The Advantages of High-Density VLP RDIMMs for Edge/5G/IIoT Applications
Edge computing, 5G, and the Industrial Internet of Things (IIoT) are, without a doubt, revolutionizing the information technology landscape and every aspect of people’s lives. Cities are becoming smarter, and so are cars, homes, and industries. Everything is connected to everything, and automation is offering huge potentials for businesses.
At the heart of this revolution is DATA – unprecedented amounts of data are being generated, transferred, accessed, analyzed, and transformed into usable, actionable insights at blistering speeds. Enabling and accelerating this vastly connected, intelligent future is MEMORY.
As Quick as Real Time: High Density, High Speed, Low Latency
Data is moving closer to the source; meaning it is stored, processed, and analyzed near the physical location where it was actually obtained, instead of staying in the cloud or in centralized repositories. According to Gartner, “Edge computing tackles a growing demand to address lower latency, process the growing amount of data on the edge and support resilience to network disconnection.”
A Gartner report estimates that while around 10% of enterprise-generated data is currently created and processed outside a traditional centralized data center or cloud, this will reach 75% by 2025.
Devices requiring ultra-fast responses such as autonomous vehicles will benefit much from high-capacity DRAM, as more high-performance applications can run at the same time. High-capacity DRAMs mean reduced CPU loads, so you can expect faster boot-up times, overall improved performance, and speedier data transfers.
Can the DDR4 Memory Standard Keep Up?
While DDR5 definitely promises faster performance, higher memory bandwidth, and higher densities, many systems are still unable to migrate and continue to run on DDR4. To meet the increasing memory requirements of edge, 5G, and IIoT systems running DDR4, ATP Electronics is offering 64 GB DDR4 very low profile registered DIMMs (VLP RDIMMs) to enhance these systems’ capabilities to process huge amounts of data.
These high-performance VLP RDIMMs offer twice the density of typical 32 GB VLP RDIMMs available in the market to meet the increasing memory requirements resulting from the endless generation of data from connected cars, smart factories, and other 5G I/IoT applications. The memory speed boosts processing and computational power to effectively handle expanding memory requirements.
Organized as 8192 MB x 72 bits in a 288-pin DIMM, each module utilizes 18 chips of 8Gx4 DDR4 SDRAMs in dual-die package (DDP) stacked chips, enabling greater density on a very compact form factor. Each module consists of a 512-byte serial EEPROM containing the module information, and includes error correction code (ECC) to support error detection and correction.
Low Height, High Performance
Blade and 1U rack servers are two of the most common servers used in data centers. A 1U rack server, as its name implies, is usually mounted on a rack, stacked, and fitted within a metal enclosure. One standard rack unit is 1.75 inches or 44.75 mm.
Blade servers are smaller, modular, single-board computers. They are physically thin, which is why they are commonly used in large data centers that want to maximize space and conserve power.
Component density is an ever-present challenge for these servers. Due to their compact size and low profile, blade and 1U rack servers have to pack their components within the limited space. During heavy workloads, they require effective cooling and heat dissipation.
ATP’s new 64 GB DDR4 VLP RDIMMs have a printed circuit board (PCB) height of just 18.75 mm or 0.74 inch, making them perfectly suitable for industrial/networking servers with small footprints and small enclosures. They may be placed vertically within blade servers to save space and maximize air flow to dissipate heat effectively and keep the system cool.
RDIMMs: Serving Up Stability, Scalability, Serviceability
Registered DIMMs are no doubt the much better option for server applications. With a registering clock driver (RCD) buffering command and address signals between the host memory controller and the DRAMs or memory chips on the DIMM, an RDIMM delivers better signal integrity for overall high performance and stability. RDIMMs can handle increased workloads at lower total cost of ownership with their comprehensive reliability, availability, and serviceability (RAS) features.
Conclusion
DDR4 remains the essential memory standard even in the face of emerging advances in edge, 5G, and IIoT technologies. ATP continues to improve upon its DDR4 offerings with its new higher-density VLP RDIMMs. Data generation and processing will remain unabated in the coming years, and the new 64 GB VLP RDIMMs are poised to tackle the faster, more intelligent, memory-intensive future.
- |
- +1 赞 0
- 收藏
- 评论 0
本文由涂抹转载自ATP Blogs,原文标题为:The Advantages of High-Density VLP RDIMMs for Edge/5G/IIoT Applications,本站所有转载文章系出于传递更多信息之目的,且明确注明来源,不希望被转载的媒体或个人可与我们联系,我们将立即进行删除处理。
相关推荐
【技术】解析DDR4与DDR3模块的差异和优势
ATP ELECTRONICS第四代双倍数据速率(DDR4)是一种内存标准,旨在更好,更快,更可靠地替代DDR3。本文介绍DDR4与DDR3模块相比的差异和优势。
DDR5 vs DDR4: Is DDR5 finally necessary?
