Waermtimo WT5912 and WT5902 Series Thermal Pads Tightly Integrate Irregular or Complex Surfaces, Suitable for Wireless Routers
The wireless router provides a very convenient network environment for work, office, and home entertainment, allowing us to get rid of the shackles of network cables and enjoy a variety of network equipment within the signal coverage area. Although it has a low daily presence, it plays a very important role.
In such a device that works 24/7, the internal components continuously generate heat, and the heat transfer system design requirements are also very high.
For a router produced by a well-known domestic brand manufacturer, by decrypting the internal structure, let's see how it dissipates heat.
There are cooling holes on the bottom of the router, and convection is formed by the internal turbo fan. In order to have better air duct heat dissipation, all places are closed except for the heat dissipation holes at the bottom.
Due to the high main frequency of the internal chip, some manufacturers choose to actively dissipate heat. The consequence is that after a long period of operation, the fan noise will generally increase.
In contrast, products using a passive cooling method, where a thermal pad is placed between the IC's main chip and the heat sink, avoid such problems and enhance the heat dissipation effect.
What is the excellent performance thermal pad suitable for wireless routers?
Recommended models:
WT5912 series thermal pad
Model: WT5912-H20-55, WT5912-H25-40
Waermtimo researched and developed TIM's new high-strength thermal pad, which is a thermal sheet with high mechanical strength, elongation rate> 300%, high toughness, thermal shock, and effective damping at the same time, and can be reworked many times. Continuously, it can tightly integrate irregular or complex surfaces, has excellent interface filling, and can be used repeatedly. Temperature resistance range -50 ~ 200℃, applicable to a wide range of power equipment, automotive electronics, communication equipment, network terminals, storage devices, handheld, wearable, and mobile terminal products between the internal chip and the radiator, this type of pad can be used to solve the problem of heat conduction and heat dissipation. At the same time, it can also be applied to the housing of some electronic products, which has the functions of heat dissipation, insulation, dust resistance, and water resistance.
WT5902 series thermal pad
Model: WT5902-D40-40, WT5902-D45-40
Thermal conductivity range: 4W, 5W, 6W, 7W, 8W
WT5902 series thermal pads can solve the problem of product structure design tolerance changes and can be reused. They are good vertical heat transfer materials between the heat source (CPU or electronic chipset) and the heat sink. Have good insulation and mechanical properties, can tightly integrate irregular or complex surfaces, are easy to use, and are easy to remove. They are widely used in power supply equipment, automotive electronics, communication equipment, network terminals, storage devices, consumer electronics, and other fields.
- |
- +1 赞 0
- 收藏
- 评论 0
本文由玄子转载自Waermtimo News,原文标题为:Decrypting how a wireless router conducts heat!,本站所有转载文章系出于传递更多信息之目的,且明确注明来源,不希望被转载的媒体或个人可与我们联系,我们将立即进行删除处理。
相关推荐
Waermtimo WT5902 and WT5921 Series High Thermal Conductive Materials Suitable for VR Glasses Heat Conduction
Important components are densely distributed on the motherboards of the somatosensory devices, like VR glasses or VR headsets. High thermal conductive materials suitable for heat conduction and evacuation of VR glasses include Waermtimo WT5902 series thermal pad and WT5921 series thermal gel.
器件选型 发布时间 : 2023-09-16
Waermtimo Offers High-strength Thermal Conductive Pad and Thermal Pad for High-speed Optical Module Heat Dissipation
To solve the heat dissipation problem of the optical module, the heat dissipation panel must meet the two conditions of heat conduction and heat dissipation. The heat dissipation of chip components mainly uses high thermal conductive materials with a certain degree of flexibility.
器件选型 发布时间 : 2023-08-27
Waermtimo WT5921 Series Thermal Gel with High Thermal Property Is Suitable for Compact Component Layouts like Drones
In heat sink applications of drones and other electronic products, the thermal gel is superior to the thermal pad in practical operation and it enables the equipment‘s automatic dispensing, which is more compatible with today‘s high-tech production lines.
