Smiths Interconnect honored as Outstanding Test and Measurement Company of the Year at the China IC Achievement Award
On 17 August 2022, the China IC Leadership Summit and China IC design achievement award ceremony was successfully held in Nanjing, China. This event was organized by Aspencore, a leading global electronics technology media group.
Smiths Interconnect, a leading provider of innovative test solutions for the semiconductor industry, won the China IC achievement award as the Outstanding Test and Measurement Company of the Year for its continuous innovation and rapid growth in the Chinese market.
The China IC achievement award is one of the most important technical awards in China's electronics industry. It recognizes the best companies, groups, and individuals who represent the highest manufacturing standards of the industry; and/or demonstrate outstanding design capabilities and technical service levels. Winners were selected through a fair and impartial vote by the committee, comprising of Aspencore senior industry analysts, and also by a panel of electronics engineers and semiconductor industry insiders through public online voting.
Smiths Interconnect was recognized for its commitment to growing its semiconductor test business in China, by offering high-quality, innovative test sockets and probe card solutions that provide customers with a competitive edge.
Kenny Quah, VP of Sales Asia & EMEA for the Semiconductor Test Business Unit at Smiths Interconnect said: "The Asia Pacific and China, in particular, is a pillar of our strategy of growth in the semiconductor market segment. The award is a great honor as it recognizes Smiths Interconnect's commitment to supporting the China IC market. It also demonstrates our dedication and ambition to be the industry leader in providing cutting-edge connectivity solutions that help solve the challenges of the digital age".
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