ATP Electronics is committed to meeting the most rigid memory requirements of varied industries. The next-generation DDR5 memory modules are expected to deliver performance and reliability improvements over the previous generation, especially for critical computing applications.
【选型】DDR4与DDR3模块相比的差异和优势
ATP ELECTRONICS第四代双倍数据速率(DDR4)是一种内存标准,旨在更好,更快,更可靠地替代DDR3。DDR4具有288个引脚,而DDR3具有240个引脚。DDR4 SO-DIMM具有260个引脚,而不是DDR3中的204个引脚。本文还介绍了其他DDR4与上一代模块相比的差异和优势。
国产的DDR3或DDR4有没有8Gb或者16Gb的,请给个厂家和具体型号?
目前世强代理的国产品牌ATP,有DDR3内存条,但不是存储芯片,存储芯片,ALLIANCE这边有,DDR3,1.5V的只有4G的,如AS4C256M16D3B-12BCN;DDR3L,1.35V的有8G的如:AS4C512M16D3L-12BxN,AS4C1G8MD3L-12BCN。
Momentum DRAM Series : DDR4 The Global Leader in Specialized Storage and Memory Solutions
型号- R48G00SD328ACSC,R416G0SD3282CSC,R416G0UD328BCSC,R432G0SD3282ASC,R48G00UD328ACSC,R432G0UD328BASC
ATP Wide-Temp DDR4 RDIMMs with I-Temp Registered Clock Driver Ensure Maximum Reliability in Extreme Temperatures
Like all ATP ELECTRONICS DRAM modules, ATP‘s wide-temp DDR4 modules with I-Temp RCD undergo rigorous 100% module-level testing to ensure maximum reliability.
DDR5 Fuels New Memory-Hungry Applications Latest Memory Standard Delivers 2X the Speed, 4X the Capacity, and Greater Power Efficiency Compared with DDR4
ATP ELECTRONICS launched the new Double Data Rate 5 (DDR5). DDR5 promises faster performance, higher memory bandwidth, higher densities, and a new power management structure that delivers better power efficiency.
What are the Common Memory Error Types and How Do ECC DIMMs Work?
ATP DRAM products are used in applications where the highest degree of reliability is required. Memory errors can have a major impact on operations, so ATP painstakingly ensures that all its DRAM products meet the toughest standards.
DDR4-3200 DRAM Solutions Deliver Memory Boost to AMD EPYC™ and 2nd Gen Intel® Xeon® Scal | ATP
Taipei, Taiwan (March 2020) – ATP Electronics announces the release of fast, low-power DDR4-3200 solutions to take full advantage of the latest AMD EPYC™ Family and 2nd Generation Intel® Xeon® Scalable Processors (formerly codenamed Rome and Cascade Lake, respectively). ATP’s DDR4-3200 modules ensure a big boost in performance, compute density and productivity with their fast 3200 MT/s data rate to optimize the power of AMD’s eight-memory channel and Intel’s six-memory channel architectures.
Understanding RAM and DRAM Computer Memory Types
ATP offers industrial memory modules in different architectures, capacities and form factors. ATP DRAM modules are commonly used in industrial PCs and embedded systems. Resistant against vibration, shock, dust and other challenging conditions, ATP DRAM modules perform well even under the most demanding workloads and applications, as well as in different operating environments.
【产品】用于AI人工智能服务器的工业级DRAM产品,具有更高容量,更高速度和更高可靠性
随着人工智能以及大数据的发展,对内存的需求急剧上升,进而需要更多硬件支持。ATP提供了完整的DRAM解决方案,可满足人工智能和机器学习工作负载不断增长的内存需求。
【产品】ATP为嵌入式物联网提供嵌入式存储器、存储卡和DRAM模块等“工业专用”产品组合
ATP Electronics是“工业专用”存储器和存储解决方案的领先制造商,在日本IT周春季第22届嵌入式系统博览会(ESEC)上展示了其为嵌入式物联网(IoT)设计和制造的广泛且自主的产品组合,包括嵌入式存储器、安全且可扩展的A1性能级存储卡和包括DDR4、DDR3模块在内的工业DRAM。
电子商城
现货市场
服务
可定制ATP TE Cooler的冷却功率:40~200W;运行电压:12/24/48V(DC);控温精度:≤±0.1℃; 尺寸:冷面:20*20~500*300;热面:60*60~540*400 (长*宽;单位mm)。
最小起订量: 1 提交需求>
登录 | 立即注册
提交评论