【产品】导热率2.5W/m·K的无硅导热凝胶THERM-A-GAP GEL 25NS,易于分配,无需二次固化
PARKER CHOMERICS 无硅导热凝胶THERM-A-GAP GEL 25NS是一种单组分、可分配的热界面材料,具有2.5W/m·K的导热率,用于将热量从电子设备传导至散热器或外壳。这种无硅导热凝胶,因此被称为 "NS",是需要避免硅污染问题的理想应用,并且不需要混合或固化。
THERM-A-GAP GEL 25NS在装配压力下需要较低的压缩力来产生变形,从而使元件、焊点和引线承受最小的应力。它的配方是为了适应当今的高性能电子产品,是自动点胶机的理想选择。
特点及优势
•导热率:2.5W/m·K
•易于分配
•无需二次固化
•低热阻
•超低压缩力
•可返工
•无硅
典型应用
•通信基站
•电源和半导体
•内存和电源模块
•微处理器
•中央处理器(CPU)
产品信息
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本文由C先森翻译自Parker Chomerics,版权归世强硬创平台所有,非经授权,任何媒体、网站或个人不得转载,授权转载时须注明“来源:世强硬创平台”。
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