KYOCERA Lanuched Ultra-Small Crystal Units CX1008SB Series Achieving the Same Performance as Kyocera‘s Previous With A 33% Reduction in Size
As 5G, IoT, ADAS and AI technologies expand, electronics will need to be designed more compactly to meet the increased performance requirements. Engineers inventing new electronics will need the smallest and most efficient components to keep up with demand.
KYOCERA's new generation of Ultra-Small Crystal Units (CX1008SB series) components - WINNER of the Japan Ministry of Education, Culture, Sports, Science and Technology (MEXT) award for technology development in 2021 for achieving the same performance as KYOCERA previous crystal units with a 33% reduction in size.
Normally, downsizing from 1.2 x 1.0mm to 1.0 x 0.8mm components would increase equivalent series resistance and require circuit board revision. However, by optimizing the design using piezoelectric analysis technology, Kyocera has downsized this device to 1.0 x 0.8mm with the same electrical characteristics as KYOCERA conventional technologies. This allows engineers to incorporate the new CX1008SB series components without revising circuit designs.
- |
- +1 赞 0
- 收藏
- 评论 0
本文由涂抹转载自KYOCERA News，原文标题为:Ultra-Small Crystal Units by Kyocera，本站所有转载文章系出于传递更多信息之目的，且明确注明来源，不希望被转载的媒体或个人可与我们联系，我们将立即进行删除处理。
相关推荐
Kyocera Named to “Top 100“ Global Innovators List for Third Consecutive Year, Marking Eighth Appearance
Kyocera Corporation announced that it has been recognized as a Top 100 Global Innovators™ 2024 by Clarivate™, a leading global provider of transformative intelligence. This year‘s list brings Kyocera‘s eighth appearance, with 2024 marking the third consecutive year.
KYOCERA Named Among “Top 100“ Global Innovators for 7th Year by Clarivate
Kyocera has been recognized as a Top 100 Global InnovatorTM 2023 by Clarivate, a global leader in connecting people and organizations to intelligence that transforms the world. This year marks Kyocera Corporation‘s seventh appearance on the list, including consecutive listings in 2022 and 2023.
Kyocera Corporation and SoftBank Corp. Succeeded in Demonstration of Backhaul System Utilizing 5G Millimeter-Wave
KYOCERA and SoftBank conducted a backhaul system verification test utilizing the millimeter-wave band allocated to SoftBank for 5G at SoftBank base stations located in Akiruno City, Tokyo, from January to April 2022.
Kyocera（京瓷）晶振选型指南（英文）
