The Benefits of Pseudo SLC (pSLC) Flash with Customizable Endurance
Single-level cell (SLC) NAND has always been the “golden standard” for industrial applications that require maximum reliability, performance and endurance. As its name implies, SLC is a type of NAND Flash that stores only one bit of data per cell, so it has the advantage of faster write speeds and longer service life. Because SLC stores less data in each cell, storage devices based on this type of NAND flash cost higher and have lower capacities than those using other types. This translates to the highest cost per gigabyte among all flash types.
Data Storage Challenges
As the Industrial Internet of Things (IIoT), smart factories, autonomous vehicles and other data-intensive applications continue to gain traction, data storage requirements for such applications become more challenging. Organizations have to contend with infrastructure, security, diversity and data volume concerns, while considering the bottom line to make the most of their investments.
Due to the high cost of SLC flash, mission-critical industrial applications resort to using multi-level cell (MLC) or triple-level cell (TLC) flash to meet tight budgets when purchasing data storage devices. MLC stores two bits of data per cell while TLC stores three bits, allowing flash storage products to be available in higher densities and significantly lower costs than SLC. Advancements in controller design and the 3D NAND architecture have made it possible for MLC/TLC flash to become more reliable, but many applications still require higher levels of reliability and endurance balanced with higher usable densities.
Another pressing challenge is the diversity of use cases. Different workloads could require different assessment and drive configuration requirements for almost every customer. To save on purchase costs, some industries choose off-the-shelf solutions that may not fit the application-specific requirements.
Once deployed, they might easily wear out due to increased workloads, high program/erase (P/E) cycles, and extended temperatures. Low endurance, low tolerance to wide temperature ranges, and low reliability because of high error rates will eventually lead to more system down time, frequent component replacements and ultimately, higher costs.
A Closer Look at MLC/TLC NAND Flash
Why do MLC and TLC flash memories perform slower, have lower reliability and have shorter endurance?
SLC flash memory can hold one data bit, which allows the flash to have two states with a value of either 0 or 1. A cell is considered “programmed” or written to with a value of 0 and “erased” when it has a value of 1. Only one reference voltage is required to differentiate or distinguish between 0 and 1.
MLC stores two data bits of per cell, which allows the flash to have four states with values of 00, 01, 10, or 11. It takes two steps to program data on MLC; thus, the writing process is much slower than SLC. It takes three reference voltages to isolate the four states.
TLC stores three bits of data per cell, increasing the states to eight, with the values of 111, 011, 001, 101, 100, 000, 010 and 110 so the writing process is even slower than MLC’s. It takes seven reference voltages to separate the eight states.
The following table compares the three NAND flash types.
Table 1. NAND Flash Types and Threshold Voltage (Vth) Distribution
To increase density in one memory chip, manufacturers employ “scaling,” which involves shrinking cells to fit more in a die. Since MLC holds more data, cells in the array are closer. Every time data is written to a cell, voltage is applied to that cell. As more voltage is applied, the programming operation affects, not only the Vth of that particular cell, but also of adjacent or surrounding cells. As temperature increases with the application of more voltage, electron leakage occurs. As a result, MLC wears out faster, altering the cells’ original state, which in turn leads to errors when the cell is read, and memory cells interfering with each other’s operations.
This phenomenon is called program interference, which affects surrounding cells and leading to errors. The error rate increases with each programming step. MLC controllers typically have powerful error correction algorithms, but it also takes time to guarantee accuracy, resulting in slower throughput.
A related occurrence arising from the scaling down of memory cells is read disturbance. When a row of cells is read, it impacts the threshold voltage of the surrounding unread cells, alters their logical states, and leads to read errors that impact flash endurance.
Pseudo SLC: The Golden Mean
For mission-critical applications where reliability and long usage life are essential, SLC is ideal but its cost is prohibitive, and capacities may be too low for some applications. MLC and TLC offer higher capacities and are more cost-friendly, but some applications require higher reliability and endurance. Could there be a middle ground or “golden mean” that could offer the best of both worlds, offering superior performance, durability and reliability at ample capacities and more accessible price points?
The answer is “Yes,” and it is called pseudo SLC (pSLC), which also goes by several marketing names such as enhanced MLC, superMLC, iSLC, advanced MLC (aMLC). The main idea is to make MLC/TLC function like SLC by storing only one data bit per cell instead of two or three.
ATP Electronics’ Premium Line: 3D TLC SSDs Configured as pSLC with Customizable Endurance
ATP recently launched the A700Pi/E700Pi Series, a new generation of Premium Line pSLC NAND-based embedded SSDs. These SSDs use advanced controller and firmware technologies to make sure that the offerings meet and even exceed the endurance requirements of demanding applications.
