Smiths Interconnect Socket Improving Time-and Cost-efficiency In Reliability Burn-in Testing
When companies develop new devices, they must ensure there are no failures in the field. This means that thorough reliability burn-in testing must take place from the start to avoid malfunctions down the road.
The process of innovation and semiconductor testing takes time and money, so how do you make testing and manufacturing processes more affordable and efficient? Let’s talk more about optimizing space on circuit boards and how this can be a domino effect for time- and cost-efficiency.
Optimizing socket use in burn-in testing
Burn-in is a testing process designed to detect early life failures in semiconductor devices and reduce the potential for defects and catastrophes in the field. During burn-in, semiconductor devices endure extreme operating conditions, including elevated temperatures, high use cycles, and high voltages. The goal is to eliminate defective parts or those with short lifespans before they can become a factor in a system failure.
Reliability burn-in requires a few necessary items: a burn-in board, sockets, and a system to provide the signal, power, and temperature regulation needed to stress the device under test (DUT).
Reliability Burn-In Standards are set by the JEDEC Solid State Technology Association and require a specific number of sockets. For example, let’s say you have to buy multiples of 80 – for reliability burn-in testing. If you have to buy 80 sockets at $100 per socket, and spread those sockets out across two to four circuit boards, that’s quite a bit of space and money being spent.
That’s where multisite sockets come in. Wouldn’t it be great to have a socket which could house more than one device?
Instead of buying 80 sockets, you could decrease the number of sockets and increase the number of rest positions. Not only is it then possible to decrease the number of burn-in boards, but it frees up capacity in the burn-in chamber. It is much more efficient to load a socket with 2-4 positions versus loading one socket at a time, so it is an added benefit that labor costs are potentially reduced.
Multisite doesn’t mean compromising on signal
But do more packages on a single socket mean you’re losing signal or performance? Not at all.
With our sockets here in the Smiths Interconnect's Semiconductor Test Business Unit, they do not compromise on raw materials, components, or manufacturing processes.
For example, we still use the H-Pin to provide a high-performance socket that is affordable for all burn-in operations. The H-Pin is a stamped spring probe with the mechanical, electrical, and thermal performance of a spring probe and the ease of use and high volume manufacturability of a stamped contact. It serves applications without the typical compromises required when considering cost versus performance.
Why Smiths Interconnect use the H-Pin:
Improved electrical performance: Designed to provide excellent electrical and mechanical performance, H-Pins reduce the risk of damage to the electronic component during insertion and removal. They provide a calculated contact force, which ensures a secure and stable connection between the component and the socket or connector. The H-Pin design also reduces contact resistance, leading to better electrical performance.
Better signal integrity: H-Pins provide a more constant and consistent contact force across all the pins, ensuring the signals transmit uniformly without loss or distortion. This leads to better signal integrity, improved data transfer rates, and reduced noise.
Enhanced durability: Made from BeCu with a stainless steel coil spring that can withstand high temperatures and mechanical stress, H-Pins are more durable than other contact pins with a longer life span, leading to lower maintenance costs and reduced downtime.
Compatibility: H-Pins can be used in a wide range of electronic applications, making them a versatile solution for electronic sockets, connectors, and adapters.
How do you know when multisite sockets are right for your burn-in testing?
Having been in this business for over 50 years, and having built the strong relationships we have with our customers and partners, we are able to truly understand and predict the situations that call for multisite socket use.
Ultimately, we know that many of our customers are facing pressure to “do more with less”, which is why we will make sure they know when to utilize multisite sockets.
There are some complex cases when multisite sockets aren’t the right choice – most have to do with minimizing the proximity of high voltage and high-temperature components. Having these interconnects too close together may affect each other thermally, mechanically, or electrically. This would be the primary case in which multisite sockets would not be ideal.
Other ways Smiths Interconnect make testing and manufacturing more affordable and time-efficient
Whether your challenge is cost, capability, lead time or quality, Smiths Interconnect has the in-house technologies and manufacturing capabilities to solve your burn-in and test challenges. From decades of experience and flexible tooling, to standard product lines and the world’s greatest pin technologies, our customers are saving money and shipping quality parts out the door.
Our patented technologies are based on solving the difficult industry problems associated with high frequency, high current, low resistance and adequate contact travel. Furthermore, our unique automated manufacturing process ensures that you get the quickest lead-times on any new project or modifications to existing products.
