Rogers Germany GmbH Receives TOP 100 Seal for Successes in Innovation，Which Has Made a Name for Itself in the Field of Ceramic Substrates and Cooling Solutions
Eschenbach, Germany, March 7, 2023——ROGERS Germany GmbH from Eschenbach in the Upper Palatinate received the 2023 TOP 100 seal awarded by compamedia recognizing its successes in innovation. The annual award is given to the top medium-sized companies throughout Germany after a comprehensive evaluation and selection process. Science journalist Ranga Yogeshwar, a mentor of the TOP 100 innovation competition, will congratulate Rogers Germany at the award ceremony in Augsburg on June 23.
Innovation researcher Prof. Dr. Nikolaus Franke from the Vienna University of Economics (WU Vienna) and his team evaluated Rogers for compamedia based on more than 100 criteria from five categories: innovation promotion of top management, innovation climate, innovative processes and organization, external orientation/open innovation and innovation success. The evaluation considers whether innovations at the companies are systematically planned and repeatable or if they occur by chance.
This year is the first time Rogers Germany has received the TOP 100 award. Rogers Germany is active in the field of power electronics and has made a name for itself in the field of ceramic substrates and cooling solutions. The company is part of Rogers Corporation, a global leader in engineered materials to power, protect, and connect our world. With more than 190 years of materials science experience, Rogers delivers high-performance solutions that enable clean energy, internet connectivity, and safety and protection applications, as well as other technologies where reliability is critical. Headquartered in Chandler, Arizona (USA), Rogers operates manufacturing facilities in the United States, China, Germany, Belgium, Hungary, and South Korea, with joint ventures and sales offices worldwide.
According to Jeff Tsao, VP, and General Manager of Rogers’ Power Electronic Solutions (PES) business, the business is a leader in providing power packaging solutions and power interconnect solutions solving the most challenging thermal, efficiency, and reliability problems for next-generation electric vehicles, renewable energy, and industrial applications. Rogers has a team of experts in Eschenbach, Germany working closely with global customers to custom design, develop, and manufacture power semiconductor packaging solutions by providing ceramic substrates and active cooling solutions to improve the thermal performance and reliability of power modules and laser diodes used in electric vehicle inverters, industrial variable frequency drives, and renewable DC-AC inverters.
“Due to the constant increase in demand for higher reliability and improved thermal conductivity to increase power density while lowering customers' total cost of ownership, our team has been driving both product and manufacturing process technology innovation to solve our customers’ challenging problems for the past 30+ years,” said Tsao.
An example of Rogers Germany’s innovation included delivering a substrate for a new power semiconductor device called Silicon Carbide (SiC), which significantly improves the efficiency of electric vehicles to get the most out of their battery packs. The curamik® metallized ceramic substrates product line team worked directly with a leading global EV OEM to design and develop a ceramic substrate utilizing a new process called active metal brazing technology (AMB) to meet the performance, consistency, and reliability requirement for electric vehicles.
Tsao said Rogers is proud to receive this prestigious award and be recognized as a top innovator in the industry. “Rogers is committed to working with our customers to continue to invest in research and development at the Eschenbach site to solve the challenges of tomorrow and enable a cleaner environment for our future generations.”
The seal is awarded in three size classes: up to 50, 51 to 200, and more than 200 employees. This year is the 30th anniversary of TOP 100. Interest in the award is high, and 550 medium-sized companies applied for the 2023 award. Out of all applicants, 300 were awarded the TOP 100 seal. A maximum of 100 companies per size class can be awarded each year.
"The TOP 100 analyzes the importance of innovation to the companies it considers," said Franke. “Does the company default to routines and habits, or is the company able to question the status quo, to think creatively in new ways and assert itself successfully in the market?”
On June 23, all top innovators of the 2023 class will come together in Augsburg for the award ceremony at the German SME Summit. At this event, Yogeshwar will personally congratulate them on their success in the TOP 100.
Top 100: The Competition
Since 1993, compamedia has been awarding the TOP 100 seal for special innovative power and above-average innovative success to medium-sized companies. The scientific management has been in the hands of Prof. Dr. Nicholas Franke. Franke is the founder and director of the Institute for Entrepreneurship and Innovation at the Vienna University of Economics and Business (WU Vienna). With 26 research awards and more than 200 publications, he is one of the leading international innovation researchers. TOP 100's mentor is science journalist Ranga Yogeshwar. Project partners are the Fraunhofer Society for the Promotion of Applied Research (FraunhoferGesellschaft zur Förderung der angewandten Forschung) and the association of medium-sized companies BVMW (Bundesverband mittelständische Wirtschaft). The magazine's manager magazin, impulse, and ZEIT für Unternehmer accompany the company comparison as media partners.