By offering the best balance between SLC and TLC, ATP’s pSLC-based embedded SSDs offer the best total cost of ownership (TCO) value for cost in terms of endurance, as measured in terabytes written (TBW) and drive writes per day (DWPD).
A game-changing highlight for this generation is a new ATP-developed firmware and supporting mass production infrastructure, which are fully customizable to endurance configurations that are tailor-fitted to customer’s requirements, to address any variety of embedded/industrial usage cases. This once again demonstrates ATP’s commitment to deliver optimal total cost of ownership (TCO) value for its customers as storage demands of the Industrial Internet of Things (IIoT), edge computing, and other high-reliability applications continue on the upsurge.
The succeeding paragraphs provide more details on the endurance benefits and configurations of the new A700Pi/E700Pi Series. If customers need special endurance specifications beyond what is specified in this article, they are welcome to inquire and discuss their requirements with ATP sales representatives in their area.
The following table shows the advantages of the A700Pi/E700Pi Series.
Table 2. ATP’s Customizable Premium Line with 3D TLC NAND flash configured as pSLC offers a balance in usable density at a better price point (Cost per GB), and impressive improvements in reliability, sustained performance, and endurance (Cost per TBW), which all boil down to best TCO value.
The following graph shows the new customizable pSLC-configured SATA III SSDs demonstrating significant improvements in endurance compared with default 3D TLC offerings.
Figure 1. Comparison of endurance ratings between default 3D TLC offerings and ATP’s new customizable pSLC-configured SATA SSDs.
ATP’s new Premium Line is available in both raw and managed NAND. Key specifications are provided in the succeeding table.
*Under highest Sequential write value. May vary by density, configuration and applications
Going Above and Beyond
The A700Pi and E700Pi Series are true game changers; however, ATP is constantly trying to break new ground and improve its offerings to deliver what customers need. If customers require special endurance requirements beyond those provided in this article, they are encouraged to explore and discuss possibilities with ATP sales representatives in their area.
Conclusion
ATP’s pSLC-based embedded SSDs with customizable endurance offer the optimum balance cost-performance-endurance balance. They address the diversity of use cases across different industries, allowing ATP to tailor-fit according to different workloads and applications.