Benefits of Smiths Interconnect test sockets
Smiths Interconnect has been raising the bar of burn-in testing sockets for years. Our socket solutions offer several advantages over traditional socket solutions, including:
Higher pin counts: Smiths Interconnect' sockets can accommodate higher pin counts, making them suitable for high-performance electronic devices.
Greater design flexibility: Smiths Interconnect offers greater design flexibility, allowing for customization and optimization of the socket design to meet specific application requirements.
Reduced manufacturing time: Sockets are produced through automated assembly, reducing manufacturing time and costs.
Improved electrical performance: Smiths Interconnect provides socket solutions that offer enhanced electrical performance, with better signal integrity, lower crosstalk, and better impedance control.
Quick recap: top 3 benefits of multisite burn-in test sockets
Save money on purchasing fewer socket
Save space by using one socket in multiple positions
Save time on labor and manufacturing
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本文由涂抹转载自Smiths Interconnect blogs,原文标题为:Improving time- and cost- efficiency in reliability burn-in testing,本站所有转载文章系出于传递更多信息之目的,且明确注明来源,不希望被转载的媒体或个人可与我们联系,我们将立即进行删除处理。
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24,W PJ A 05A NNNN 283,W EA A 05D MDBN 000 ..,W PC A 04A NNNN 294,W PJ A 04A NNNN 283,W RC A 04B MRAN 283 ..,W RL A 05B MRAN 293 ..,W PC A 04A NNNN 293,W EA A 04D MDAN 000 ..,W DA A 05C FDAN 000 ..,W DD A 04C FDAN 000 ..,021.000402.1020,W PJ A 08A NNNN 293,W PJ A 08A NNNN 294,W DE A 05C NNNN 000,B287/24 - 20,W ED A 04D MRAN 000 ..,021.001036.1025.A2,W RE A 08D NNNN 308,W EB A 08D MRDN 000,W ED A 04D NNNN 000,SERIES W,W RE A 05D NNNN 283,W RC A 04B NNNN 294,W ED A 05D MDAN 000 ..,B287/28-24,W DC A 04C FRAN 000 ..,W RC A 04B NNNN 293,W PJ A 05A NNNN 294,W EA A 08D NNNN 000,W PJ A 05A NNNN 293,W PL A 04A FRAN 294 ..,W PC A 04A NNNN 283,W DC A 08C FRCN 000,W EB A 05D MDAN 000 ..,W PC A 08A FRDN 283,020.000376.2000.A2,W RC A 08B MRDN 283,W DA A 08C NNNN 000,FRDN,W ED A 08D MRDN 000,W DE A 04C FRAN 000 ..,W DB A 04C FDAN 000 ..,020.001027.1020,W RJ A 04B NNNN 283 00 A1,W RE A 05D MRAN 294 ..,W DA A 08C FRCN 000,W RE A 08D NNNN 294,W RE A 08D NNNN 293,W RL A 04B NNNN 294,B288/32 - 28,W RL A 04B NNNN 293,W EA A 04D MDBN 000 ..,W EB A 04D MRAN 000 ..,W DA A 05C NNNN 000,W ED A 05D MDBN 000 ..,W PC A 05A FRAN 293 ..,W PE A 04C NNNN 294,W PE A 04C NNNN 293,W RC A 04B NNNN 308,020.001018.2000,W EB A 08D NNNN 