【产品】导热率2.5W/m·K的无硅导热凝胶THERM-A-GAP GEL 25NS,易于分配,无需二次固化
PARKER CHOMERICS 无硅导热凝胶THERM-A-GAP GEL 25NS是一种单组分、可分配的热界面材料,具有2.5W/m·K的导热率,用于将热量从电子设备传导至散热器或外壳。这种无硅导热凝胶,因此被称为 "NS",是需要避免硅污染问题的理想应用,并且不需要混合或固化。
THERM-A-GAP GEL 25NS在装配压力下需要较低的压缩力来产生变形,从而使元件、焊点和引线承受最小的应力。它的配方是为了适应当今的高性能电子产品,是自动点胶机的理想选择。
特点及优势
•导热率:2.5W/m·K
•易于分配
•无需二次固化
•低热阻
•超低压缩力
•可返工
•无硅
典型应用
•通信基站
•电源和半导体
•内存和电源模块
•微处理器
•中央处理器(CPU)
产品信息
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本文由C先森翻译自Parker Chomerics,版权归世强硬创平台所有,非经授权,任何媒体、网站或个人不得转载,授权转载时须注明“来源:世强硬创平台”。
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景图(Gentone)导热凝胶/导热垫片/绝缘垫片/相变导热材料/储热材料选型指南
目录- 公司概况 选型速查表 单组份导热凝胶 双组份导热凝胶 常规导热垫片 超软导热垫片 高回弹导热垫片 导热绝缘垫片 低渗油导热垫片 低挥发导热垫片 相变化导热材料 导热硅脂 导热吸波垫片 半导体底部填充胶 储热材料
型号- RDP-08020,HRGP 系列,LBGP-03040,ZGP-03060,LBGP-05060,RDP-08025,NSGP 系列,RGP-03055,RGP-02040,PCGP-03000,LBGP-08065,RDP-12010,RDP2-02060,IGP-02040,RSG-01500,RDP 系列,RGP-03060,GTHZ-110 110J,RGP-07025,RGP-03025,RGP-06050,HRGP-06050,RSG-03000,RDP2,LVGP-08065,CUF105+,PCGP,RDP2-06060,IGP-02041,RDP-09010,CUF106,RDP-06015B,RGP-02060,IGP-03045,IGP 系列,CUF109,CUF108,CUF107,RDP-02060,NSGP,LBGP 系列,RDP-06020,HRGP-02050,LVGP,HRGP,RGP-12070,LVGP-05060,PCGP-05000,RDP-06015Y,LVGP-03040,RDP2 系列,RDP,CUF110,PCGP 系列,GTHZ-110,RSG-05000,RGP-03045,HRGP-03050,IGP,RDP-03530,RDP2-09070,NSGP-02060,NSGP-03070,LBGP,RDP2-03570,LVGP 系列
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