MiniSKiiP®DUAL with Advanced New Die-attach Technology，Strengthening The Bond between Chips and DCBs
Manufacturers expect more from power modules these days. Extended operating time at high temperatures is a top priority. VIN’s advanced new die-attach technology strengthens the bond between chips and DCBs to live up to those expectations all across the MiniSKiiP® product line.
Featuring latest-generation IGBT M7 and IGBT7 chips, VINCOTECH MiniSKiiP® DUAL products deliver the triple-play benefits of superior performance, multiple sourcing and longer life for flexible and scalable inverter designs with nominal currents up to 400 A.
Samples of the MiniSKiiP® with IGBT7 or IGBT M7 are available through our usual channels.
Main benefits
●More than ten times longer life at high operating temperatures
●Latest-gen chips up efficiency and power density to help drive down system costs
●Less material usage (rather than copper bus bars) plus easy, solder-free assembly equals even greater savings
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本文由星晴123转载自Vincotech，原文标题为:MiniSKiiP®DUAL with advanced NEW die-attach technology，本站所有转载文章系出于传递更多信息之目的，且明确注明来源，不希望被转载的媒体或个人可与我们联系，我们将立即进行删除处理。
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