000,020.000353.1020,W EA A 04D MRAN 000 ..,021.001005.1025.A2,W ED A 05D MRAN 000 ..,020.001019.2000,W RC A 08B MRCN 283,W PL A 08A FRCN 308,W DC A 05C FRAN 000 ..,W EA A 05D MDAN 000 ..,W RL A 08B NNNN 308,W DA A 08C FRDN 000,W DE A 08C FRDN 000,W RL A 04B NNNN 283,W RL A 04B MRAN 294 ..,W PE A 04C NNNN 283,W EA A 05D NNNN 000,W PL A 04A NNNN 308,W PJ A 05A FRAN 283 ..,W RE A 05D MRAN 283 ..,W DA A 04C FRAN 000 ..,021.001045.1020,W DC A 05C FDBN 000 ..,W PE A 08C FRDN 294,W RC A 05B NNNN 308,W PE A 08C FRDN 293,W PL A 08A FRDN 308,W RL A 05B MRAN 283 ..,W PE A 04C FRAN 283 ..,W RC A 08B MRCN 293,W DB A 05C FDBN 000 ..,W RL A 04B MRAN 283 ..,W DE A 04C FDAN 000 ..,W RC A 08B MRCN 294,W RE A 04D NNNN 308,W PJ A 05A FRAN 294 ..,W RE A 04D MRAN 294 ..,021.001044.1020,W ED A 04D MDBN 000 ..,W RL A 04B MRAN 308 ..,MRDN,W PE A 08C FRCN 283,W RE A 08D MRCN 283,W PE A 08C FRDN 283,W EA A 05D MRAN 000 ..,W PC A 05A FRAN 308 ..,021.001006.1025,W RL A 05B NNNN 283,B287/24-20,W PE A 05C NNNN 283,W RE A 08D MRDN 283,W RE A 04D MRAN 293 ..,020.001022.1020,W EC A 08D MRDN 000,W DA A 04C NNNN 000,W PC A 08A NNNN 308,W PE A 05C NNNN 293,W DB A 08C NNNN 000,020.001020.2000.A2,B288/28 - 24,W RE A 04D MRAN 308 ..,W RE A 08D MRCN 293,021.001035.1025,W PE A 08C FRCN 293,W PE A 08C FRCN 294,W RE A 08D MRCN 294,020.001019.2000.A2,W EB A 04D MDAN 000 ..,021.001035.1025.A2,W PJ A 05A FRAN 308 ..,MRCN,W RC A 08B NNNN 293,W EA A 04D NNNN 000,W RL A 05B NNNN 294,070.000012.2000,W RC A 08B NNNN 294,W RE A 04D MRCN 308,W PE A 05C NNNN 294,W PJ A 08A NNNN 308,W RL A 05B NNNN 293,W ED A 05D NNNN 000,W PC A 08A FRCN 283,W PE A 05C FRAN 294 ..,W DD A 04C FDBN 000 ..,B055A,W PE A 08C FRDN 308,W RL A 05B NNNN 308,020.000376.2000,W PC A 04A NNNN 308,W PE A 05C NNNN 308,W RC A 04B MRAN 308 ..,W DB A 04C NNNN 000,B395,W PJ A 04A NNNN 308,B150,B151,020.000377.2000.A2,W RL A 08B MRDN 283,W PL A 04A NNNN 294,W RC A 08B NNNN 283,W RL A 08B MRCN 308,W EB A 05D NNNN 000,W PL A 04A NNNN 293,W PL A 05A FRAN 308 ..,W PC A 05A FRAN 283 ..,W PJ A 05A FRAN 293 ..,W PC A 08A FRCN 294,W PE A 04C FRAN 293 ..,W RE A 05D MRAN 293 ..,W PC A 08A FRCN 293,020.000378.2000,W EB A 08D MRCN 000,W PC A 04A FRAN 294 ..,W DC A 04C FDBN 000 ..,W PJ A 08A FRCN 283,W PC A 05A FRAN 294 ..,B288/24 - 20,020.001018.2000.A2,W DB A 04C FDBN 000 ..,021.001007.1025,W EC A 08D MRCN 000,W PL A 05A NNNN 293,W RE A 08D MRDN 294,W PL A 05A NNNN 294,W RC A 08B MRDN 308,W RE A 08D MRDN 293,W DC A 08C FRDN 000,W PE A 05C FRAN 283 ..,W PL A 08A FRDN 293,W PE A 04C FRAN 294 ..,021.001005.1025,W