ATP experts are available to help customers assess the best TCO solution through customization options. By carefully assessing, customizing and delivering products fitted to customer’s requirements, ATP can help ensure the most optimal purchase decisions.
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本文由青莲居士转载自ATP，原文标题为:The Benefits of Pseudo SLC (pSLC) Flash with Customizable Endurance，本站所有转载文章系出于传递更多信息之目的，且明确注明来源，不希望被转载的媒体或个人可与我们联系，我们将立即进行删除处理。
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SMART（世迈科技）DuraFlash™闪存产品选型指南
Company Portfolio/Products Applications Flash Storage Product Introduction 2.5” SATA M.2 SATA mSATA Slim SATA M.2 PCIe NVMe U.2 PCIe NVMe EDSFF / U.2 PCIe NVMe (Enterprise and Data Center SSDs) BGA eMMC 5.1 Memory Cards CF Cards/CFast Cards eUSB Flash Drives/USB Flash Drives RUGGED SSD LINE-UP
SMART - USB FLASH DRIVES,MICROSD CARDS,SD CARDS,M.2 2280 PCIE NVME,EMBEDDED SSDS,ENTERPRISE AND DATA CENTER SSDS,MSATA,M.2 PCIE NVME MODULE,固态驱动器,CFAST CARDS,USB FLASH DRIVES,BGA EMMC 5.1,MICROSD卡,SD CARDS,SOLID STATE DRIVES,SLIM SATA,CF CARDS,CF卡,CFAST卡,M.2 2280 SATA,MICROSD CARDS,SSD,M.2 PCIE NVME,M.2 PCIE NVME模块,M、 2个SATA,EUSB闪存驱动器,CFAST,ENTERPRISE/DATA CENTER SSD,2.5” SATA,MEMORY CARDS,EUSB,EMMC,SD CARDS,SD卡,存储卡,CFAST CARDS,EUSB FLASH DRIVES,固态硬盘,USB闪存驱动器,U.2 PCIE NVME,CF CARDS,EDSFF,2.5英寸SATA,NVME MODULES,超薄SATA,M.2 SATA,N200,R800,RU350,SP2800,S5E,RU150,T5E,M4,R800V,BGAE440,S1800,BGAE240,RD130M,ME2,M1HC,H9 CF,M1400,HU250E,M4P,T5EN,T5PFL,RU150E,N200V,T5PF,RD230M,MDC7000,XL+,RD230,NAS STORAGE,嵌入式计算,军事的,存储服务器,X86 SERVER-STORAGE APPLIANCES,NAVIGATION,游戏和工业控制应用,TRIPLE-LEVEL CELL 3D NAND,通信,AI ANALYTICS,汽车远程信息处理,DATA COMMUNICATIONS,SINGLE-BOARD COMPUTERS,SERVER/STORAGE CACHE ACCELERATORS,DIGITAL COMMERCIAL CAMCORDERS,服务器/存储缓存加速器,打印机,数据通信,X86服务器存储设备,COMMUNICATIONS,RFID SCANNERS,数据中心,POS,INDUSTRY STANDARD SERVERS,INDUSTRIAL CONTROL,TELECOM ROUTERS AND SWITCHES,网络设备,央视行业,NAS/SAN存储系统,NETWORKING,DATA CENTER,ATCA COMPUTE BLADES,COMMUNICATIONS,STORAGE SERVER,DEFENSE,人工智能,DATA COMMUNICATION,MILITARY,EMBEDDED COMPUTING,安防用单板计算机,医疗设备,ARTIFICIAL INTELLIGENCE,工控,DEFENSE,TELECOM,DATA CENTER,工业应用,工厂自动化,TRANSACTION INTENSIVE APPLICATIONS,DISTRIBUTED SCALE-OUT CLOUD SERVERS,电信和通信,MEDICAL EQUIPMENT,SERVER CACHE,HIGH-PERFORMANCE COMPUTING,NETWORKING,INDUSTRIAL METERS,工业仪表,PERSONAL PC,POS终端,AEROSPACE,SAN STORAGE SYSTEM,高性能计算,视频,INFOTAINMENT,分布式横向扩展云服务器,TELECOM AND COMMUNICATIONS,TELECOM AND NETWORKING ROUTERS AND SWITCHE,网络,导航,RFID扫描器,FACTORY AUTOMATION,OEM STORAGE APPLICATIONS,信息娱乐,工业控制设备,单板计算机,INDUSTRIAL INTERNET OF THINGS,GAMING AND INDUSTRIAL CONTROL APPLICTIONS,AUTOMOTIVE TELEMATICS,CCTV INDUSTRIES,INFOTAINMEN,安防,TELECOM