Smiths Interconnect Launches The New HR-CTX Series, Offering Excellent Broadband Performance Up to 64GHz
Smiths Interconnect, a leading provider of technically differentiated electronic components, subsystems, microwave and radio frequency products extends its offering of high frequency wire-bondable chip terminations with the release of its new HR-CTX Series, a small, easy-to-implement, high-reliability product qualified for space applications.
HR-CTX
The new HR-CTX high frequency termination Series offers excellent broadband performance up to 64GHz and unrivalled power rating capability up to 5 Watts in a compact 0404 package. Its four times smaller footprint allows customers to save space and weight on the board, while the total thin film design optimized on Aluminum Nitride offers a high power dissipation.
The HR-CTX Series is qualified for space applications, eliminating the need for customer’s inhouse qualifications. It is supplied with all the necessary test and qualification data to ensure flight compliance.
“Our lightweight and very compact termination ensures optimized return loss for multiple frequency bands and a wide array of applications. This allows to use a single chip in multiple applications, reducing the total cost of ownership for our customers”, says Tullio Panarello, VP and General Manager of the Fibre Optics and RF Components Business Unit at Smiths Interconnect.
The new HR-CTX series is a unique solution reducing the bill of material and offering:
·Power rating up to 5 Watts, increased by up to 5x over alternative solutions
·Frequency rating DC to 64 GHz with optimal broad band performance
·Excellent VSWR (1.25:1 Typical)
·Total thin film construction
·Reduced footprint allowing for space and weight savings on the board: 0.040" x 0.040" x 0.015"
·Space qualification based on MIL-PRF-55342
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本文由Batman转载自Smiths Interconnect,原文标题为:High reliability wire-bondable chip terminations in a small package,本站所有转载文章系出于传递更多信息之目的,且明确注明来源,不希望被转载的媒体或个人可与我们联系,我们将立即进行删除处理。
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品类
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Size(mm)
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Substrate
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Terminal Material
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Resistive Material
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TCA Tolerance(dB/dB/˚C)
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Impedance(Ω)
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Power Rating(W、mW)
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Frequency Range(GHz)
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VSWR (Typical)
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Operating Temperature(℃)
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TVA0500N07W1S
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ATTENUATOR
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1.52mmx1.91mm[0.060inx0.075in]
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Alumina
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Thick Film, Nickel Barrier with Solder Plate or Lead Free Finish Gold and Wire Bondable Options Available
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Thick Film
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±0.001dB/dB/˚C
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50Ω
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2.0W
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DC-6GHz
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1.30@1GHz
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-55˚C to 150˚C
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选型表 - Smiths Interconnect 立即选型
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品类:TEMPERATURE VARIABLE CHIP ATTENUATOR
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品类:TEMP VARIABLE ATTENUATOR
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品类:TEMPERATURE VARIABLE ATTENUATOR
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可贴PCB板厚范围:0.6~2.0mm,也支持生产软硬接合板,拼板长宽:50*50mm~550*500mm,PCBA快速贴片支持01005CHIP元件。
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可贴片PCB尺寸50*50mm-580*610mm;PCB厚度0.3-8mm;贴装精度CHIP元件+0.03,BGA Pitch 大于0.25mm;元件尺寸0201-74*74BGA;元件高度:30mm。
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