描述- Kyocera is a leading manufacturer in developing cutting edge crystal products such as crystal units and crystal oscillators by utilizing the full capability of quartz crystals. Kyocera has experience supplying a wide variety of crystal devices globally contributing to the evolution of IoT era.
型号- CX3225GA,CX2016SA,KT2520K26000□□□□□□XX,CX2016DB27000D0GLLCC,CX1210SB,CX1008SB37400□□□□□□□,MC2520Z,K-SERIES,KT5032F20000□□□33TXX,KC2520K25.0000C□□E00,CX3225SA,MC□□□□Z25.0000C1□YSH,MC3225Z,MC2016K,MC5032Z,KT1612A,MC3225K,KT7050,KC7050Z,KC5032K,KT5032F SERIES,KT1612A SERIES,MC2520K,CX1210DB,CX3225GA16000D0PTV□□,KC□□□□Z25.0000C1□Y00,MC2520K25.0000C□□ESH,CX2016SA20000D0GSS□□,CT1612RB,CX1008SB,KC2520Z,KC5032Z,KT2520K,CX1612DB24000□□GLLCC,KT5032F,KT1612A52000□□□□□NXG,KC3225Z,CT1612RB38400□□□□□□□,CX2520DB,MC-K SERIES,MC□□□□Z25.0000C1□XSH,CT2016DB,KC7050K,KT7050 SERIES,KT2016K,KC2016Z,KT2520K SERIES,CT2016DB19200□□□□□□□,MC7050Z,KT7050□20000□□□33TXX,Z-SERIES,KT2016K26000□□□□□□XX,KT2016K SERIES,MC2016Z,CX1210SB27120□□□□□CC,MC5032K,KC2016K,MC-K,KC2520K,MC7050K,CX1210DB37400□□□□□CC,CX2016DB,CX3225SA12000D0GTV□□,CX1612DB,KT1612A26000□□□□□□XX,KC3225K,KC□□□□Z25.0000C1□X00
表面贴装型 CX1008SB 〔消费类电子产品应用/ 移动通信应用〕晶体谐振器
描述- 本资料介绍了表面贴装型CX1008SB晶体谐振器的特点和规格。该产品适用于消费类电子产品和移动通信设备，具有超小尺寸、薄型和陶瓷封装等特点，提供高可靠性。
型号- CX1008SB,CX1008SB37400□□□□□□
晶体器件选型指南
描述- 本资料为晶体器件选型指南，详细列出了不同类型晶体器件的尺寸、频率范围、使用条件等信息。资料中包含多种晶体器件，并对每种器件的适用性进行了说明。同时，资料还提到了RoHS合规产品，即不含铅、镉、汞等有害物质的环保产品。
型号- CT1612RB,CX1008SB,CX3225GB,KC2520Z,KC5032Z,KT2520K,CX3225GA,CX2016SA,MC2016F,CX3225CA,CX1210SB,KC3225Z,MC2520Z,CX3225SB,CX3225SA,MC3225Z,MC2016K,CT2016DB,KC7050K,KT2016K,MC5032Z,KC2016Z,MC7050Z,KC3225F,MC2520F,CX2016GR,KT1612A,MC3225K,MC2016Z,KC7050Z,KC2520F,MC5032K,KC2016K,KC5032K,KC2520K,MC7050K,KC2016F,MC3225F,CX2016DB,CX1612DB,MC2520K,CX1210DB,KC3225K
晶体器件
型号- CX3225GB,CX3225GB27000D0HEQCC,CX3225GA,CX3225CA16000D0PSVCC,CX2016SA,KT2520K26000□□□□□□XX,CX3225CA,CX2016DB27000D0GLLCC,CX1008SB37400□□□□□□□,CX1210SB,MC2520Z,CX3225SB,KT5032F20000□□□33TXX,KC2520K25.0000C□□E00,CX3225SA,MC□□□□Z25.0000C1□YSH,MC3225Z,MC2016K,CT1612RB38400,MC5032Z,KT1612A,KT7050,MC3225K,KC7050Z,MC2520K32K7680C1□ASH,KC5032K,KT5032F SERIES,KT1612A SERIES,MC2520K,CX1210DB,KT1612A26000□□□□□NXY,CX3225GA16000D0PTV□□,KC□□□□Z25.0000C1□Y00,MC2520K25.0000C□□ESH,CX2016SA20000D0GSS□□,CT1612RB,CX1008SB,KC2520Z,KC5032Z,KT2520K,CX1612DB24000□□GLLCC,KC2520K32K7680C1□A00,KT5032F,KT1612A52000□□□□□NXG,KC3225Z,MC-K SERIES,MC□□□□Z25.0000C1□XSH,CT2016DB,KC7050K,KT7050 SERIES,KT2016K,KT2520K SERIES,KC2016Z,CT2016DB19200□□□□□□□,KT7050□20000□□□33TXX,MC7050Z,CX2016GR,KT2016K26000□□□□□□XX,KT2016K SERIES,MC2016Z,CX1210SB27120□□□□□CC,MC5032K,KC2016K,MC-K,CX1210DB37400□□□□□CC,KC2520K,MC7050K,CX2016DB,CX2016GR20000D0GTVCC,CX3225SA12000D0GTV□□,CX1612DB,KT1612A26000□□□□□□XX,CX3225SB27000D0GLLCC,KC□□□□Z25.0000C1□X00,KC3225K