INFRASTRUCTURE,INDUSTRIAL,TRANSPORTATION,IIOT,航空航天,GAMING AND INDUSTRIAL CONTROL APPLICATIONS,VIDEO,NAS / SAN STORAGE SYSTEMS,NETWORKING APPLIANCES,工业物联网,医疗器件,NETWORKING ROUTERS AND SWITCHES,NAS STORAGE SYSTEM,交通运输,游戏,数字商用摄像机,CLOUD COMPUTING,ATCA计算刀片,工业,TELECOM AND NETWORKING ROUTERS AND SWITCHES,MEDICAL DEVICES,PRINTERS,STORAGE CACHE ACCELERATORS,PRINTERS,INDUSTRIAL,INDUSTRIAL CONTROL EQUIPMENT,个人电脑,INDUSTRIAL CONTROL EQUIPMENT,电信基础设施,POS TERMINALS,INDUSTRIAL APPLICATIONS,电信和网络路由器和交换机,GAMING,SINGLE-BOARD COMPUTERS FOR DEFENSE,行业标准服务器
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Company Profile Segment Challenges and Solutions Thermal Solutions Endurance Solutions Security Solutions CFexpress & USB 3.0 Value Line SSDs DDR5 DRAM SOLUTIONS FLASH SOLUTIONS Flash Products Naming Rule Solutions & Technologies Flash Technology Overview table Complete Flash Spec Overview & Product Dimensions
ATP - ECC SO-DIMM,USB驱动器,MICROSD MEMORY CARDS,MICROSDHC CARD,DDR SO-DIMM,3D TLC SSDS,PCIE®GEN4高容量NVME M.2 2280固态硬盘,PCIE® GEN4 NVME U.2 SSD,SATA III 2.5" SSD,DDR2模块,PCIE® GEN 4 NVME M.2 2280 SSD,SD CARD,SATA III M.2 2280 SSD,PCIE®GEN4 NVME U.2固态硬盘,PCIE® GEN 3 NVME M.2 2280 SSD,NANODURA双通用闪存驱动器（UFD）,PCIE®GEN 3 NVME M.2型1620 HSBGA固态硬盘,SD CARDS,CFEXPRESS TYPE B MEMORY CARDS,DRAM,非ECC UDIMM,NVME固态硬盘,SECURSTOR MICROSD CARD,DDR2 MODULES,DDR4 RDIMMS,SATA III MSATA SSD,SSDS,PCIE® GEN 3 NVME M.2 2242 SSD,SD卡,LEGACY (SDR/DDR) DRAM MODULES,ECC UDIMM,NON-ECC UDIMM,PCIE® GEN4 NVME CFEXPRESS CARD,NANODURA双UFD,PCIE® GEN 3,PCIE® GEN 3 NVME M.2 TYPE 1620 HSBGA SSD,SDHC CARD,E.MMC,HIGH-SPEED TYPE B CFEXPRESS CARDS,高速B型CFEXPRESS卡,PCIE® GEN4 HIGH-CAPACITY NVME M.2 2280 SSD,DDR3模块,DDR5 DIMM,MICROSD卡,PCIE®GEN3 NVME U.2固态硬盘,SOLID STATE DRIVES,SDXC卡,DRAM MODULES,SATA III M.2 2242 SSD,PCIE® GEN3 NVME M.2 2242 SSD,NON-ECC SO-DIMM,DUAL-INLINE MEMORY MODULES (DIMMS),CFAST卡,NVME散热器球栅阵列（HSBGA）固态硬盘,PCIE®GEN 3 NVME M.2 2242固态硬盘,SD MEMORY CARDS,MICROSD CARDS,非ECC SO-DIMM,PCIE®GEN 3 NVME M.2 2280固态硬盘,SDHC卡,DDR3 UDIMM,DDR3 MODULES,PCIE® GEN3 NVME M.2 2280 SSD,存储卡,固态硬盘,DDR3 MODULES,SECURSTOR MICROSD卡,MICROSDXC CARD,DDR3 SO-DIMM,NAND FLASH MEMORY,PCIE® GEN3 NVME M.2 2230 SSD,DDR4模块,DDR5 MEMORY,DDR5 DIMMS,WIDE TEMPERATURE RDIMM,HSBGA SSDS,NVME HEAT SINK BALL GRID ARRAY (HSBGA) SSDS,DDR4-3200模块,SDXC CARD,NANODURA DUAL UNIVERSAL FLASH DRIVES (UFDS),SATA III 2.5英寸固态硬盘,DDR4-3200 MODULE,RDIMM,MICROSDHC卡,PCIE® GEN 3 NVME M.2 2230 SSD,DDR4 MODULES,DRAM模块,DDR4宽温度RDIMM,MICROSDXC卡,NVME SSDS,DDR5内存,MEMORY CARDS,NVME M.2 TYPE 1620 HSBGA SSD,SDRAM,DDR5模块,CFEXPRESS CARDS,DDR UDIMM,SATA III M.2 2280固态硬盘,UNIVERSAL FLASH DRIVES,PCIE® GEN3 NVME U.2 SSD,NANODURA DUAL UFDS,DDR1模块,DDR1 MODULES,U.2 SSD,MICROSD CARD,PCIE® GEN3 