Volta Product Pushes Testing Technology Boundaries, Achieving Short Signal Path Enabling Low and Stable Contact Resistance

时间： 2023-08-26 来源：Smiths Interconnect News

代理服务

技术支持

批量订货

Smiths Interconnect announced the release of the Volta Series probe heads optimized for wafer level chip scale package testing on Dec 06 2017.

As phones and smart devices get more powerful, so do the integrated chips that support them. Volta is used for testing the chips (while in their wafer form) that are behind everything from Bluetooth and power management to digital display controllers. Volta helps customers deliver higher quality products by ensuring the chips in them are up to specification, and perform as they should.

Volta is the result of Smiths Interconnect’s close collaboration with customers, and has been designed to significantly outperform the competition in durability and performance. It uses innovative, world-class electrical contact technologies and proprietary engineered materials to achieve improved performance and production efficiency.

In the Volta Series spring probe contacts are used in place of cantilever and traditional vertical probe card technologies. As part of Smiths Interconnect’s complete line of semiconductor test products, the Volta Series offers a number of differentiating benefits:

The design itself ensures an extremely short signal path enabling low and stable contact resistance, high current carrying capacity and longer life cycle.
Proprietary engineered plastic and machined ceramic materials used in the product make for improved planarity that allows increased test parallelism.
The housing allows for easy maintenance, quick installation and field repair potential that all add up to reduced cost of ownership.
The state-of-the-art Volta Manual Actuator (Lid) design allows sorted die tests at all sites simultaneously as well as eliminates the possibility of die cracking even after repetitive tests, enabling probe card bring-ups prior to the wafer availability.

“The semiconductor packaging industry is evolving quickly to accommodate complex functional integration of ICs for higher performance in smaller form factors,” said Jeff Dick, Marketing Vice President at Smiths Interconnect. “The technical challenges and increases in packaging costs are fueling the growth of Wafer Level Packages and Known Good Dies. Smiths Interconnect’s Volta Series addresses these trends with a cost-effective, high-performance option specifically designed to meet customers’ needs.”

发送到邮箱 |
+1 赞 0
收藏
评论 0
| 转发至：

本文由涂抹转载自Smiths Interconnect News，原文标题为:Volta Product Pushes Testing Technology Boundaries，本站所有转载文章系出于传递更多信息之目的，且明确注明来源，不希望被转载的媒体或个人可与我们联系，我们将立即进行删除处理。

全部评论（0）

暂无评论

Smiths Interconnect announced the launch of its Volta 200 Series Probe Head to Enhance Wafer Test Production Efficiency

A departure from cantilever and more traditional vertical probe technologies, the Volta Series enables quicker test set-up time and online cleaning ＆ maintenance while assuring impeccable site to site planarity. These benefits are a result of using spring probe contacts and a proprietary engineered housing material.

2023-11-01 - 产品代理服务技术支持批量订货

JOHNSON ELECTRIC‘s VOLTA High Voltage Cooling Fan Module: Breakthrough in Powertrain Cooling Technology Driving the Future of Efficient Automotive Cooling

JOHNSON ELECTRIC is thrilled to announce the launch of its latest innovation, the VOLTA High Voltage Cooling Fan Module. This breakthrough in powertrain cooling technology is set to revolutionize the automotive industry, particularly for Heavy Duty and Fuel Cell vehicles.

2024-11-21 - 产品代理服务技术支持批量订货

德昌电机VOLTA高压冷却风扇，10千瓦大功率设计，是汽车界的“温度管家”

VOLTA高压冷却风扇不仅提升了汽车的性能，还延长了使用寿命，为各种车型“量身定做”。它通过提高燃油经济性和减少排放，为汽车设计提供了一种既经济又环保的方案。而且，VOLTA的密封电机设计，让它在各种恶劣环境下都能稳定运行，保障了车辆的安全。

2024-11-21 - 产品代理服务技术支持批量订货

Volta 180 Series Probe Head Wafer Level Testing

型号- 851-0023038-H00,102119-H00,851-0012074-H01,VOLTA 180 SERIES,VOLTA 300,VOLTA 200,102120-H00,VOLTA 400,851-0023049-H00,VOLTA 180,102121-H00,VOLTA 250,VOLTA 350

2020/12/01 - SMITHS INTERCONNECT - 数据手册 - Version 1.0 代理服务技术支持批量订货查看更多版本

A Paradigm Shift in Simulation Techniques of Semiconductor Test Sockets

With the rise of the Internet of Everything (IoT), 5G, artificialin tellig ence ( AI ) and augmented reality (AR), high-performance test socket technology must keep pace. Performance specifications for test sockets published by suppliers should only be used as a general guideline in selecting the product family for a test application. Once a socket technology is chosen based on the general specification, suppliers should provide a more representative simulation of the socket based on the customer’s package layout with a focus on the high-speed areas of the device.

2024-02-25 - 设计经验代理服务技术支持批量订货

【产品】史密斯英特康发布Volta 180系列晶圆级芯片封装探针头，适用于最小引脚间距180µm及以上测试

史密斯英特康作为全球领先的半导体测试解决方案供应商，今天发布全新 Volta180 测试头扩大Volta产品线，支持市场对更小间距的晶圆尺寸，晶圆级芯片封装（WLCSP）和已知合格芯片（Known Good Die）的测试需求。

2020-12-02 - 新产品代理服务技术支持批量订货

Smiths Interconnect推出晶圆级芯片测试头Volta 200系列产品的新闻稿

描述- 史密斯英特康推出的Volta系列测试头适用于200μm间距及以上晶圆级测试，为高可靠性WLP（晶圆级封装）、WLCSP（晶圆级芯片封装）和KGD（已确认的好芯片）测试程序提供更多优势，可满足客户对更高引脚数，更小间距尺寸，更高频率和更高并行度测试的要求。

型号- VOLTA 200

SMITHS INTERCONNECT - 商品及供应商介绍代理服务技术支持批量订货

Volta Series Probe Head Wafer Level Testing

型号- 102121-H00,102119-H00,851-0012074-H01,VOLTA 350,VOLTA 300,VOLTA 200,102120-H00,VOLTA 400

2020/01/17 - SMITHS INTERCONNECT - 数据手册 - Version 1.0 代理服务技术支持批量订货

Volta Series Probe Head

型号- 102121-H00,102119-H00,VOLTA 350,VOLTA 300,102120-H00,VOLTA 400

2019/10/23 - SMITHS INTERCONNECT - 技术文档代理服务技术支持批量订货

Smiths Interconnect‘s Volta line of WLCSP Accelerating Device Brings up and Ramps up Production for WLCSP 5G Mobile ICs

As mobile phone electronics continue to shrink, WLCSP has become the de-facto packaging solution for IC’s going into today’s flagship handsets. Manufacturers need solutions to rapidly debug their new silicon, and quickly ramp it to HVM while achieving aggressive DPPB quality levels.

2023-09-18 - 原厂动态代理服务技术支持批量订货