EPC Has Introduced A 100V, 65A Integrated Circuit Chipset Designed for 48V DC-DC Conversion
EPC has introduced a 100V, 65A integrated circuit chipset designed for 48V DC-DC conversion used in high-density computing applications and in 48V BLDC motor drives for e-mobility, robotics, and drones. The EPC23101 eGaN IC plus EPC2302 eGaN FET offers an ePower Chipset capable of a maximum withstand voltage of 100V, delivering up to 65A load current, while capable of switching speeds greater than 1MHz.
• Key features of the EPC23101 integrated circuit using EPC's proprietary GaN IC technology include integrated 3.3mOhm RDS(on) high side FET with gate driver, input logic interface, level shifting, bootstrap charging, gate drive buffer circuits and gate driver output to drive external low side eGaN FET.
• The EPC2302 eGaN FET offers a super small RDS(on), of just 1.8mOhm, together with very small QG, QGD, and QOSS parameters for low conduction and switching losses.
• Both devices feature a thermally enhanced QFN package with exposed top with optimized pinout between the two devices. The combined chipset footprint, is 7mm x 5mm, offering an extremely small solution size for the highest power density applications.
When operated in a 48V to 12V buck converter, the EPC23101 + EPC2302 chipset delivers 96% efficiency at 1MHz switching frequency and 97% efficiency at 500kHz switching frequency and can deliver 65A with less than 50°C temperature rise.
The ePower family of products makes it easy for designers to take advantage of the significant performance improvements made possible with GaN technology. Integrated devices are easier to design, easier to layout, easier to assemble, save space on the PCB, and increase efficiency.
"Discrete power transistors are entering their final chapter. Integrated GaN-on-Silicon offers higher performance in a smaller footprint with significantly reduced design engineering required," said Alex Lidow, CEO and co-founder of EPC. "From the serenity or control environment of digital and analog controllers, the ePower Chipset translates the PWM command signals to high voltage and high current waveforms capable of driving real world loads. Designers can use the ePower Chipset to make lighter weight and more precise battery-operated BLDC motor drives for eMotion, robotic arms and drones, higher efficiency 48V input DC/DC converters for data center, datacom, artificial intelligence, solar MPPT and other industrial and consumer applications."
Development Board
The EPC90142 development board is a 100V maximum device voltage, 65A maximum output current, half bridge featuring the EPC23101 Integrated ePower FET and EPC2302 eGaN FET. The purpose of this board is to simplify the evaluation process of the ePower Stage Chipset This 2" x 2"(50.8mm x 50.8mm) board is designed for optimal switching performance and contains all critical components for easy evaluation.
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本文由董慧转载自EPC，原文标题为:ePower Chipset Family for High Power Density Applications Chosen as Bodo’s Power System ‘Product of the Month’，本站所有转载文章系出于传递更多信息之目的，且明确注明来源，不希望被转载的媒体或个人可与我们联系，我们将立即进行删除处理。
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