NVME,USB DRIVES,SOLID STATE DRIVES,SSD,DDR5 MODULES,NAND型闪存,DDR4 RDIMM,COMPACTFLASH CARD,DDR4 WIDE-TEMP RDIMMS,3D TLC固态硬盘,COMPACTFLASH卡,PCIE®GEN4 NVME CFEXPRESS卡,CFEXPRESS B型存储卡,CFAST CARD,PCIE®GEN 3 NVME M.2 2230固态硬盘,SDRAM SO-DIMM,PCIE®GEN 4 NVME M.2 2280固态硬盘,PCIE® GEN4 NVME M.2 2280 SSD,HSBGA固态硬盘,SATA III M.2 2242固态硬盘,A750PI,E650SC SERIES,S600SC,B800PI,S750 SERIES,S600SI,S600SCA,E750PC SERIES,B600SC,N700PC,S700SC,E650SC,A750 SERIES,E600VC,S800PI,A750PI SERIES,I800PI,A600VC,A650SI,A650SC,N700 SERIES,S650SI,N750,N750PI,A800PI,A700PI,N700SI,N650 SERIES,E600SAA,N700SC,A750,N600SC,A600VC SERIES,E600SA,E650SI,E650SI SERIES,N750 SERIES,E700PIA,TR-03153,N600SI,S650,S650SC,E700PAA,N650SIA,E600SI,B600SC SERIES,S750SC,S600SIA,I700SC,N650SI,N600VI,E600SIA,E750PI,N650SC,N750PI SERIES,N600VC,I600SC,E750PC,S700PI,A650 SERIES,N650,N600 SERIES,N600VC SERIES,S650 SERIES,A650,AES-256,E700PI,A600SI,E750PI SERIES,N700PI,E700PA,S750,S750PI,E700PC,A600SC,EDUCATION,汽车,TRANSPORTATION INFRASTRUCTURE,NETWORKING,AUTONOMOUS DRIVING,IN-VEHICLE,DIGITAL VIDEO RECORDERS (DVRS),AUTOMATION,TEST,驱动器记录器,DRIVE RECORDER,数据记录器,EDGE COMPUTING,AUTONOMOUS VEHICLES,能源,TRANSPORTATION SYSTEMS,网络,TEST & MEASUREMENT,工业4.0,无人机,CYBERSECURITY,MEC,自动化,汽车应用,网络安全,WEB SERVER,数据中心,AUTOMOTIVE APPLICATIONS,5G,AUTOMOTIVE,IVI,SD-WAN,EV INFRASTRUCTURE,MEASUREMENT,RAILWAY,电信,MEASURING SYSTEMS,NETWORKING,INDUSTRIAL,无风扇电脑,TRANSPORTATION,IIOT,航空航天,测量系统,车队管理,DATA CENTER,车内,FANLESS PC,TELECOMMUNICATIONS INDUSTRY,IOT,POINT-OF-SALE SYSTEMS(POS),电动汽车基础设施,物联网（IOT）,工业物联网,AUTOMOTIVE STORAGE,ENERGY,DEFENSE,FLEET MANAGEMENT,SURVEILLANCE SYSTEMS,交通运输,游戏,铁路,INDUSTRIAL 4.0,工业,国防,自动驾驶,AUTOMATION,INTERNET OF THINGS (IOT),BOX PC,测试,边际运算,测量,INTERNET OF THINGS,DATA LOGGER,NGFW,O-RAN,汽车存储,交通基础设施,TELECOM,INDUSTRIAL,TEST AND MEASUREMENT,教育,AEROSPACE,KIOSK,GAMING,DRONES
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ATP Electronics unveils its latest embedded MultiMedia Card (e.MMC) flash storage in the world’s smallest package — a size comparable to that of a standard die face, with up to 128 GB storage capacity. The E600Vc breaks dimension limits without compromising on advanced features, such as extremely low power consumption, reliable operation, high endurance, and commendable read/write performance.
ATP e.MMC v5.1嵌入式闪存存储解决方案
该资料介绍了ATP e.MMC v5.1嵌入式闪存解决方案，强调其在工业级性能、极端耐用性和可靠性方面的特点。它符合AEC-Q100 Grade 2和Grade 3标准，具有高耐久性，支持JEDEC e.MMC v5.1标准，并采用153球FBGA封装。ATP e.MMC集成了NAND闪存、复杂的闪存控制器和快速的多媒体卡（MMC）接口，适用于空间受限但需在恶劣环境中保持可靠性的嵌入式系统。
ATP - MANAGED NAND,管理NAND,E.MMC,E600SI,E650SC,E600SAA,E700PI,E600SA,E650SI,E600VC,E700PIA,E600SIA,E700PA,E750PI,E700PAA,E750PC,E700PC
DuraFlash™闪存存储产品
