Volta Product Pushes Testing Technology Boundaries, Achieving Short Signal Path Enabling Low and Stable Contact Resistance

时间： 2023-08-26 来源：Smiths Interconnect News

技术问答

Smiths Interconnect announced the release of the Volta Series probe heads optimized for wafer level chip scale package testing on Dec 06 2017.

As phones and smart devices get more powerful, so do the integrated chips that support them. Volta is used for testing the chips (while in their wafer form) that are behind everything from Bluetooth and power management to digital display controllers. Volta helps customers deliver higher quality products by ensuring the chips in them are up to specification, and perform as they should.

Volta is the result of Smiths Interconnect’s close collaboration with customers, and has been designed to significantly outperform the competition in durability and performance. It uses innovative, world-class electrical contact technologies and proprietary engineered materials to achieve improved performance and production efficiency.

In the Volta Series spring probe contacts are used in place of cantilever and traditional vertical probe card technologies. As part of Smiths Interconnect’s complete line of semiconductor test products, the Volta Series offers a number of differentiating benefits:

The design itself ensures an extremely short signal path enabling low and stable contact resistance, high current carrying capacity and longer life cycle.
Proprietary engineered plastic and machined ceramic materials used in the product make for improved planarity that allows increased test parallelism.
The housing allows for easy maintenance, quick installation and field repair potential that all add up to reduced cost of ownership.
The state-of-the-art Volta Manual Actuator (Lid) design allows sorted die tests at all sites simultaneously as well as eliminates the possibility of die cracking even after repetitive tests, enabling probe card bring-ups prior to the wafer availability.

“The semiconductor packaging industry is evolving quickly to accommodate complex functional integration of ICs for higher performance in smaller form factors,” said Jeff Dick, Marketing Vice President at Smiths Interconnect. “The technical challenges and increases in packaging costs are fueling the growth of Wafer Level Packages and Known Good Dies. Smiths Interconnect’s Volta Series addresses these trends with a cost-effective, high-performance option specifically designed to meet customers’ needs.”

发送到邮箱 |
+1 赞 0
收藏
评论 0
| 转发至：

本文由涂抹转载自Smiths Interconnect News，原文标题为:Volta Product Pushes Testing Technology Boundaries，本站所有转载文章系出于传递更多信息之目的，且明确注明来源，不希望被转载的媒体或个人可与我们联系，我们将立即进行删除处理。

全部评论（0）

暂无评论

Smiths Interconnect announced the launch of its Volta 200 Series Probe Head to Enhance Wafer Test Production Efficiency

A departure from cantilever and more traditional vertical probe technologies, the Volta Series enables quicker test set-up time and online cleaning ＆ maintenance while assuring impeccable site to site planarity. These benefits are a result of using spring probe contacts and a proprietary engineered housing material.

产品发布时间 : 2023-11-01

Smiths Interconnect‘s DaVinci 112 Test Socket Shortlisted for 2024 World Electronics Achievement Awards

Smiths Interconnect is proud to announce that its DaVinci 112 test socket has been shortlisted as one of the top Test ＆ Measurement products for the 2024 World Electronics Achievement Awards, hosted by AspenCore.

产品发布时间 : 2024-08-29

Smiths Interconnect Launches Press-Fit cPCI Connector Series to Enhance Efficiency, and Reduce Costs

Smiths Interconnect is thrilled to announce the release of the Press-Fit version of its renowned cPCI connector series. This innovative addition underscores Smiths Interconnect’s dedication to meeting the rigorous demands of the Defense, Space and Commercial Aerospace markets.

产品发布时间 : 2024-07-24

Volta 180 Series Probe Head Wafer Level Testing

型号- 851-0023038-H00,102119-H00,851-0012074-H01,VOLTA 180 SERIES,VOLTA 300,VOLTA 200,102120-H00,VOLTA 400,851-0023049-H00,VOLTA 180,102121-H00,VOLTA 250,VOLTA 350

数据手册 - SMITHS INTERCONNECT - Version 1.0 - 2020/12/01 PDF 英文下载查看更多版本

A Paradigm Shift in Simulation Techniques of Semiconductor Test Sockets

With the rise of the Internet of Everything (IoT), 5G, artificialin tellig ence ( AI ) and augmented reality (AR), high-performance test socket technology must keep pace. Performance specifications for test sockets published by suppliers should only be used as a general guideline in selecting the product family for a test application. Once a socket technology is chosen based on the general specification, suppliers should provide a more representative simulation of the socket based on the customer’s package layout with a focus on the high-speed areas of the device.

设计经验发布时间 : 2024-02-25

Smiths Interconnect推出晶圆级芯片测试头Volta 200系列产品的新闻稿

描述- 史密斯英特康推出的Volta系列测试头适用于200μm间距及以上晶圆级测试，为高可靠性WLP（晶圆级封装）、WLCSP（晶圆级芯片封装）和KGD（已确认的好芯片）测试程序提供更多优势，可满足客户对更高引脚数，更小间距尺寸，更高频率和更高并行度测试的要求。

型号- VOLTA 200

商品及供应商介绍 - SMITHS INTERCONNECT PDF 中文下载

Volta Series Probe Head Wafer Level Testing

型号- 102121-H00,102119-H00,851-0012074-H01,VOLTA 350,VOLTA 300,VOLTA 200,102120-H00,VOLTA 400

数据手册 - SMITHS INTERCONNECT - Version 1.0 - 2020/01/17 PDF 英文下载

【应用】新型Volta半导体探头测试解决方案，用于测试从蓝牙和电源管理等集成芯片封装

随着计算机、手机和智能设备变得越来越先进，支持它们的集成芯片也必须跟上这种变化。Smiths Interconnect的新型Volta半导体探头测试解决方案处于领先地位，这些解决方案用于测试从蓝牙和电源管理到数字显示器的所有背后的集成芯片封装。

应用方案发布时间 : 2022-03-02

Smiths Interconnect‘s Volta line of WLCSP Accelerating Device Brings up and Ramps up Production for WLCSP 5G Mobile ICs

As mobile phone electronics continue to shrink, WLCSP has become the de-facto packaging solution for IC’s going into today’s flagship handsets. Manufacturers need solutions to rapidly debug their new silicon, and quickly ramp it to HVM while achieving aggressive DPPB quality levels.

厂牌及品类发布时间 : 2023-09-18