【应用】导热凝胶THERM-A-GAP™ GEL37用于家用摄像头散热,出油率低于0.18%TML,不会污染镜头
随着科技的发展,家用摄像头越来越智能化,智能化的标志就是摄像头集成的功能越来越多,但是体积却越做越小,导致的后果就是摄像头的SOC芯片温度越来越高,家用摄像头散热也变成了一个亟待解决的问题。
家用摄像头外壳的材质多为塑料,导热效果不好,而且摄像头就在正面,热量不宜导到正面散热,所以散热只能在摄像头背面想办法。通常的散热方案是在摄像头背面的外壳上面打孔,然后里面装上金属散热器,把PCB板上面SOC芯片的温度通过导热材料导到金属散热器上,然后再利用外壳打孔对流散热。
家用摄像头后壳散热孔
由于监控摄像头是个光学设备,所以对于导热材料的选择就有一定条件,其中之一就是要求导热材料不能有大量的硅油析出,所以市面上很多出油率高的导热硅脂和导热垫片就不能随便选择。PARKER CHOMERICS派克固美丽导热凝胶THERM-A-GAP™ GEL37,出油率低于0.18%TML,CVCM仅有0.07%,可以完美取代导热硅脂和导热垫片的应用,极低的出油率,不会污染摄像头,此外,3.7W/m.K的导热系数可以快速的使得SOC芯片热量快速传递到散热器上,30g/min的流速适合进行连续化的点胶作业,十分适合工业批量生产。
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描述- Parker Chomerics is a global provider of EMI shielding and thermal interface materials as well as electrically conductive thermoplastics and optical products. Parker provides products and services to OEM and CEM electronics companies in the telecommunications, information technology, consumer, power conversion, medical device, defense and transportation markets.
型号- PAD30G,60-XX-D065-ZZZZ,60-XX-4353-ZZZZ,60-XX-D379-ZZZZ,60-XX-D417-ZZZZ,G570,PAD30A,GEL 75,T500,60-XX-6875-ZZZZ,60-XX-D420-ZZZZ,G974,60-XX-D381-ZZZZ,60-XX-4305-ZZZZ,60-XX-D382-ZZZZ,G579,579PN,A580,60-XX-D396-ZZZZ,T630,60-XX-4997-ZZZZ,60-XX-4306-ZZZZ,PAD 30,60-XX-D416-ZZZZ,6W-XX-YYYY-ZZZZ,60-XX-4996-ZZZZ,60-XX-D421-ZZZZ,60-XX-D402-ZZZZ,60-XX-6956-ZZZZ,60-XX-D404-ZZZZ,G569,60-XX-D415-ZZZZ,60-XX-D418-ZZZZ,60-XX-D429-ZZZZ,65-00-T670-3790,65-1P-CIP35-5600,60-XX-D395-ZZZZ,60-XX-D398-ZZZZ,60-XX-5792-ZZZZ,69-1X-YYYYY-ZZZZZZ,65-00-CIP35-0400,60-XX-D406-ZZZZ,T404,T647,60-12-20264-TW10,PAD60A,T405,T646,60-XX-D400-ZZZZ,T766,T644,T642,60-XX-4511-ZZZZ,60-XX-D384-ZZZZ,60-XX-D428-ZZZZ,60-XX-5791-ZZZZ,65-00-YYYY-ZZZZ,60-XX-D419-ZZZZ,T650,60-XX-D385-ZZZZ,60-XX-D391-ZZZZ,T636,T635,60-XX-D394-ZZZZ,G580,TC50,60-XX-D397-ZZZZ,60-XX-D378-ZZZZ,60-XX-D375-ZZZZ,60-XX-D425-ZZZZ,1641,65-5P-CIP35-10452,60-XX-D422-ZZZZ,60-XX-D372-ZZZZ,60-XX-D403-ZZZZ,60-12-20267-TW10,GEL 37,6W-XX-1015-ZZZZZZ,60-XX-D373-ZZZZ,60-XX-D409-ZZZZ,PC07DM-7,60-XX-4661-ZZZZ,579KT,60-XX-D387-ZZZZ,60-XX-YYYY-ZZZZ,60-XX-D412-ZZZZ,65-00-1641-0000,60-XX-D388-ZZZZ,65-00-T644-0045,65-00-T644-0200,GEL 30,64-XX-YYYY-ZZZZ,60-XX-D374-ZZZZ,60-XX-D390-ZZZZ,60-XX-4659-ZZZZ,60-XX-D408-ZZZZ,T670,65-00-T642-0035,T405-R,60-XX-4374-ZZZZ,T418,60-XX-D424-ZZZZ,60-XX-D410-ZZZZ,GEL 45,T777,1642 65-00-1642-0000,60-XX-D413-ZZZZ,T414,T411,T412,1671,60-12-20266-TW10,60-XX-8531-ZZZZ,60-12-20269-TW10,60-XX-D407-ZZZZ,PAD 60,569PN,60-XX-5527-ZZZZ,65-XX-YYYYY-ZZZZ,60-XX-5442-ZZZZ,60-XX-D426-ZZZZ,569,65-00-CIP35-0200,65-00-CIP35-0045,T660,PAD30PN,HCS10,T725,60-XX-D370-ZZZZ,60-XX-D376-ZZZZ,67-XX-YYYY-ZZZZ,65-00-T642-0250,60-XX-8302-ZZZZ,T444,GEL 8010,T766-06,65-00-T646-0045,A569,65-01-1641-0000,60-XX-D423-ZZZZ,PAD30KT,60-XX-D392-ZZZZ,60-XX-4969-ZZZZ,T609,570,65-00-T646-0200,1678,1674,60-XX-D371-ZZZZ,974,60-XX-D399-ZZZZ,60-XX-D405-ZZZZ,579,60-XX-D401-ZZZZ,976,60-XX-D377-ZZZZ,65-00-CIP35-1200,65-00-T647-0200,65-00-T647-0045,60-XX-D393-ZZZZ,60-XX-D427-ZZZZ,65-00-T650-0160,T558,HCS10G,6W-XX-0909-ZZZZZZ,T710,T557,CIP 35,60-XX-D383-ZZZZ,A579,PAD60,60-XX-D386-ZZZZ,580,60-XX-D389-ZZZZ,A570,60-XX-D430-ZZZZ,GEL 25NS,60-XX-D411-ZZZZ,HCS10A,60-XX-D414-ZZZZ,60-12-20268-TW10,T441,60-XX-D380-ZZZZ,60-12-20265-TW10
