【应用】华联电子高速光耦HPL6M257助力RS-485通讯隔离设计,速率高达15Mbit/s
RS485差分通信网络经常用于恶劣环境下的工业和仪器应用中,在恶劣环境下进行长距离通信时,可能出现引起链路损毁、接地噪声等问题,采用隔离型RS485方案可使得电路具有更强的抗干扰性和系统稳定性。
图1 HPL6M257 电路原理图
本文重点介绍国产厦门华联电子高速光耦HPL6M257助力RS-485通讯隔离设计,数据传输速率快高达15Mbit/s,逻辑门输出,输入、输出间绝缘电压高 VISO≥3750Vrms,采用双列贴片式8L塑料封装,正常工作温度范围-40°C~+105°C,具有很强的共模抑制能力高达20kV/μs,非常十分适合工业应用场合。
图2 HPL6M257 引脚定义和尺寸图
国产华联高速光耦HPL6M257助力458通讯隔离设计,具有以下几点优势:
1、数据传输速率快、高达15Mbit/s,高共模瞬抑制比20kV/μs ;
2、输出端为CMOS输出,产品具有很强的共模抑制能力。 正常工作温度范围-40°C~+105°C;
3、3750Vrms的电气隔离,防止共模干扰以及隔离高压保护用户人生安全;
如上所述,华联高速光耦HPL6M257非常十分适合工业应用场合,市场主流封装,国产化替代封装兼容,在工业市场广泛应用,通过VDE和UL安规认证,国产器件性价比高,供货和技术支持都能够快速响应。
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可加工PCB板层数:0-60层,板材类型:高频板/高速板/高频混压板/盲埋孔板/HDI板/无卤素板/厚铜板/刚柔结合板;最大加工尺寸:622*1200MM;板厚:0.05-8.0MM;铜厚:0.33-30OZ;
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