3PEAK Becomes the First Chip Maker in China to Have Two Types of CAN Transceivers Passed German C＆S Compatibility Certification at the Same Time

时间： 2023-04-19 来源：3PEAK News

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3PEAK, a semiconductor company focusing on the development of high-performance analog chips and embedded processors, has unveiled its latest CAN transceiver chips with independent intellectual property rights — TPT1042 and TPT1051. Now, these products have passed the German C&S compatibility certification, and it is the first chip manufacturer in China to have two types of CAN transceivers successfully certified by C&S at the same time.

TPT1042

Fully compliant with CAN ISO11898-2
Supports 5 Mbps CAN FD (Flexible Data Rate), compatible with standard CAN
5 μA ultra-low power consumption standby mode, remote wake-up available
RX common mode input voltage range: ±30 V
Bus fault-protection dielectric strength: ±70 V
Bus-Pin ultra-high level ESD protection:
±15 kV IEC61000-4-2 contact discharge
Compliant with AEC-Q100 Grade 1
Package: SOP8, DFN3X3-8L

TPT1051

Fully compliant with CAN ISO11898-2
Supports 5Mbps CAN FD (Flexible Data Rate), compatible with standard CAN
Low power silent mode
RX common mode input voltage range: ±30V
Bus fault-protection dielectric strength: ±70V
Bus-Pin ultra-high level ESD protection:
±15kV IEC61000-4-2 contact discharge
Compliant with AEC-Q100 Grade1
Package: SOP8, DFN3X3-8L

All mainstream CAN transceivers in the international market have passed the C&S compatibility test. 3PEAK's CAN transceivers — TPT1042 and TPT1051, have also passed C&S compatibility certification, making 3PEAK the first chip maker in China to obtain C&S compatibility certification for two types of CAN transceivers at the same time. Fully compatible with mainstream solutions in the market and equipped with 15 kV IEC ESD contact discharge capability and 70 V bus fault-protected dielectric strength, these two products are leading in China and also advanced in the global market in terms of performance. They have greatly enhanced 3PEAK's core competitiveness in the field of in-vehicle communication networks, thus boosting the development of the automotive industry toward digitalization, intelligence, and interconnection.

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