罗杰斯亮相第五届西部微波会，展示用于工业雷达、汽车雷达、微波通信和高可靠性领域的材料

Rogers（罗杰斯）高频层压板材料和粘结材料选型指南（中文）

公司及产品简介    层压板材料    粘结材料    金属箔    厚度、公差和板材尺寸    订购信息    电气表征能力    主要市场   

ROGERS  -  3D可打印介质材料,层压板材料,玻纤布半固化片,粘结材料,半固化片,粘结片,陶瓷半固化片,陶瓷热固性半固化片,电解铜箔,热固性微波材料,热固性粘结片,粘结膜,埋阻铜箔,热固性导热导电胶,金属箔,模压成型介质材料,铜箔,热塑性粘结膜,低轮廓反转处理电解铜箔,层压板,压延铜箔,碳氢化合物半固化片,导热导电胶,陶瓷PTFE粘结片,高频层压板,RO4534,RO3203,RO4533,TC 系列,KAPPA® 438,RO4003C,RO4533™,5880LZ,ISOCLAD933,CLTE-MW,ISOCLAD 933,RT/DUROID 6002,CUCLAD 217,RO3035™,COOLSPAN® TECA,RO4725JXR™,CUCLAD,6010.2LM,CLTE™,TMM®,CLTE-AT™,RT/DUROID 6006,RO4730G3 LOPRO®,RO4003C LOPRO®,RO4534™,XTREMESPEED™R01200M,RO4835T™,6002,RO3210,AD1000™,R03003™,10I,AD350A™,AD255C™-IM,RO3006™,RO4730G3™,RO3010™,TC600™,RO3206,AD 系列™,RO4535,RT/DUROID 6202PR,RO4535™,RT/DUROID5870,RO4835 LOPRO®,RO4534 LOPRO®,RO4533 LOPRO®,ISOCLAD917,6250,RO4730G3 ED,AD250C™,RO3003G2™,RO4360G2,ISOCLAD® 917,CUCLAD 233,RT/DUROID® 5880LZ,6006,TC600,RO4835™,RO4535 LOPRO,AD300D™-IM™,RO3035,RO4835IND™ LOPRO,TMM 13I,R03206,MAGTREX® 555,CLTE-XT™,RO3210™,AD255™,AD300™,RO3206™,TMM® 3,RO4350B LOPRO®,XTREMESPEED™ RO1200™,TMM 10,RT/DUROID® 5870,TC350,RO4360G2™,RO3003,CLTE-MW™,RO3000,CLTE,DICLAD® 880,RO3003G2,13I,RO4350B,CUCLAD 250,RT/DUROID 5870,DICLAD 527,DICLAD527,AD255C™,RO3003™,6700,DICLAD 880,CLTA™,DICLAD® 527,RT/DUROID 5880LZ,RT/DUROID 6202,RO3000® 系列,RO4000® 系列,TC350 PLUS,6202,RO3010,RO4350B™,RT/DUROID 6035HTC,DICLAD® 系列,RO4450F™,ISOCLAD® 系列,AD300D™,CUCLAD® 系列,RT/DUROID 5880,AD350™,AD350,R04450T™,DICLAD 870,6202PR,SPEEDWAVE® 300P,ANTEO™,CLTE-XT,RO3006,RO4830™,AD1000,TMM 10I,5880,AD300,TMM 6,TMM 4,RT/DUROID 6010.2LM,CU4000 LOPRO,RO3203™,RO4003C™,AD250™,2929,TC350™,DICLAD® 870,R04460G2™,588018X12H1/H1R30200+-001DL,R03203™,CU4000,CLTE-AT,DICLAD® 880-IM,AD250,CLTE 系列™,6035HTC,AD255,RO4835,RO3003M™,CUCLAD® 217,功率放大器,汽车,热管理,计算设备,测试测量,天线系统,小基站,航空系统,微波回传,物联网,射频印制电路,雷达系统,分布式天线系统,IP基础设施,信息娱乐,移动互联网设备,数据中心,有线基础设施,通信系统,卫星电视,移动互联设备,汽车雷达传感器,天线,连接设备,无线基础设施

Rogers（罗杰斯）高频层压板材料和粘结材料选型指南（英文）

Rogers Corporation is the world’s leading manufacturer of high performance dielectrics, laminates and prepregs used in microwave and RF printed circuit and related applications in Aerospace & Defense, Wireless & Wireline (digital) Infrastructure, Automotive Radar Sensor, Satellite TV, Mobile Internet Device and High End Chip Scale Packaging.

