【选型】导热凝胶GEL 45助力路由器散热设计，导热系数4.5Wm-K，最小间隙小于0.1mm

时间： 2022-07-14 来源：世强

技术问答

路由器是连接两个或多个网络的硬件设备，在网络间起网关的作用，核心器件是基带和射频收发芯片，长期工作导致发热量较高，为保证路由器长期工作可靠性，需要导热系数高、体积小、便于批量生产的散热设计方案。

针对路由器的散热设计，推荐PARKER CHOMERICS的单组分导热凝胶 GEL 45，导热系数4.5W/m-K，最小间隙小于0.1mm，流胶速度55g/min，以下是GEL 45典型性能参数：

1、路由器内部空间有限，内部功耗较大的器件是基带和射频芯片，长期工作下产生的热量堆积会影响系统性能，推荐采用导热凝胶设计散热方案，GEL 45可以提供4.5 W/m-K导热系数，用于高功耗器件与散热结构之间，可以提高传热效率，降低核心器件工作温度，提高路由器工作稳定性。

2、路由器内部基带芯片、射频芯片等单元有不同的结构，导热凝胶GEL 45流胶速度是55g/min，通过重力控制可以实现受控分配不同的厚度，最小厚度只有0.0889mm，满足多个芯片的散热需求。

3、导热凝胶GEL 45属于单组份凝胶设计，无需二次固化，可以利用点胶机实现自动化批量生产，提高生产效率；该系列导热凝胶满足UL 94 VO防火等级和RoHS标准，符合路由器产品环保要求。

综上所述，Parker Chomerics的单组份导热凝胶GEL 45具有4.5W/m-K导热性能、最小间隙小于0.1mm、自动点胶便于批量生产的特性，是路由器等网通产品散热方案的优秀选择。

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Flow Rate, grams/min - 30cc syringe with no tip at

Specific Gravity

Typical Minimum Bondine Thickness, in (mm)

Thermal Conductivity, W/m-K

Heat Capacity, J/g-K

Coefficient of Thermal Expansion, ppm/K

Operating Temperature Range, ℃

Dielectric Strength, Vac/mil (kVac/mm)

Volume Resistivity, ohm-cm

Dielectric Constant @ 1,000 kHz

Dissipation Factor @ 1,000 kHz

Flammability Rating

RoHS Compliant

Outgassing,% TML (% CVCM)

Shelf Life, months from date of manufacture

Storage Conditions, ℃ @50% Relative Humidity

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数据手册 - PARKER CHOMERICS - 2021/7/2 PDF 英文下载查看更多版本

导热屏蔽吸波创新性材料解决方案供应商

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商品及供应商介绍 - 锐腾 - 2023/10/17 PDF 中文下载

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应用方案发布时间 : 2022-01-08

Parker Chomerics Thermal Interface Materials Product Shelf Life Data

型号- CHO-THERM 1674 W/PSA,THERM-A-GAP HCS10A,THERMATTACH T405,THERMAL GREASE T650,THERM-A-GAP 8010,THERM-A-GAP HCS10G,THERMATTACH T404,CHO-THERM T609 W/PSA,THERM-A-GAP A580,THERM-A-GAP G570,THERM-A-GAP GEL 45,THERM-A-GAP G174,CHO-THERM 1680 W/PSA,THERM-A-GAP G569,THERMFLOW T725,CHO-THERM T500,CHO-THERM T500 W/PSA,CHO-THERM 1678 W/PSA,THERMFLOW T766,T-WING,THERMATTACH T418,THERM-A-GAP A579,THERMATTACH T412,THERM-A-GAP A574,THERM-A-GAP T174,THERMATTACH T414,THERM-A-GAP A174,THERM-A-GAP A570,CHO-THERM 1646,THERM-A-FORM CIP 35,CHO-THERM 1677 W/PSA,CHO-THERM 1671 W/PSA,CHO-THERM T441 W/PSA,THERMATTACH T410,THERMATTACH T411,THERMFLOW T777,THERM-A-GAP A569,THERMAL GREASE T670,CHO-THERM 1671,CHO-THERM 1674,CHO-THERM 1677,THERM-A-GAP G274,CHO-THERM 1678,CHO-THERM T444,CHO-THERM T441,THERM-A-GAP TC50,THERM-A-GAP 976,THERMFLOW PC07DM-7,CHO-THERM T609,THERMAL GREASE T660,THERM-A-GAP T630,THERM-A-FORM T644,THERM-A-GAP GEL 30,THERM-A-FORM T646,THERM-A-GAP 974,THERM-A-FORM T647,THERM-A-GAP T274,THERM-A-GAP A274,THERM-A-GAP T636,THERM-A-GAP G580,THERM-A-GAP T635,THERM-A-FORM 1641,THERM-A-FORM 1642,THERM-A-GAP G574,THERM-A-GAP G579,THERM-A-GAP G974,THERMFLOW T557,THERMFLOW T710,THERMFLOW T558,THERM-A-FORM T642

技术文档 - PARKER CHOMERICS - 2021-04 PDF 英文下载

Speeding Development. Reducing Risk. Electromagnetic Interference (EMI) Shielding and Thermal Interface Materials Solutions for Life Science Devices

型号- PREMIER™ A240-FRHF,WIN-SHIELD™ P,SOFT-SHIELD® 4850,CHO-SEAL® 1285,PREMIER™ PEI 140,THERM-A-GAP™ GEL 30,CHOFORM® 5528,CHO-SHIELD® 2040,PREMIER™ A220-HT,THERM-A-GAP™ 974,CHO-SHIELD® 2044,CHO-SEAL® 6370,THERM-A-GAP™ 976,THERM-A-GAP™ 579,WIN-SHIELD™ G,THERM-A-GAP™ GEL 8010,THERM-A-GAP™ HCS10,CHO-SEAL® S6305,DURALAN™ P,CHO-SEAL® 1298,CHO-SEAL® 6502,THERM-A-GAP™ GEL 45,THERM-A-GAP™ G974,THERM-A-FORM™ T646,CHOFORM® 5513,CHO-SHIELD® 2056,THERM-A-FORM™ T647,CHO-SEAL® 6503,PREMIER™ A240-ST,THERM-A-GAP™ TC50,THERM-A-GAP™ 569,PREMIER™ PBT-225,SOFT-SHIELD® 3500,THERM-A-FORM™ 1641,SOFT-SHIELD® 3700

商品及供应商介绍 - PARKER CHOMERICS - 10/18 PDF 英文下载