SMART Modular Technologies提供一系列的DRAM和Flash存储产品，包括内存模块、固态存储产品和混合解决方案。公司专注于为计算、网络、通信、存储、移动、军事、航空航天和工业市场提供标准、加固和定制内存和存储解决方案。产品线涵盖数据中心、人工智能/高性能计算、网络、工业物联网、交通、POS/游戏和军事/航空航天等多个应用领域。SMART Modular的DuraFlash产品系列提供多种形式的Flash存储解决方案，包括SSD、BGA、卡和USB等，以满足不同应用的需求。
SMART - MICROSD MEMORY CARDS,DURAFLASH MSATA,EDSFF PCLE NVME,MSATA,BGA EMMC 5.1,2.5” SATA SOLID STATE DRIVES,SD CARDS,SLIM SATA,2.5英寸SATA固态硬盘,CF CARDS,DURAFLASH M.2 PCIE NVME MODULES,欧盟安全理事会,M.2 SATA EMBEDDED SSDS,DURAFLASH MSATA,DURAFLASH U.2 PCIE NVME MODULES,EDSFF PCLE NVME,MEMORY CARDS,MICROSD存储卡,DURAFLASH固态硬盘,DURAFLASH M.2 SATA,SD卡,ENTERPRISE/DATA CENTER SSDS,EUSB FLASH DRIVES,DURAFLASH CARDS,HIGH-PERFORMANCE, HIGH-CAPACITY SOLID STATE DRIVES,超薄SATA,DURAFLASH BGA EMMC 5.1,DURAFLASH卡片,高性能、高容量固态驱动器,HIGH-PERFORMANCE, HIGH-CAPACITY SSDS,企业/数据中心SSD,高性能、高容量SSD,USB FLASH DRIVES,DURAFLASH M.2 PCIE NVME模块,MICROSD卡,DURAFLASH SLIM SATA,DURAFLASH USB,DURAFLASH SSDS,DURAFLASH超薄SATA,CF卡,MICROSD CARDS,M.2 PCIE NVME,DURAFLASH U.2 PCIE NVME模块,EUSB闪存驱动器,EUSB,存储卡,USB闪存驱动器,U.2 PCIE NVME,M.2 SATA嵌入式固态硬盘,R800,N200,RU350,S5E,RU150,MP3000,T5E,HU250E,RD530M,T5PFLC,T6CN,T5EN,RU150E,RP1700,T5PF,BGAE340,S1800,RD130M,RD230M,XL+,ME2,BGAE640,RD230,CLOUD COMPUTING,MEDICAL EQUIPMENT,嵌入式计算,SWITCHES,军事的,HIGH-PERFORMANCE COMPUTING,INDUSTRIAL METERS,工业仪表,X86 SERVER-STORAGE APPLIANCES,PERSONAL PC,POS终端,NAVIGATION,SAN STORAGE SYSTEMS,通信,高性能计算,网络路由器,AI ANALYTICS,汽车远程信息处理,INFOTAINMENT,分布式横向扩展云服务器,SINGLE-BOARD COMPUTERS,DIGITAL COMMERCIAL CAMCORDERS,网络,导航,打印机,数据通信,RFID扫描器,FACTORY AUTOMATION,X86服务器存储设备,COMMUNICATIONS,信息娱乐,工业控制设备,视频监控,单板计算机,RFID SCANNERS,INDUSTRIAL INTERNET OF THINGS,数据中心,NETWORKING ROUTERS,DATA COMMUNICATIONS,POS,人工智能分析,INDUSTRY STANDARD SERVERS,INDUSTRIAL CONTROL,网络设备,AUTOMOTIVE TELEMATICS,电信,安防,TELECOM INFRASTRUCTURE,NETWORKING,INDUSTRIAL,IIOT,航空航天,SAN存储系统,NETWORKING APPLIANCES,DATA CENTER,ATCA COMPUTE BLADES,工业物联网,医疗器件,NAS STORAGE SYSTEMS,INDUSTRIAL AUTOMATION MARKET,交通运输,人工智能,游戏,数字商用摄像机,VIDEO SURVEILLANCE,ATCA计算刀片,工业,MILITARY,云计算,EMBEDDED COMPUTING,MEDICAL DEVICES,医疗设备,ARTIFICIAL INTELLIGENCE,工控,PRINTERS,DEFENSE,TRANSPORTATION,TELECOM,INDUSTRIAL CONTROL EQUIPMENT,NAS存储系统,个人电脑,电信基础设施,工厂自动化,开关,POS TERMINALS,AEROSPACE,工业自动化市场,DISTRIBUTED SCALE-OUT CLOUD SERVERS,GAMING,行业标准服务器
【产品】ATP发布采用3D TLC NAND flash设计的A1性能等级SD/microSD卡产品系列S600Sia
2019年10月，专注于工业应用的存储解决方案领导厂商ATP Electronics（华腾国际科技）日前发布了其最新产品线 S600Sia, 这是ATP首个采用3D TLC NAND flash设计的A1 性能等级SD卡和microSD卡产品系列，是高可靠存储产品，可进行定制化设计，面向汽车电子及工业领域应用。
ATP（华腾国际）固态硬盘选型指南
Since 1991, we have consistently distinguished ourselves as one of the world’s leading original equipment manufacturers (OEM) of high-performance, high-quality and high-endurance NAND flash products and DRAM modules.