ROGERS  -  THERMOSET GLASS REINFORCED PREPREG,PTFE随机玻璃纤维,编织玻璃94 V-0层压板,HYDROCARBON CERAMIC,热固性导热导电胶膜,半固化片,HIGH PERFORMANCE DIELECTRICS,PREPREGS,PTFE CERAMIC,THERMOSET MICROWAVE MATERIALS,BONDING MATERIALS,HYDROCARBON UL 94 V-0 LAMINATES,热固性微波材料,粘结片层,陶瓷UL 94 V-0层压板,PTFE RANDOM GLASS FIBER,层合板,磁介质层压板,TECA FILM,玻璃纤维增强聚四氟乙烯,高性能电介质,热塑性粘合膜,THERMOSET THERMALLY & ELECTRICALLY CONDUCTIVE ADHESIVE FILM,交叉编织玻璃纤维增强聚四氟乙烯,3D可打印介电材料,MAGNETO-DIELECTRIC LAMINATES,玻璃纤维增强聚四氟乙烯天线级层压板,专利陶瓷、热固性聚合物复合材料,NON-WOVEN GLASS REINFORCED PTFE,粘接材料,导热导电胶电影,烃类陶瓷,WOVEN GLASS REINFORCED PTFE,CROSS-PLIED WOVEN GLASS REINFORCED PTFE,BONDPLYS,PROPRIETARY CERAMIC, THERMOSET POLYMER COMPOSITES,WOVEN GLASS REINFORCED PTFE ANTENNA GRADE LAMINATES,无纺玻璃纤维增强聚四氟乙烯,聚四氟乙烯陶瓷,3D-PRINTABLE DIELECTRIC MATERIALS,CERAMIC UL 94 V-0 LAMINATES,碳氢化合物UL 94 V-0层压板,热固性玻璃纤维增强半固化片,LAMINATES,WOVEN GLASSUL 94 V-0 LAMINATES,THERMOPLASTIC BONDING FILM,RO4534,RO3203,RO4533,KAPPA® 438,RO4003C,RO4533™,AD300D-IM,CLTE-MW,COOLSPAN,ISOCLAD 933,RT/DUROID 6002,CUCLAD 217,AD255C,RO3035™,AD300D,COOLSPAN® TECA,RO4725JXR™,AD250TM,CUCLAD,CLTE™,6010.2LM,CLTE-AT™,RT/DUROID 6006,RO4003C LOPRO®,RO4730G3 LOPRO®,RO4534™,XTREMESPEED RO1200,CLTE SERIES,CUCLAD® 6250,RO4835T™,6002,RO3210,RO4350B LOPRO,AD350A™,AD255C™-IM,RO3006™,RO4730G3™,RO3010™,TC600™,RO3206,RO4535,RT/DUROID 6202PR,RO4535™,RO4835 LOPRO®,RO4534 LOPRO®,RO4533 LOPRO®,6250,RO4730G3 ED,TC600TM,AD255TM,RT/DUROID 6202PR 0.005",AD250C™,RO3003G2™,RO4360G2,ISOCLAD® 917,CUCLAD 233,RADIX,RT/DUROID® 5880LZ,AD350A,6006,TC600,RO4835™,RO4535 LOPRO,TMM®10,AD300D™-IM™,DICLAD,RO3035,RO4835IND™ LOPRO,KAPPA,RO4000,TMM 13I,AD SERIES,RO4730G3,CLTE SERIES™,MAGTREX® 555,TMM®13I,ISOCLAD,CLTE-XT™,RO3210™,CUCLAD 6700,TMM® 3,RO3206™,RO4350B LOPRO®,ANTEO,RT/DUROID 6202PR 0.020",XTREMESPEED™ RO1200™,TMM 10,RT/DUROID® 5870,TC350™ PLUS,TC350,RO4360G2™,RO3003,RT/DUROID 6010.2 LM,CLTE-MW™,RO3000,CLTE,DICLAD® 880,RO3003G2,588018X12H1/H1R30200+-001DI,RO4350B,AD300TM,CUCLAD 250,RT/DUROID 5870,DICLAD 527,RO4835T,AD255C™,RO3003™,6700,RO4460G2™,DICLAD 880,DICLAD® 527,RT/DUROID 5880LZ,RT/DUROID 6202,RO4835IND,TC350 PLUS,AD350TM,RO4350B™,6202,RO3010,RT/DUROID 6035HTC,RO4450F™,RO4835 LOPRO,AD300D™,RT/DUROID 5880,RT/DUROID 6202PR 0.010",DICLAD 880-IM,AD350,KAPPA 438,DICLAD 870,6202PR,SPEEDWAVE® 300P,ANTEO™,CLTE-XT,RO3006,RO4830™,RO4830,TMM 10I,5880,AD300,AD255-IM,RT/DUROID,TMM 6,TMM 4,TMM®10I,DICLADR 880-IM,RT/DUROID 6010.2LM,TC350 TM,CU4000 LOPRO,RO3203™,ISOCLAD 917,RO4003C™,2929,TC350™,RO4460G2,DICLAD® 870,RO4450F,TMM,CLTE-AT,RO4450T™,TMM®4,AD250,AD250C,TC SERIES,TMM®3,6035HTC,AD255,RO4835,CUCLAD® 217,TMM®6,RO4450T,SATELLITE TV,DIGITAL INFRASTRUCTURE,航空航天,DLP,DIGITAL LIGHT PROCESSING,RF PRINTED CIRCUIT,SLA 3D PRINTING PROCESSES,AUTOMOTIVE RADAR SENSOR,AEROSPACE,立体光刻3D打印工艺,WIRELESS INFRASTRUCTURE,STEROLITHOGRAPHY 3D PRINTING PROCESSES,国防,WIRELINE INFRASTRUCTURE,数字基础设施,射频印刷电路,数字投影系统,HIGH END CHIP SCALE PACKAGING,SLA 3D打印工艺,微波电路,DEFENSE,有线基础设施,MOBILE INTERNET DEVICE,高端芯片级封装,DLP公司,卫星电视,移动互联设备,MICROWAVE CIRCUIT,汽车雷达传感器,无线基础建设

