260-30-H/H
授权代理品牌：集成电路
授权代理品牌：分立元件
授权代理品牌：接插件及结构件
授权代理品牌：部件、组件及配件
授权代理品牌：电源及模块
授权代理品牌：电子材料
授权代理品牌：仪器仪表及测试配组件
授权代理品牌：电工工具及材料
授权代理品牌：机械电子元件
授权代理品牌：加工与定制
我要提问
登录 | 立即注册
提交评论