产品简表
型号- CT1612RB,CX1008SB,CX3225GB,KC2520Z,KC5032Z,KT2520K,CX3225GA,CX2016SA,MC2016F,CX3225CA,CX1210SB,KC3225Z,MC2520Z,CX3225SB,CX3225SA,MC3225Z,MC2016K,CT2016DB,KC7050K,KT2016K,MC5032Z,KC2016Z,MC7050Z,KC3225F,MC2520F,CX2016GR,KT1612A,MC3225K,MC2016Z,KC7050Z,KC2520F,MC5032K,KC2016K,KC5032K,KC2520K,MC7050K,KC2016F,MC3225F,CX2016DB,CX1612DB,MC2520K,CX1210DB,KC3225K
【IC】京瓷成功量产超小型晶振CX1008SB系列，尺寸减小到1.0×0.8mm，顺应通信终端多功能化趋势
近年来，5G通信普及、Wi-Fi®高速化、车载装置的电装化等通信终端多功能化趋势加深，而电子设备的贴装密度持续增加，可实装面积受限，对于更小型化的搭载元器件的需求随之增长。在此市场背景下，京瓷凭借出色的光刻加工以及同大阪大学共同开发的超高精度加工技术（等离子CVM技术），成功量产了超小型晶振CX1008SB系列。
用于消费产品/移动通信的表面贴装型CX1008SB 1.0×0.8mm晶体单元
描述- 本资料介绍了一种超小型、低轮廓的表面贴装型石英晶体单元CX1008SB，适用于移动通信等消费电子产品。该产品具有高可靠性、兼容回流焊工艺，并提供详细的技术规格和应用信息。
型号- CX1008SB,CX1008SB37400□□□□□CC
KYOCERA 产品简表
描述- 本资料提供了一系列元器件产品的简表，包括产品名称、尺寸、频率范围和使用条件等信息。资料中列出了多种产品，并标注了符合RoHS指令的产品，以及基于欧盟指令2015/863的不含有害物质的产品信息。资料截止至2023年10月。
型号- CT1612RB,CX1008SB,CX3225GB,KC2520Z,KC5032Z,KT2520K,CX3225GA,CX2016SA,CX3225CA,KT5032F,CX1210SB,KC3225Z,MC2520Z,CX3225SB,CX3225SA,MC3225Z,MC2016K,CT2016DB,KC7050K,KT2016K,MC5032Z,KC2016Z,MC7050Z,CX2016GR,KT1612A,MC3225K,KT7050,MC2016Z,KC7050Z,MC5032K,KC2016K,KC5032K,KC2520K,MC7050K,CX2016DB,CX1612DB,MC2520K,CX1210DB,KC3225K
压纹载带包装、卷盘规格包装规格
描述- 资料详细介绍了不同型号的晶体谐振器和时钟晶体振荡器的包装规格，包括尺寸、公差和数量等信息。内容涵盖了多种型号的晶体谐振器，如CT1612RB、CT2016DB等，以及时钟晶体振荡器型号如MC2016K、MC2520K等。资料还提供了压纹载带包装和卷盘规格的详细信息。
型号- CT1612RB,CX1008SB,CX3225GB,KC2520Z,KC5032Z,KT2520K,CX3225GA,CX2016SA,MC2016F,CX3225CA,CX1210SB,MC2520Z,KC3225Z,CX3225SB,CX3225SA,MC3225Z,MC2016K,CT2016DB,KC7050K,KT2016K,MC5032Z,KC2016Z,MC2520F,KC3225F,MC7050Z,CX2016GR,KT1612A,MC3225K,MC2016Z,KC7050Z,KC2520F,MC5032K,KC2016K,KC5032K,KC2520K,MC7050K,KC2016F,MC3225F,CX2016DB,CX1612DB,MC2520K,CX1210DB,KC3225K
压纹载带包装、卷盘规格
型号- CX3225GB,CX3225GA,CX2016SA,CX3225CA,KV5032D,CX1210SB,MC2520Z,CT1612DB,CX3225SB,CX3225SA,MC3225Z,MC2016K,MC5032Z,KC7050P,KC7050R,KT1612A,MC3225K,KT7050,KC7050Z,KC5032K,KC5032P,MC2520K,KC5032E,CX1210DB,CX1008SB,KC2520Z,KC5032Z,KV7050R,KT2520K,KT5032F,KC3225Z,KC7050A,KT3225K,KV7050B,CX2520DB,KV7050C,KV7050G,CT2016DB,KC7050K,KC7050G,KT2016K,KC2016Z,MC7050Z,CX2016GR,KC2520B,KC3225A,MC2016Z,MC5032K,KC2016K,KC2520K,MC7050K,KC2520M,CX2016DB,KV5032G,KC2016B,KV5032R,CX1612DB,CT2520DB,KC3225K
电子商城
现货市场
授权代理品牌：集成电路
授权代理品牌：分立元件
授权代理品牌：接插件及结构件
授权代理品牌：部件、组件及配件
授权代理品牌：电源及模块
授权代理品牌：电子材料
授权代理品牌：仪器仪表及测试配组件
授权代理品牌：电工工具及材料
授权代理品牌：机械电子元件
授权代理品牌：加工与定制
我要提问
登录 | 立即注册
提交评论