【应用】高导热系数、高绝缘电压的导热垫片MCS30在EPS/变频器IGBT上的应用

时间： 2019-08-01 来源：世强

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PARKER CHOMERICS公司推出的MCS30高性能导热垫片，具有硬度超小、导热系数高、压缩比例大、绝缘电压高等特点。在EPS、变频器等应用中，IGBT器件既需要较高的导热性能，又需要较高的绝缘电压，传统的方式是使用陶瓷垫片，外加涂抹导热硅脂，达到较好绝缘与导热性能，但该方式存在陶瓷垫片易碎、工艺复杂、人力成本高等问题。而使用MCS30可以较好的解决上述问题。

导热垫片是填充发热器件和散热片或金属底座之间的空气间隙，它们的柔性、弹性特征使其能够用于覆盖非常不平整的表面。热量从分离器件或整个PCB传导到金属外壳或扩散板上，从而能提高发热电子组件的效率和使用寿命。MCS30导热垫片主要优点是它们的交联软凝胶结构与传统的高模量热垫相比具有优异的性能和长期热稳定性，其典型性能如下表所示

MCS30的标准厚度为0.5~5mm，能够满足不同导热缝隙的填充需求，选择时应选择比实际缝隙略大的厚度，以便保证一定的压缩量，保证更大的接触面积，降低热阻，压力也不需要特别大，因为其硬度只有25 Shore 00，只需20psi的压力就可达到压缩比例30%以上。典型的性能是绝缘性能非常高，其绝缘强度11KVac/mm的绝缘能力，只需0.5mm厚度，就可满足绝大多数应用的绝缘要求，应用于IGBT上，完全没有压力。

MCS30具有3W/m-K@20psi的导热系数，热阻低至0.4℃-in2/W，相对于多数IGBT和MOS来说，这个导热性能完全可以满足。

Parker Chomerics是全球领先的运动和控制技术多元化制造商Parker Hannifin的子品牌，是电子，运输和替代能源系统中导电和导热材料开发和应用的全球领导者。Parker Chomerics的材料科学与工艺技术广泛应用于EMI屏蔽，热管理，集成显示方案，工程塑胶，金属基装配等方面，是电信，信息技术，医疗设备，汽车，军事，商业和消费电子行业EMI屏蔽和热管理解决方案的首选。

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2022/2/17 - PARKER CHOMERICS - 应用笔记或设计指南代理服务技术支持现货查询批量订货

笔记本cpu用导热硅脂还是导热硅胶片导热效果好？

常规笔记本电脑CPU会选用导热硅脂来进行散热，长时间使用会存在老化掉粉的风险。导热垫片就不会。可推荐Parker Chomerics 导热垫片MCS30，导热系数3.5W/mk，性价比高，数据手册可见：THERM-A-GAP™ GEL 8010 & GEL30 High Performance Fully Cured Dispensable GELS 数据手册