器件选型 发布时间 : 2023-12-01
鸿富诚(HFC)热界面材料/屏蔽材料/吸波材料选型指南
目录- 公司介绍 Company Profile 热界面材料介绍 Thermal Interface Material Introduction 导热硅胶垫片 Thermal Pad 各向异性导热垫片 Anisotropic Thermal Pad 导热凝胶 Thermal Gel 导电泡棉 FOF Gasket 石墨泡棉 Graphite Foam 半包型导电泡棉 Half-wrapped Gasket SMT导电泡棉 SMT Gasket 全方位导电泡棉 XYZ Conductive Foam 导电PE Conductive PE 导电毛丝 Conductive FOA 导电布胶带 Conductive Fabric Tape 铜/铝箔胶带 Copper/Atuminum Foil Tape 吸波材料 Wave-absorbing Material 导热吸波材料 Thermal Conductive Absorbing Material
型号- H800-LY,HFS-15,HFS-18,H100,HFC-MC,H300,HFC-SMT,H500,H700,H350-SOFT,H100RS,H300-RB,HTG-150DK,HFC-MC系列,HTG-150D,HFC-GB系列,SMFB系列,H200RS,HFC-MFZ系列,HFC-AM,H1200,H250,HFC-GR系列,HTG-1000,HTG-100DK,H1000,HFS-20,H1000-SOFT,H150RS,HFC-A18000,SMFB,H250RS,HTG-600,HTG-500SF,HTG-800,SMFA,HTG-200,HFC-AM系列,HFC-MF,H300MAS,HFC-MT,SMT,H500-RB,HTG-200D,HFC-A系列,HFC-A25000,H150A15,H500-LY,HTG-800D,H100A15,HFS-30,HFC-AM5000,H200,H400,H600,H200-SOFT,H800,H300-SOFT,H100-SOFT,HFC-MF系列,HFC-AM1000,H200MAS,HFC-A5000,SMFA系列,H300-HC,HTG-300SF,HFC-MFZ,H150,HFC-GR,HTDG-250,H150-LY,H700-SOFT,H600-LY,H300-LY,HFC-A,H300-HR,H300-DR,SMT系列,HTG-300,HFC-GB,H200-LD,HTG-500,H150-LD
沃尔提莫(Waermtimo)碳纤维导热片/导热硅胶/导热灌封胶选型指南
描述- 沃尔提莫成立于2010年,在深圳、东莞建立了生产基地,为全球客户提供高导热系数、较低热阻、较高性价比导热材料产品。公司致力于为管理和控制电子整机、器件、模块和线路板的发热,研发各种新型复合材料及解决方案,并将新技术、新材料落地于自主知识产权的产品设计和生产中
型号- WT5921-30,WT5921-20,WT5935C高瓦系列,WT5921-35,WT5912,WT5902,WT5921,WT5932,WT5932-30P,WT 5921-86,WT5912系列,WT5932-30D,WT5922-501AB,WT5902系列,WT5921-15AB,WT5932 系列,WT5921-25AB,WT5935C
The Next Generation of Thermal Gap Filler Pad: THERM-A-GAP PAD 80LO, with a Thermal Conductivity of 8.3 W/m-K
By addressing the shortcomings of current gap pads, PAD 80LO represents the next generation of gap pads to address modern electronics design and thermal managements. With a thermal conductivity of 8.3W/m-K, PAD 80LO is designed for high heat-output components.