ATP - PCIE®GEN4 X4 M.2 2280，U.2 SSD,PCIE® GEN3 NVME M.2 2230 SSD,DDR5 MEMORY,PCIE®GEN3 NVME M.2 2230固态硬盘,MICROSDHC CARD,PCIE® GEN4 NVME U.2 SSD,SATA III 2.5" SSD,USB DRIVE,SD CARD,SATA III M.2 2280 SSD,SDXC CARD,PCIE®GEN3 NVME M.2 2280固态硬盘,SATA III 2.5英寸固态硬盘,PCIE®GEN4 NVME U.2固态硬盘,USB 2.0 EUSB,CFEXPRESS TYPE B MEMORY CARDS,M.2 TYPE 1620 HSBGA SSD,M.2 2242 SSD,NVME固态硬盘,MICROSDHC卡,PCIE® GEN4 X4 M.2 2280, U.2 SSDS,SECURSTOR MICROSD CARD,MSATA固态硬盘,PCIE® GEN4 NVME E1.S SSD,SATA III MSATA SSD,DRAM模块,PCIE®GEN4 NVME M.2 2280固态硬盘,MICROSDXC卡,NVME SSDS,DDR5内存,PCIE ® GEN4 NVME CFEXPRESS CARD,EMMC,SD卡,PCIE®GEN4 NVME E1.S固态硬盘,DRAM MODULES,M.2 2280固态硬盘,PCIE®GEN3 NVME M.2 2242固态硬盘,PCIE® GEN4 NVME CFEXPRESS CARD,NANODURA双UFD,E1.S PCIE GEN4 X4 SSD,SDHC CARD,袖珍闪存卡,E.MMC,PCIE® GEN3 NVME M.2 TYPE 1620 HSBGA SSD,MICROSD,M.2 2280 SSD,M.2 2230 SSD,SATA III M.2 2280固态硬盘,PCIE® GEN3 NVME U.2 SSD,NANODURA DUAL UFDS,MICROSD卡,CFEXPRESS卡,PCIE®GEN3 NVME U.2固态硬盘,SDXC卡,SATA III M.2 2242 SSD,PCIE® GEN3 NVME M.2 2242 SSD,MICROSD CARD,CFAST卡,1.ES PCIE GEN4 X4固态硬盘,SDHC卡,PCIE®GEN3 NVME M.2型1620 HSBGA固态硬盘,随身碟,CFEXPRESS CARD,COMPACTFLASH CARD,COMPACTFLASH卡,PCIE®GEN4 NVME CFEXPRESS卡,PCIE® GEN3 NVME M.2 2280 SSD,PCIE ® GEN3 NVME M.2 TYPE 1620 HSBGA SSD,EUSB,VALUE LINE SSDS,M.2型1620 HSBGA SSD,CFEXPRESS B型存储卡,CFAST CARD,M.2 2230固态硬盘,价值线固态硬盘,MSATA SSD,SECURSTOR MICROSD卡,PCIE® GEN4 NVME M.2 2280 SSD,MICROSDXC CARD,COMPACT FLASH CARD,M.2 2242固态硬盘,PCIE ® GEN3 NVME U.2 SSD,SATA III M.2 2242固态硬盘,A750PI,S600SC,B800PI,S750 SERIES,S600SI,B600SC,N700PC,A750 SERIES,E650SC,N601,N651SI,A600VI,S800PI,E600VC,I800PI,A600VC,A650SI,A650SC,N651SC,N750,S650SI,A600VI SERIES,N750PI,N651SIE,A800PI,N601 SERIES,A700PI,N651SIA,N650 SERIES,E600SAA,A750,A600VC SERIES,N600SC,E600SA,E650SI,N750 SERIES,E700PIA,N600SI,S650,S650SC,N651SI SERIES,E700PAA,B600SC SERIES,E600SI,N600VI SERIES,I700SC,N600VI,N650SI,E600SIA,N650SC,E750PI,N600VC,I600SC,E750PC,N651,S700PI,A650 SERIES,N650,N751PI,S700PC,N600VC SERIES,N651 SERIES,S650 SERIES,A650,N601SC,S750PC,E700PI,A600SI,N700PI,E700PA,S750,S750PI,E700PC,N651SCE,A600SC,数据记录,伺服器,汽车,AI SURVEILLANCE INFRASTRUCTURES,NETWORKING,ARTIFICIAL INTELLIGENCE (AI)-ENABLED SURVEILLANCE,HANDHELD COMPUTING,工业企业,物联网,手持计算,WEB SERVERS,网络,DATA LOGGING,POINT-OF-SALE (POS) TRANSACTIONS,自动化,IMAGING,企业,5G,STORAGE,成像,POS,销售点（POS）交易,BOX PCS,AUTOMOTIVE,SERVER,电信,ENTERPRISE,TRANSPORTATION,ROBOTICS,IOT,交通运输,SURVEILLANCE,人工智能（AI）监控,盒装PCS,边缘计算系统,工业,机器人学,AUTOMATION,EDGE COMPUTING,MISSION-CRITICAL APPLICATIONS,边际运算,INTERNET OF THINGS,EDGE COMPUTING SYSTEMS,TELECOM,INDUSTRIAL,INDUSTRIAL ENTERPRISE,关键任务应用程序,监控,存储器,人工智能监控基础设施,网络服务器
E700PI系列AF010GEC5A-SEK0111工业级SLC模式e.MMC数据表