PL A 05A FRAN 293 ..,W PL A 08A FRDN 294,W PC A 04A FRAN 293 ..,FDAN,W PJ A 08A FRCN 294,W EC A 05D NNNN 000,090.000029.2000,W PJ A 08A FRCN 293,W DB A 08C FRDN 000,W DE A 08C NNNN 000,W DE A 08C FRCN 000,B055,W PJ A 08A FRDN 308,W RC A 05B MRAN 308 ..,W PJ A 04A FRAN 293 ..,W PE A 08C NNNN 308,W PL A 04A FRAN 308 ..,W DA A 04C FDBN 000 ..,021.001036.1025,W RE A 08D NNNN 283,W EB A 04D NNNN 000,W PL A 08A FRDN 283,W DC A 08C NNNN 000,C/BEL/9,W,机器人,DIGITAL TRACKING,乘客信息系统,乘客娱乐,FACTORY AUTOMATION,INVERTERS,COMMUNICATION APPLICATIONS,VIDEO SURVEILLANCE,COMMUNICATION-BASED TRAIN CONTROL,加工设备,测试工作台,电磁阀,PROBERS,电梯,闪电,CONVEYOR SYSTEMS,ROBOTS,SENSORS,机床,探测器,PASSENGER INFORMATION SYSTEMS,DRIVE MOTORS,PRODUCTION TEST EQUIPMENT,电子显示器,控制设备,视频监控,TEST EQUIPMENT,ENCODERS,定制OEM生产设备,输送机系统,制造机床,ELECTROMAGNETIC VALVES,倒相器,机械,装卸机械,ELECTRONIC DISPLAYS,TICKETING MACHINES,PROCESSING EQUIPMENT,试验设备,驱动电机,BESPOKE OEM PRODUCTION EQUIPMENT,HANDLING MACHINES,MACHINERY,售票机,模拟器,板载千兆互联网网络,基于通信的列车控制,CONTROL EQUIPMENT,生产测试设备,数字跟踪,SIMULATORS,TEST BENCH,通信应用,MANUFACTURING MACHINE TOOLS,ALARMS,RAIL INFRASTRUCTURE,GIGABIT INTERNET NETWORK ON-BOARD,司机室,铁路基础设施,警报,DRIVER CABIN,LIGHTNING,编码器,工厂自动化,MACHINE TOOLS,ELEVATORS,传感器,PASSENGER ENTERTAINMENT
FAQs at Smiths Interconnect: Test Sockets, Capabilities, and Support
At Smiths Interconnect, we receive some of the same questions repeatedly, so we’d like to offer up those answers early on for our existing and potential customers. Here are some of our most frequently asked questions, and if you still have thoughts, questions, or concerns, we’re here to help!
A Paradigm Shift in Simulation Techniques of Semiconductor Test Sockets
With the rise of the Internet of Everything (IoT), 5G, artificialin tellig ence ( AI ) and augmented reality (AR), high-performance test socket technology must keep pace. Performance specifications for test sockets published by suppliers should only be used as a general guideline in selecting the product family for a test application. Once a socket technology is chosen based on the general specification, suppliers should provide a more representative simulation of the socket based on the customer’s package layout with a focus on the high-speed areas of the device.
达芬奇56-高性能同轴测试插座
本资料由Smiths Interconnect于2020年发布,主要介绍了其高性能同轴测试插座DaVinci 56。资料涵盖了Smiths Interconnect的概述、产品组合、技术品牌、全球能力以及DaVinci 56测试插座的特点和优势。资料重点介绍了DaVinci 56在高速数据传输、高功率和高引脚数IC开发中的应用,以及其在阻抗匹配、信号完整性、耐用性和机械性能方面的卓越表现。