产品 发布时间 : 2024-10-24
金菱通达(GLPOLY)热对策材料选型指南
目录- Company Profile Low Density Thermally Conductivity Silicone Gel Pad/Stressless Silicone Thermal Putty Gel Thermal Pad Thermal Silicone Pad & Silicone Thermal Fiberglass/Film EMI absorber/Absorption Gel Two-part Liquid Thermal Gap Pad/PCMs/Non-Silicone Sealing Compound Silicone/Non-Silicone Thermal grease Silicone Thermal Tape Graphite Thermal radiation Pad/Vibration Dampening Silicone Pad
型号- XK-G20E,XK-P20系列,XK-R系列,XK-P PUTTY,XK-PN50,XK-Z系列,XK-P20LD,XK-P80,XK-RE SERIES,XK-RAY310,XK-A100,XK-FN系列,XK-F系列,XK-FN,XK-FN20,XK-J系列,XK-C35D,XK-C35C,XK-PN45,XK-GN SERIES,XK-Z,XK-FST,XK-F35,XK-R30,XK-Z SERIES,XK-F10ST,XK-FN10,XK-P PUTTY SERIES,XK-FN15,XK-FST系列,XK-SF SERIES,XK-P45-PUTTY,XK-GN20,XK-Z15,XK-RE系列,XK-FN50,XK-X SERIES,XK-T SERIES,XK-G40,XK-F20,XK-J20,XK-SF35,XK-XN40,XK-P60,XK-RAY,XK-J25,XK-FST SERIES,XK-C系列,XK-SN SERIES,XK-R20,XK-G系列,XK-PN系列,XK-K系列,XK-TN08,XK-GN15,XK-XN系列,XK-SN系列,XK-FN40,XK-XN50,XK-G30,XK-S15LV,XK-F10,XK-C35,XK-PN60,XK-S30LV,XK-TN,XK-J10,XK-P50,XK-F15,XK-A SERIES,XK-TN12,XK-PS SERIES,XK-R10,XK-J18,XK-X50,XK-SF系列,XK-R15,XK-P30S20,XK-A80,XK-A60,XK-P系列,XK-PLD SERIES,XK-P20 SERIES,XK-PN15,XK-T系列,XK-P50-PUTTY,XK-C20,XK-X系列,XK-G20,XK-S20LV,XK-C25,XK-PLD,XK-SN,XK-SF15,XK-GEL 100,XK-SF18,XK-SN10,XK-P45,XK-PS系列,XK-P80-P,XK-SF,XK-K4,XK-X40,XK-TN SERIES,XK-F20ST,XK-K6,XK-P20S,XK-F SERIES,XK-GN30,XK-J SERIES,XK-S12LV,XK-C15,XK-C16,XK-P PUTTY 系列,XK-K10,XK-P15LD,XK-G15,XK-P50-P,XK-P30,XK-SN20,XK-P SERIES,XK-P80-PUTTY,XK-RE,XK-PN SERIES,XK-C,XK-TN系列,XK-G,XK-F,XK-F60,XK-R SERIES,XK-S25LV,XK-PN30,XK-A,XK-P20S20,XK-R,XK-A系列,XK-T,XK-R10E9,XK-PLD系列,XK-P20,BETA GEL 100,XK-X,XK-P25,XK-K,XK-J,XK-P45-P,XK-RAY SERIES,XK-P,XK-G SERIES,XK-PN,XK-T09,XK-A30,XK-PS,XK-F50,XK-F15ST,XK-C SERIES,XK-PN20,XK-K SERIES,XK-XN,XK-XN10,XK-XN SERIES,XK-RAY 系列,XK-P10LD,XK-FN SERIES,XK-R50,XK-GN系列,XK-T12,XK-GN,XK-ANFC,XK-X10
汉华(Hanhua)导热界面材料选型指南
描述- 深圳市汉华热管理科技有限公司成立于2015年,是与清华大学深圳研究生院材料学院合作成立的一家高科技企业,全面致力于热管理方案、新型导热材料、热扩散材料、导热模组的研发、生产和技术服务。Shenzhen HanHua TM Technology Co., LTD., founded in 2015, is a high-tech enterprise established in cooperation with the School of Materials, Tsinghua Shenzhen Graduate School.
