MiniSKiiP®DUAL with Advanced New Die-attach Technology，Strengthening The Bond between Chips and DCBs

时间： 2021-03-21 来源：Vincotech

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Manufacturers expect more from power modules these days. Extended operating time at high temperatures is a top priority. VIN’s advanced new die-attach technology strengthens the bond between chips and DCBs to live up to those expectations all across the MiniSKiiP® product line.

Featuring latest-generation IGBT M7 and IGBT7 chips, VINCOTECH MiniSKiiP^® DUAL products deliver the triple-play benefits of superior performance, multiple sourcing and longer life for flexible and scalable inverter designs with nominal currents up to 400 A.

Samples of the MiniSKiiP® with IGBT7 or IGBT M7 are available through our usual channels.

Main benefits

●More than ten times longer life at high operating temperatures

●Latest-gen chips up efficiency and power density to help drive down system costs

●Less material usage (rather than copper bus bars) plus easy, solder-free assembly equals even greater savings

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