SMITHS INTERCONNECT - 短弹簧探针,VOLTA探头,0.80毫米螺距探头,SPRING PROBES,0.80 MM PITCH PROBE,CELSIUS SOCKETS,SILMAT SOCKET,SILMAT插座,SHORT SPRING PROBE,DAVINCI SOCKETS,SINGLE ENDED 0.80 MM PITCH PROBES,弹簧探针,HIGH SPEED TEST SOCKET,微型同轴插座,DIFFERENTIAL PAIR 0.80 MM PITCH PROBES,单端0.80MM螺距探头,高速测试插座,标准阵列插座,摄氏度插座,欧几里得插座,MICRO CO-AX SOCKETS,差分对0.80 MM螺距探头,达芬奇插座,STANDARD ARRAY SOCKETS,EUCLID SOCKETS,VOLTA PROBE HEADS,851-0023056-H00,851-0003643-H01,AUTOMOTIVE TESTING,DISPOSABLES SPACE,AUTOMOTIVE,ELECTRONIC WARFARE,VEHICLES,外围包装测试,监视与侦察(ISR),通信,基础设施,SEMICONDUCTOR TEST,WAFER LEVEL TEST,智能化,COMMUNICATIONS,REMOTE RADIO INSTALLATIONS,SURVEILLANCE AND RECONNAISSANCE (ISR),数据中心,PATIENT MONITORING,发射器,一次性空间,MEDICAL,5G NETWORKS,远程无线电装置,重型设备,电子测试,机车车辆,4G网络,RADAR,4G NETWORKS,TEST AND MEASUREMENT,GEO/MEO SATELLITES,低轨卫星,包对包测试,分布式天线系统,RF AND MICROWAVE TESTING,DEFENSE,SIGNALING,PERIPHERAL PACKAGE TEST,工业自动化,ROLLING STOCK,AVIONICS EQUIPMENT,电子战,医学,发信号,INTELLIGENCE,汽车,LAUNCHERS,地面保障设备,INDUSTRY,成像系统,UTILITIES,AEROSPACE,配电,AREA ARRAY TEST,WIRELESS INFRASTRUCTURE,商业航空航天,外科系统,POWER DISTRIBUTION,TELECOMMUNICATIONS,HEAVY EQUIPMENT,DATA CENTERS,试验和测量,雷达,LEO SATELLITES,机械,PACKAGE ON PACKAGE TEST,SURGICAL SYSTEMS,面阵试验,卫星通信宽带连接,INDUSTRIAL,TRANSPORTATION,航空航天,无线通讯,MACHINERY,INFRASTRUCTURES,IMAGING SYSTEMS,GROUND SUPPORT EQUIPMENT,航空电子设备,晶圆级测试,交通运输,汽车试验,工业,国防,发动机系统,INDUSTRIAL AUTOMATION,ELECTRONICS TESTING,公用事业,车辆,半导体测试,DISTRIBUTED ANTENNA SYSTEMS,5G网络,COMMERCIAL AEROSPACE,病人监护,GEO/MEO卫星,射频和微波测试,SATCOM BROADBAND CONNECTIVITY,ENGINE SYSTEMS,无线基础建设
Hyper系列1.02mm(0.040in.)联系人
该资料介绍了HYPER系列连接器的技术规格,包括接触器尺寸、电流承载能力、插拔寿命、材料构成和镀层厚度等详细信息。
SMITHS INTERCONNECT - 母头触头(插座),触点,MALE CONTACTS (PINS),FEMALE CONTACTS (SOCKETS),公触头(插引脚),CONTACTS,HYPS102O127A001,HYPS102E127A001,HYPS102E127A002,HYPP102U127A001
QN系列加速寿命测试解决方案
该资料介绍了Smiths Interconnect公司生产的QN系列烧录插座,用于下一代IC封装的高可靠性测试。这些插座具有模块化设计,适用于多种QFN封装,并提供广泛的尺寸和配置选项。
SMITHS INTERCONNECT - OPEN TOP QFN SOCKET,开顶式QFN插座,BURN-IN SOCKETS,老化插座,QN-SERIES,QN SERIES
达芬奇系列测试插座高速测试
Smiths Interconnect推出的DaVinci系列高速测试插座,专为高频集成电路(IC)测试设计,支持高达67 GHz的模拟射频和56 Gbps的非归零(NRZ)数字信号。该系列产品采用弹簧探针技术和专有的绝缘材料,提供匹配的同轴阻抗、低电感、高电流承载能力和低接触电阻等特点。
SMITHS INTERCONNECT - 测试插座,TEST SOCKET,DAVINCI 56,DAVINCI 45G,医学,AUTOMOBILE,OPTICAL & SILICON PHOTONICS,GAME CONSOLES,通讯,INDUSTRIAL,深度学习,光学与硅光子学,AI,游戏控制台,DEFENSE,DEEP LEARNING,艾艾,电脑,COMPUTER,MEDICAL,汽车用品,国防,工业,COMMUNICATION
QH系列H-PIN插座加速寿命测试解决方案
本资料介绍了Smiths Interconnect公司生产的QH系列高可靠性测试插座。该系列产品采用H-Pin技术,适用于下一代集成电路包的高可靠性测试,具有小型化设计、广泛的可配置选项和高频、高电流、高温等特性。
SMITHS INTERCONNECT - FULLY MOLDED SOCKET,H-PIN SOCKET,H-PIN插座,完全模制的插座,BURN-IN SOCKETS,老化插座,QH-SERIES,QH SERIES
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