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电子精细陶瓷
本文介绍了Kyocera公司精细陶瓷材料在电子行业中的应用，包括陶瓷基板、散热基板、功能材料和设备外围设备等。文章详细阐述了这些材料的特点、应用领域和设计指南，旨在支持电子设备的微型化和功能提升。
KYOCERA - CERAMIC SUBSTRATES,SAPPHIRE COVER PLATES,薄膜印刷基板,蓝宝石盖板,LED SUB-MOUNT SUBSTRATE,氧化铝金属化基板,THIN FILM PRINTING SUBSTRATES,压电PZT基片,THICK FILM PRINTING SUBSTRATES,FINE CERAMICS,SINGLE CRYSTAL SAPPHIRE SUBSTRATES,LONG THICK FILM PRINTING SUBSTRATES,精密陶瓷,电路板基板,INDUCTOR CORES,CIRCUIT BOARD SUBSTRATES,长厚膜印刷基板,POLISHED THIN FILM PRINTING SUBSTRATES,电感磁芯,PIEZOELECTRIC PZT SUBSTRATES,HEAT DISSIPATION SUBSTRATES,耐高压氧化铝陶瓷,陶瓷基板,抛光薄膜印刷基板,超薄陶瓷帽,散热基板,POWER DEVICE SUBSTRATES,散热结构陶瓷基板,HIGH VOLTAGE-RESISTANT ALUMINA CERAMIC,ULTRA THIN CERAMIC CAPS,蓝宝石单晶基板,厚膜印刷基板,HIGH REFLECTIVITY ALUMINA SUBSTRATES,HEAT DISSIPATION STRUCTURE CERAMIC SUBSTRATES,功率器件基板,ALUMINA METALLIZED SUBSTRATES,高反射率氧化铝基板,LED子安装基板,AO479G,A480S,SN240,AO480S,A445,SO211O,SA100,SN201B,A479S,A479M,F1120,F1023O,AO476O,F1023,F1120O,A479G,Z201N,AN2000,SO210O,A459,A479,A476,AO473O,A473,AO445O,ZO201N,AO479S,S210,SN240O,AO479M,S211,AN216A,AO479O,AO459K,医学,THERMOSTATS,恒温器,INSULATORS,分析设备,电子束发生器,热交换器部件,半导体加工工具,FILTERS FOR BASE TRANCEIVER STATIONS,保险丝,ACTUATOR COMPONENTS (POSITIONING CONTROL),超高真空馈通,BULBS,DOWN LIGHTS,筒灯,加热元件冷却器,灯泡,INDUSTRIAL X-RAY TUBES,LED SUB-MOUNT ASSEMBLY,ELECTRON BEAM GENERATORS,管灯,各种传感器,MICRO REACTORS,工业X射线管,HIGH VOLTAGE ACCELERATORS,ANALYSIS EQUIPMENT,FUSES,执行器部件（定位控制）,HEAT ELEMENT COOLERS,基站收发信台用滤波器,HEAT EXCHANGER COMPONENTS,陶瓷零件,CERAMIC PARTS,THERMAL INSULATION COMPONENTS,LED子安装组件,热控部件,THERMAL CONTROL COMPONENTS,微反应器,VARIOUS SENSORS,ULTRA HIGH VACUUM FEEDTHROUGHS,MEDICAL,TUBE LIGHTS,绝热构件,绝缘子,SEMICONDUCTOR PROCESSING TOOLS,高压加速器
Copper Is Here to Stay in Power Electronics
Copper is a well-established material for base plates and heat sinks because of its thermal conductivity. Furthermore, it has become important for the metallization and interconnection of power devices. The ever-growing power density, current carrying capability and reliability requirements are factors to why copper is already widespread in the industry. Copper is readily available, relatively inexpensive, and not likely to disappear anytime soon.
金属化陶瓷基板的可靠性
本资料主要探讨了金属化陶瓷基板的可靠性，包括影响其寿命的因素、测试条件、测试标准以及典型的失效机制。资料详细分析了原材料特性、基板设计、机械应力分析、测试条件、设计、可靠性和测试方法。此外，还提供了不同类型金属化陶瓷基板的热循环测试曲线和可靠性数据。
ROGERS - METALLIZED CERAMIC SUBSTRATES,金属化陶瓷基板,CURAMIK®,工业应用,INDUSTRIAL APPLICATIONS
Rogers developed Thermal Simulation Tools to Accelerate Time to Market
The team at Rogers developed a series of simulation tools using our extensive experience. In this blog, Rogers will showcase a small portion of these simulation tools using a simplified thermal model.