RT/duroid® 5870 / 5880高频层压板数据资料表

ROGERS  -  层压板,玻璃微纤维增强PTFE复合材料,高频层压板,RT/DUROID 5870,RT/DUROID 5880,RT/DUROID® 5880,RT/DUROID® 5870,商用航天宽带天线,带状线电路,微带线电路,点对点数字射频天线,毫米波设备,军用雷达系统,导弹制导系统

RO4000®系列碳氢陶瓷层压板数据表

RO4000®系列碳氢陶瓷层压板专为高频电路设计，提供优异的高频性能和低成本电路制造。该材料具有低损耗特性，可使用标准环氧/玻璃（FR-4）工艺加工，适用于多种应用。其介电常数温度系数极低，介电常数在宽频率范围内稳定，适合宽带应用。此外，RO4000材料的Z轴热膨胀系数与铜相似，具有良好的尺寸稳定性。

ROGERS  -  陶瓷层压板,HYDROCARBON CERAMIC LAMINATES,CERAMIC LAMINATES,碳氢陶瓷层压板,REINFORCED HYDROCARBON,强化碳氢化合物,RO4000 SERIES,RO4000®,RO4000,RO4003C,RO4000® SERIES,RO4350B™,RO4003C™,POWER AMPLIFIERS,LNB,CELLULAR BASE STATION ANTENNAS,蜂窝基站天线,功率放大器,AUTOMOTIVE RADAR,SENSORS,RF IDENTIFICATION TAGS,传感器,汽车雷达,射频识别标签