本资料为ATP Electronics Inc.生产的工业级SLC模式e.MMC E700Pi系列产品的数据手册。该产品是一款嵌入式存储解决方案，采用MMC接口、闪存和控制器集成在同一IC封装中，适用于嵌入式和商业应用。产品具备高可靠性、高性能、长寿命等特点，支持多种高级功能，如动态数据刷新、自动刷新、SRAM软错误检测和恢复技术等。
ATP - INDUSTRIAL-GRADE SLC MODE E.MMC,INDUSTRIAL-GRADE E.MMC,工业级SLC模式E.MMC,工业级E.MMC,E700PI,E700PI SERIES,AF010GEC5A-SEK0111,COMMERCIAL APPLICATIONS,INDUSTRIAL,商业应用,工业
DuraFlash™BGAE640|eMMC|153引脚/100引脚
SMART Modular Technologies推出的DuraFlash BGAE640 eMMC是一款结合了NAND Flash内存、嵌入式MMC控制器和高级固件的固态存储解决方案。该产品旨在满足工业、医疗和网络市场的严格要求，符合eMMC v5.1标准，提供16GB至128GB的容量，适用于多种应用场景。
SMART - EMMC,SP9QCGY1ASI11,SP9QCGY1ASI01,SP9QDGY1ASI01,SP9QBGY1ASI01,KTMDGY1ASE01,SP9QBGY1ASI11,KTMDGY1ASI01,SP9MCGY1ASI11,SP9QDGY1ASI11,SP9MDGY1ASI11,SP9MAGY1ASI11,KTMAGY1ASE01,KTMCGY1ASI01,KTMBGY1ASE01,KTMAGY1ASI01,SP9MBGY1ASI11,KTMCGY1ASE01,SP9QAGY1ASI01,SP9QAGY1ASI11,BGAE640,KTMBGY1ASI01,NETWORKING APPLIANCES,RFID SCANNERS,TELECOM INFRASTRUCTURE,SINGLE-BOARD COMPUTERS,RFID扫描器,IIOT,MEDICAL DEVICES,POS TERMINALS,单板计算机,FACTORY AUTOMATION,POS终端,工业物联网,医疗器件,电信基础设施,工厂自动化,网络设备
ATP e.MMC v5.1 Embedded Flash Storage Solution
ATP e.MMC v5.1 是一款集成了NAND闪存、高级闪存控制器和快速MultiMedia Card（MMC）接口的高级存储解决方案。它具有工业级性能、极强耐用性和可靠性，适用于空间受限但需在恶劣环境中保持耐久性的嵌入式系统。
ATP - ATP E.MMC V5.1嵌入式闪存存储解决方案,ATP E.MMC V5.1 EMBEDDED FLASH STORAGE SOLUTION,E700PI,E700PIA,E600SIA,E800PI,E600SI,E700PAA,E600SAA,医学,AUTOMATION,NETWORKING,网络,TRANSPORTATION,IOT GATEWAYS / 5G SMALL CELL,EMBEDDED PCS,无人机,自动化,试验和测量,移动/手持计算机,SURVEILLANCE,嵌入式PC,交通运输,监控,TEST AND MEASUREMENT,MEDICAL,MOBILE/HANDHELD COMPUTERS,DRONES,物联网网关/5G小蜂窝
RU350|USB 3.2|USB闪存驱动器
SMART的RU350 USB闪存盘专为嵌入式应用提供低功耗、高容量的存储解决方案。采用注塑成型工艺，满足最小尺寸要求，并具备增强的可靠性，包括板载错误检测和纠正、静态和动态磨损平衡算法。产品支持USB 3.2 Gen 1接口，向后兼容USB 2.0。
SMART - USB FLASH DRIVE,USB闪存驱动器,RU350,SVJ33CGRSOE01,SVJ33BGRSOE01,SVJ33AGRSOE01,SVJ33BGRSOEI01,工业物联网,INDUSTRIAL,EMBEDDED APPLICATIONS,TRANSPORTATION,IIOT,交通运输,游戏,嵌入式应用程序,GAMING,工业
E600Si/E600Sia e.MMC 3D MLC and SLC Mode Reliability Report Summary
本报告旨在展示工业和汽车级3ATP e.MMC基于3D NAND MLC和SLC模式闪存的存储可靠性。报告涵盖了不同容量（16GB至128GB）的E600Si/E600Sia（3DMLC）和E700Pi/E700Pia（3DSLC模式）产品的数据保留测试结果，强调了其在高温和高循环次数下的可靠性和耐用性。
ATP - E.MMC 3D MLC AND SLC MODE,E.MMC 3D MLC和SLC模式,E700PI,E600SIA,E700PIA,E600SI
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品牌：SILICON LABS
品类：Wireless Gecko SoC
价格：￥8.1764
现货： 86,199
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提供语音芯片、MP3芯片、录音芯片、音频蓝牙芯片等IC定制，语音时长：40秒~3小时（外挂flash），可以外挂TF卡或U盘扩容。
最小起订量： 1pcs 提交需求>
可定制ATP TE Cooler的冷却功率：40~200W；运行电压：12/24/48V(DC)；控温精度：≤±0.1℃； 尺寸：冷面：20*20~500*300；热面：60*60~540*400 （长*宽；单位mm）。
最小起订量： 1 提交需求>
授权代理品牌：集成电路
授权代理品牌：分立元件
授权代理品牌：接插件及结构件
授权代理品牌：部件、组件及配件
授权代理品牌：电源及模块
授权代理品牌：电子材料
授权代理品牌：仪器仪表及测试配组件
授权代理品牌：电工工具及材料
授权代理品牌：机械电子元件
授权代理品牌：加工与定制
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