金属化陶瓷基板的可靠性技术说明
本文档主要讨论了金属化陶瓷基板的可靠性及其影响因素。内容涵盖了原材料特性、基板设计、测试条件、测试标准以及典型的失效机制。文章强调了热循环和热冲击测试在评估金属化陶瓷基板可靠性方面的重要性，并提供了不同类型基板在热循环测试中的性能对比。
ROGERS - METALLIZED CERAMIC SUBSTRATES,金属化陶瓷基板
京瓷公司简介
KYOCERA - GAN LASER DIODE DEVICES,气动切割工具,EV RELAY COMPONENTS,电动工具,氧传感器加热器,LASER FLASHLIGHT,刷牙后牙刷,摄像头模块,钽电容,晶体器件,CRYSTAL DEVICES,数码打印喷墨打印头,PRP PREPARATION KIT,太阳能电池,激光手电筒,ARTIFICIAL JOINTS,POWER TOOLS,AL COLLABORATIVE ROBOT SYSTEM,人工智能协作机器人系统,人工关节,珠宝陶瓷厨房用品,CUTTINGTOOLS PNEUMATIC,种植牙,AUTOMOTIVE CONNECTORS,TANTALUM CAPACITORS,STORAGE,CAMERA MODULES,POST-BRUSHING TOOTHBRUSH,DENTAL IMPLANTS,汽车连接器,电池和SOFC,光流测量模块,电动汽车继电器部件,OPTICAL UNITS,氮化镓激光二极管器件,陶瓷电容器,PRP制备试剂盒,JEWELRY CERAMIC KITCHEN GOODS,HEAD-UP-DISPLAY LCDS,SOLAR CELLS,车载毫米波雷达基板,光学单元,IN-VEHICLE MILLIMETER-WAVE RADAR SUBSTRATES,OPTICAL FLOW MEASUREMENT MODULE,OXYGEN-SENSOR HEATERS,BATTERIES SOFCS,CERAMIC CAPACITORS,平视显示器LCD,LASER DIODE MODULE,存储器,激光二极管模块,DIGITAL PRINTING INKJET PRINTHEADS,医学,ELECTRONICS,汽车,MOBILE PHONES,商用喷墨打印机,企业内容管理,ADAS,因特网,5G-COMPATIBLE LOT DEVICES,地段,基站,有机半导体,通信,无线通信,驾驶员辅助系统,ORGANIC SEMICONDUCTOR,液晶制造元件,DIGITAL PRINT,ENERGY,ENTERPRISE CONTENT MANAGEMENT,保健,能源,数码产品,打印机,COMMUNICATIONS,LOCAL 5G NETWORKS,LED LIGHTING,工业机械,WIRELESS COMMUNICATIONS,移动电话,LOT,CERAMIC SEMICONDUCTOR,ENVIRONMENT,MEDICAL,环境,多功能处理器,INTERNET,AUTOMOTIVE,基础设施到一切,ADVANCEMENTS,LIQUID CRYSTAL MANUFACTURING COMPONENTS,COMMERCIAL INKJET PRINTERS,INFRASTRUCTURE-TO-EVERYTHING,INFORMATION,5G兼容批次设备,ROADSIDE UNITS,FACTORY AUTOMATION,INTELLIGENT TRANSPORT SYSTEM,智能手机,MFPS,SMARTPHONES,DRIVER ASSISTANCE SYSTEMS,数字打印,自动驾驶,ICT ENGINEERING,智能交通系统,本地5G网络,路边单位,SEMICONDUCTOR MANUFACTURING COMPONENTS,LED,PRINTERS,AUTONOMOUS DRIVING,LED照明,ICT工程,INDUSTRIAL MACHINERY,发光二极管,陶瓷半导体,工厂自动化,HEALTHCARE,资讯,进步,BASE STATIONS,半导体制造元件
curamik®陶瓷基板AMB技术
本资料为curamik®陶瓷基板AMB技术的设计规则，主要内容包括几何属性、物理属性、质量标准以及附加设计特性。资料详细描述了陶瓷基板的类型、厚度、铜厚度、可用面积、物理性能、电性能等参数，并提供了设计规则和制造标准。
ROGERS - 陶瓷基板,CERAMIC SUBSTRATES,CURAMIK®
电子商城
品牌：ROGERS
品类：High Frequency Circuit Materials
价格：￥550.8681
现货： 6,415
品牌：ROGERS
品类：High Frequency Laminates
价格：￥2,617.4106
现货： 3,019
品牌：ROGERS
品类：Circuit Materials
价格：￥2,479.9453
现货： 760
品牌：ROGERS
品类：Antenna Grade Laminates
价格：￥2,989.4355
现货： 429
品牌：ROGERS
品类：Liquid Crystalline Polymer Circuit Material
价格：￥1,485.0299
现货： 253
品牌：ROGERS
品类：Antenna Grade Laminates
价格：￥2,571.9097
现货： 250
品牌：ROGERS
品类：PTFE/Woven Fiberglass Laminates
价格：￥16,030.1502
现货： 201
品牌：ROGERS
品类：High Frequency Circuit Materials
价格：￥4,679.1859
现货： 180
服务
使用FloTHERM和Smart CFD软件，提供前期热仿真模拟、结构设计调整建议、中期样品测试和后期生产供应的一站式服务，热仿真技术团队专业指导。
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授权代理品牌：接插件及结构件
授权代理品牌：部件、组件及配件
授权代理品牌：电源及模块
授权代理品牌：电子材料
授权代理品牌：仪器仪表及测试配组件
授权代理品牌：电工工具及材料
授权代理品牌：机械电子元件
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