【技术】一文解析MLCC的四大发展方向——微型化、高容量化、高可靠方向、高频化

时间： 2022-08-10 来源：微容科技

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本文中微容科技将为大家解析MLCC的四大发展方向——微型化、高容量化、高可靠方向、高频化。MLCC（Multi-layer Ceramic Capacitors）是片式多层陶瓷电容器英文缩写。是由印好电极（内电极）的陶瓷介质膜片以错位的方式叠合起来，经过高温烧结形成陶瓷芯片，再在芯片的两端封上金属层（外电极），从而形成一个类似独石的结构体。

MLCC是重要的被动元件，诞生于20世纪60年代。因为有着可靠性高、体积小、损耗小、易于贴装等多种优势，快速成为电子产业的首选电容种类。伴随着家用电器、计算机、网络设备、手机、汽车等各类电子产业的发展，MLCC的市场用量大大增加，成为了“工业电子大米”。在广泛的市场应用中，MLCC技术也持续快速发展，高端MLCC成为市场和供应方共同的追求。而在中国，高端阻容元器件，也成了制约国家工业发展的“卡脖子工程”。

MLCC是几乎所有电子产品中使用数量最多的元器件，其特性会在多个方面影响整个电子产品的性能，因此对MLCC的要求也非常极致，由此带动的MLCC发展方向主要是四个方面。

第一是微型化

微型化是MLCC技术发展最显著的方向，早期的MLCC主要用于军工产品，对体积没有特殊要求，随着MLCC工业化，尤其是贱金属化之后，广泛应用于消费类电子，紧密配合着消费类电子的轻薄化、智能化的要求，持续微型化发展，以减轻产品重量、节省贴装空间和配合密集元器件贴装。目前小尺寸MLCC中最典型的是01005尺寸（英制，下同），在智能手机、芯片封装内、穿戴产品和高集成模块等产品中大量使用，其长宽仅0.04mm*0.02mm，肉眼已经看不清。

此外，还有更小一代的008004尺寸，长宽仅为0.02mm*0.01mm，主要粉体材料的粒径已进入亚微米级甚至纳米级水平。

二是高容量化

由于MLCC具备稳定的电性能、无极性、高可靠性的优点，在替代电解电容趋势的推动下，促使其高容量化发展以实现更大范围的替代，并且对于同一个MLCC尺寸，容量也不断提升。目前MLCC的0805以上的尺寸已量产100μF，小尺寸中0201尺寸也覆盖到了4.7μF和2.2μF。

三是高可靠方向

随着MLCC的应用场景扩展，对MLCC的可靠性要求越来越高，其中最具代表性的就是车规系列。汽车的智能化以及新能源汽车的兴起和发展，大大增加了车规MLCC的需求，使得车规产品成为MLCC行业的重要方向。

四是高频化

无线通信技术应用越来越丰富，特别是4G、5G技术的发展，将更多的产品连接和智能控制，与之匹配的射频元器件需求大增，且射频性能要求越来越高。射频MLCC通过元件内部结构的设计改良、微波陶瓷介质材料的优化以及低损耗特性的铜电极材料，实现低 ESR，强抗干扰，高SRF等特性。

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车规级A系列片式多层陶瓷电容器

型号- 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

2023/4/10 - 微容科技 - 数据手册代理服务技术支持现货查询批量订货