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Parker Chomerics(派克固美丽)热界面材料(热传导性凝胶/在位灌封材料/润滑脂)选型指南
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Parker Chomerics 产品概述
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PARKER CHOMERICS提供以下技术参数的导热凝胶选型,导热系数包含0.7~7.5W/m·K,热膨胀系数150~400ppm/K,介电强度180~220Vac/mil,符合ROHS标准,多种颜色可选
产品型号
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品类
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Color
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Binder
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Flow Rate, grams/min - 30cc syringe with no tip at
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Specific Gravity
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Typical Minimum Bondine Thickness, in (mm)
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Thermal Conductivity, W/m-K
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Heat Capacity, J/g-K
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Coefficient of Thermal Expansion, ppm/K
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Operating Temperature Range, ℃
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Dielectric Strength, Vac/mil (kVac/mm)
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Volume Resistivity, ohm-cm
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Dielectric Constant @ 1,000 kHz
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Dissipation Factor @ 1,000 kHz
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Flammability Rating
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RoHS Compliant
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Outgassing,% TML (% CVCM)
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Shelf Life, months from date of manufacture
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Storage Conditions, ℃ @50% Relative Humidity
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T630
|
导热凝胶
|
White
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Silicone
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10 @0.130"orifice
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2
|
0.004 (0.10)
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0.7
|
1.1
|
350
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-55 to 200
|
200 (8)
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10¹⁴
|
5.5
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0.01
|
V-0
|
Yes
|
0.55 (0.14)
|
18
|
10 to 32
|
选型表 - PARKER CHOMERICS 立即选型
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实验室地址: 深圳 提交需求>
提供稳态、瞬态、热传导、对流散热、热辐射、热接触、和液冷等热仿真分析,通过FloTHERM软件帮助工程师在产品设计初期创建虚拟模型,对多种系统设计方案进行评估,识别潜在散热风险。
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