8 Advantages to Know About Spring Probe Contact Technology in the Space Industry
The requirements of space flight components must be carefully taken in account when designing a spring-loaded connector.When looking at spring probe contact technology the solution you choose must meet the mechanical, electrical and environmental performance requirements required in today’s space market. The lifecycle of spring contact probes is dependent on the design of the probe and as well as the operating conditions in the field. Design and manufacturing challenges take place to meet the rigors of the space market environmental requirements.
The following are 8 key advantages to know about spring probe contact technology in the space industry:
1. Shock and Vibration: When designing for shock and vibration, it is essential to have a good understanding of the application requirements. Standard requirements are 20 G sine and random vibration, and 50 G shock with no micro interruption longer than 1 microsecond. Mission requirements exceed these values often with the use of explosive bolts and latches. This can drive the shock accelerations into the thousands of G’s. Spring probes design variants are proven to survive over 2000 G shock.
2. Thermal cycling: Designing for elevated temperatures, the spring material selection must address stress relaxation. Typical materials for the spring are Beryllium Copper, Music Wire and Stainless Steel. Most common temperature test performed for spring material range from -85°C to 250°C, although some applications may require a wider range of temperatures.
3. Cycle Life: In most space applications, the connector is mated / unmated just a few times (during testing or device assembly) – although movement of the plungers may be dictated during shocks or thermal cycling. Applications requiring active cycling are achievable; with known environmental conditions. Hundreds to thousands of cycles are achievable.
4. Vacuum conditions: This limits the selection of the insulation materials as well as the plating process and poses requirements on general cleanliness of the manufacturing process.
5. Absence of debris / loose particles: Material selection must be selected in order to minimize the risk of having loose particles, ensure that material selection, plating and biasing design is considered in detail. Spring probe assembly operations should be performed in as clean an environment as possible.
6. Contact resistance: Contact resistance requirements may vary significantly with the application. A low and stable contact resistance is ideal, although, for signal applications, may not be strictly mandatory.
7. Current rating: Depending on the application – usually current rating for signaling applications is low (less than 1A), but higher currents may be required in some cases.
8. Signal integrity: Depending on the application for high frequency coaxial interconnects and/or high speed digital differential pair applications, it is paramount that signal integrity must be maintained with frequencies of DC-50 GHz and data rates up to 10 Gbps. The solution must be designed to meet your requirements comprised of a solderless board to board standalone compressible coaxial or differential spring probe configurable to various stacking heights and size constraints while meeting your electrical signal integrity requirements and mechanical packaging constraints.
This will help you achieve your X-Y misalignment tolerance conditioning issues and z-axis size constraints with a greater ease of assembly with vastly reduced costs, complexity and rework while meeting your electrical performance requirements. This offers 4-5 degrees of freedom forgiveness and manufacturing alleviations.
Smiths Interconnect's spring probe contact solutions feature IDI contact technology, are compliant which makes them ideal for blind mate applications as they offer forgiveness or x, y, z, rotational and angular misalignment of the target. Offered in compressed heights less than 2 mm and utilized on pitches as tight as 0.4 mm, they are well suited for high density, board-to-board, battery contact and high frequency space applications.
Long cycle life
Stable contact resistance
Superior compliance
Reliable signal integrity
Ease of assembly and lower cost of ownership
In summary, spring probe contact technology can provide significant benefits in space and satellite applications over traditional pin and socket connector systems. It is critical to fully understand the application requirements to best balance the design trade-offs to make the best implementation of spring probe contacts and connectors to meet the reliability and efficient design needs of today’s satellite and space craft challenges.
Decades of experience have positioned Smiths Interconnect well – both in designing and delivering state of the art spring probe solutions specifically engineered and designed to support the trends and technology of the future.
