4 Key Factors on Copper Plating
Copper plating is an essential process for PCB manufacture and has a very important influence on PCB quality. The copper inside holes connects traces between different layers and the pins of THT components. In the very beginning, the PCB boards were mainly single-layer boards, which do not have copper side holes. Nowadays, the PCBs are becoming more and more dense with higher and higher layers, and smaller and smaller vias, with the development of copper plating technology.
SDY Electronic attaches great importance to the copper plating process and has built a well-organized system to manage the copper plating process.
There are four key factors in the copper plating process to ensure good quality of copper inside holes.
（1）Board abrasion.
There are sharp edges around holes after the drilling process. So those sharp edges have to be removed by abrasion.
（2）Board cleaning.
There are dust or impurity substances attached to the holes after the drilling process and movement, which have to be cleaned completely. Otherwise, the impurity substances may cause copper to be peeled off. SDY has a super high-pressure water cleaning machine to clean the boards before copper plating. The machine integrates board abrasion function as well, so the abraded materials are washed away by water immediately.
（3）Desmear.
Part of the resin of CCL is melted due to high temperature during the drilling process, and the melted resin is distributed irregularly inside the holes. This makes the surface of the hole wall in a rough condition. It has to make the surface of holes smooth and flat, in order to plate even copper with enough and average thickness.
（4）The copper plating facility.
Automatic copper plating lines are widely used nowadays. SDY has an automatic copper plating line, integrating desmear process with automatically controlled specifications. This not only increases the copper plating efficiency but also ensures the quality of copper plating.
Please feel free to contact SDY for any further questions or remove your worries about the copper plating of your PCB projects.
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本文由PlusLee转载自SDY News，原文标题为:4 key factors on copper plating，本站所有转载文章系出于传递更多信息之目的，且明确注明来源，不希望被转载的媒体或个人可与我们联系，我们将立即进行删除处理。
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