型号- HI,HT90,HL10,HL,HP10,HP,HS,HT,HI系列,KCH30,THSB30,KHGC系列,THSI10,HT80,HI25,THSB25,THSB20,KGF系列,HG70,HI30,KHG80,HL30,KGF100,KGF060,HP30,THSI系列,KHGC50,KGC35,HS10,KGS040A,KCH15,THSB10,HC20,KGT55,KG,HC25,KHGC60,KGS系列,HL20,KGS025A,KGC,HL25,HP20,HP25,HAZ20,KGF,KCH20,KGC系列,KCH25,HAZ10,KGS,HT100,KGT,KGF080,HC10,HAZ,KHG60,HC系列,KGC15,HS30,HG系列,KHG,HAZ30,HS35,HAZ25,KGT35,HB20,HAZ系列,HG40,HB25,KG35,KHGC80,KG15,KGT系列,KGC25,HS20,HS25,HL系列,HP系列,HB10,HT系列,HC30,KGT45,KG25,HI10,HT70,HS50,HB系列,KGS032A,THSI30,KHG系列,HG60,KHGC,HI20,KGS017A,THSB,HS40,HT60,KHG50,KG系列,THSI,KCH,KGT20,HS系列,HB30,THSI25,HB,HC,HG50,THSI20,THSB系列,HG
What is Thermal Pad?
Thermal pads are essential components in modern electronic devices, designed to facilitate efficient heat transfer from heat-generating components to heat sinks or other cooling solutions. Understanding what thermal pads are and their importance can help you choose the right material for your specific application.
技术探讨 发布时间 : 2024-08-03
HFC Company Profile
型号- H150-S,HTG SERIES,H150-S SERIES,H150-LD SERIES,H200-LD SERIES,HFC-A15000,H150-A SERIES,H200-A SERIES,H200-A,H200 S40 SERIES,HFC-A12000,HFC-A18000,HFC-A1000,H150-A,H200 S40,H200-LD,HTG,HFC-A5000,HFC-A25000,H150-LD,HFC-A2000
THERM-A-GAP™ MCS30 Thermally Conductive Gap Filler Pad
型号- 69-11-20687-MCS30X,MCS30,THERM-A-GAP™ MCS30,69-11-20684-MCS30X,69-11-20685-MCS30X,69-11-20698-MCS30X,69-11-20686-MCS30X,69-11-20672-MCS30X,69-11-20991-MCS30X,69-11-20675-MCS30X,69-11-27072-MCS30X,MCS 30,69-11-21259-MCS30X,69-11-27102-MCS30X,69-11-20913-MCS30X
Why Thermal Gel Become More and More Popular?
The thermal gel is one kind silicone two-component paste-like thermal conductive filling material. It mainly meets the requirements of low pressure and high compressive modulus during use. It can realize automatic production. It has the properties of excellent contact with electronic products, low contact heat resistance and excellent electrical insulation. This material has the advantages of thermal pad and thermal grease, while at the same time better compensating for the shortcomings of above two materials.
技术探讨 发布时间 : 2024-01-21
High-Performance Thermal Gap Filler Pads to Further Optimise Heat Transfer Applications in Electronic Systems
The Parker Chomerics is introducing its next generation of thermal gap filler pads - THERM-A-GAPTM PAD 30 and 60 - for all heat transfer applications between electronic components and heat sinks.
新产品 发布时间 : 2021-12-24
THERM-A-GAP™ PAD 80 8.3 W/m-K Thermally Conductive High Performance Gap Filler Pad
型号- PAD 80,6W-XX-1015-ZZZZZZZ,THERM-A-GAP™ PAD 80
Thermal Pad WT5912-H20,WT5912-H25 Provides a Heat Dissipation Solution for Wireless Charger
Wireless charging is a device that uses the principle of electromagnetic induction to charge. By placing a coil on each of the transmitting and receiving ends, the transmitting end coil emits an electromagnetic signal to the outside under the action of electric power, and the receiving end coil receives the electromagnetic signal and converts the electromagnetic signal into Current to achieve wireless charging.
应用方案 发布时间 : 2024-01-20
电子商城
服务
使用FloTHERM和Smart CFD软件,提供前期热仿真模拟、结构设计调整建议、中期样品测试和后期生产供应的一站式服务,热仿真技术团队专业指导。
实验室地址: 深圳 提交需求>
登录 | 立即注册
提交评论