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型号- ST1091,C13PSC-----,C13PSC01AAZ,C19ESC-----,C13RSC-----,C07CPMET---,C19CRMET---,C07XSC-----,C07YSC-----,C07ZSC-----,23840,23841,R21RDC-----,C13YSC-----,C13XSC-----,C13ZSC-----,C07R,C19R,C13ESC-----,C07P,ST1089,C19P,C13PSC01CH01AAZ,C19CPRUBFPR,R21PSC--CH-----,R12PSC--CH-----,C07PSC--CH-----,R12RSC-----,C13PSC--CH-----,C19PSC--CH-----,R12PSC01AAZ,C13CRRUBFPR,C07CPRUBFPR,C13CRMET---,C19RDC-----,C19YSC-----,C07RDC-----,C7ZSC--CH-----,R12RLC-----,R21RSC-----,R21RLC-----,R21PSC-----,C07ESC-----,C13R,C07CRMET---,C13P,C13ZSC--CH-----,R12PSC-----,C13RDC-----,M1035,M1036,C19ZSC--CH-----,C19XSC-----,C13CPMET---,C07RSC-----,C19ESC--CH-----,C07PSC-----,R30RDC----,C19CRRUBFPR,C07ESC--CH-----,R30RLC----,SNAPTAC□□□□□□□□□□□□□□□,C19PSC-----,C19CPMET---,R12RDC-----,C19ZSC-----,C19RSC-----,C07CRRUBFPR,R12PSC01CH01AAZ,C13ESC--CH-----,C13CPRUBFPR,SNAPTAC□□□□□□□□□□□
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描述- Smiths Interconnect 是商业航空航天领域高可靠性连接产品和服务的主要供应商。公司提供高性能连接器解决方案、天线系统、射频组件和电缆组装，服务于飞行控制与导航系统、发动机系统、电源分配、卫星通信连接等多种航空应用。其技术品牌包括 EMC、Hypertac、IDI 等，专注于为高科技、高质量解决方案提供卓越性能，以满足高度安全和耐用性需求。此外，Smiths Interconnect 还提供广泛的认证标准和技术支持服务，以适应全球市场。
SPRING PROBES Loose Probe & Connector Solutions 产品介绍
描述- Smiths Connectors作为弹簧接触探头设计的全球领导者，提供了一系列弹簧探头连接器解决方案。这些解决方案具有低剖面、高合规性比、高频性能、低稳定电阻、高插入寿命等特点，适用于医疗、航空、国防、工业、铁路、石油天然气、替代能源、测试测量和太空等多个市场和领域。资料详细介绍了不同型号的探头规格、尺寸和材料，以及连接器在各个领域的应用。
型号- 101111,305330-000,101190,101506,101628,101402-000,100410,100410-005,100891-002,PI-5327,101628-000,100671,101247-001,100671-000,101582-000,101050-003,100606-000,101712-000,PI-5329,101119-001,PI-5328,101111-000,101506-000,101190-002,101438-000,101679,101712,101438,101119,101050,305327-000,100804-002,101294,305328-000,101050-005,101294-000,305329-000,PI-5330,101247,101402,101582,100891,100803-011,101679-000,101530-000,100803,100606,100804,101530
ITT（埃梯梯）Cannon Nemesis节约空间型连接器选型指南
目录- Company Profile Connector Systems Nemesis Space Saver Connector Product Safety Information Others Connector
型号- NEM-SSSR-714PGNT-XXXB,NEM-SS
空间连接解决方案
描述- Smiths Interconnect作为太空应用中选择的首选供应商，提供安全、高效且高度可靠的连接解决方案。公司凭借超过80年的太空市场经验，设计并制造了小型化、轻量化且坚固耐用的产品，以应对振动、冲击、极端温度和辐射等恶劣环境。其技术品牌包括EMC、Hypertac、IDI、Lorch、Millitech、Plastronics、Reflex Photonics、RF Labs、Sabritec、TECOM、TRAK和HSI，这些品牌以其在高科技和高品质解决方案中的卓越性能而闻名。产品组合涵盖了高可靠性电气连接器和电缆组件、耐用嵌入式收发器、天线系统解决方案以及广泛的创新射频和微波解决方案。此外，Smiths Interconnect还为国际航天机构提供服务，并在多个空间飞行项目中表现出色。
型号- HC SERIES,K2TVA,AURORA,MWC,KU SERIES,AURORA SERIES,MWC SERIES,QT SERIES
Resilient Growth within Space Technology
In summary, in space applications, whether satellites, manned space flights, or ground support equipment, high reliability in really harsh environments is a necessity.
电子商城
品牌：Smiths Interconnect
品类：TEMPERATURE VARIABLE CHIP ATTENUATOR
价格：￥37.0712
现货： 3,100
品牌：Smiths Interconnect
品类：TEMP VARIABLE ATTENUATOR
价格：￥11.5897
现货： 2,677
授权代理品牌：集成电路
授权代理品牌：分立元件
授权代理品牌：接插件及结构件
授权代理品牌：部件、组件及配件
授权代理品牌：电源及模块
授权代理品牌：电子材料
授权代理品牌：仪器仪表及测试配组件
授权代理品牌：电工工具及材料
授权代理品牌：机械电子元件
授权代理品牌：加工与定制
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