【应用】“热翼”型T-WING®系列散热薄片为独立IC提供散热解决方案,支持与不平整表面接近100%粘接
当前各类电子产品设计之初,很多时候结构工程师时常忽略了小功率IC端的热设计,在实际运行测试中发现IC过热,有时会引起芯片过热保护,停止工作,影响其稳定性和可靠性,其使用寿命也会大打折扣。而且其结构上往往很难改动,遇到此问题时,那如何采取有效的补救措施呢?
PARKER CHOMERICS推出由两片电绝缘薄膜以及夹在中间的 5盎司铜箔组成的散热薄片,能支持与凹形或其他不平整表面接近100%的粘接,以达到最佳的热性能和机械性能。重量轻,体积小,能够方便添加到现有的设计结构复杂的元件中,有很好的兼容性,操作方便。用于为常规散热片不适用且空间结构受限的IC散热,解决前期结构设计不当引起散热问题。
图1 运动板卡
图2 TWing产品
有客户控制板卡项目遇到类似问题,在设计时没有考虑到IC的散热,没有在PCB板间预留安装孔位,产品结构已成型,在最终测试环节中发现芯片工作温度在55以上,工程师们很担心芯片的可靠性及稳定性。
对于此项目散热需求,有推荐固美丽T-WING®系列散热薄片解决方案,测试结果反馈:实测芯片温度45.3C左右,降了10多度,且对邻近的组件无影响。经济有效,解决了客户当前散热需求。
从应用场景,产品性能和成本的角度来看,该散热解决方案在此项目中被证明是理想的。
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【选型】Parker Chomerics(派克固美丽)热管理材料选型指南
产品简介 热传递基础 填缝材料 THERM-A-GAP™569,570,579,580,热垫片 THERM-A-GAP™974,G974,976,高性能热垫片 THERM-A-GAP™T63X系列,可涂布填缝材料 THERM-A-GAP™TP575NS,无硅热垫片 THERM-A-GAP™174,274,574,热垫片 THERMFLOW®相变垫片 HERMATTACH®热粘合带 THERM-A-FORM™可现场固化的灌注和底部填充材料 导热脂和导热胶 绝缘垫片 CHO-THERM®商用热绝缘垫片 CHO-THERM®高能热绝缘垫片 T-WING®和C-WING™薄型散热器 热管理词汇表 安全指南
PARKER CHOMERICS - 填缝材料,导热胶,绝缘垫片,现场固化的灌注和底部填充材料,高性能导热脂,相变垫片,薄型散热器,导热粘合带,相变热界面垫片,聚合物焊接混合材料,热凝胶,导热脂,EMI屏蔽材料,可涂布热填缝材料,热粘合带,热垫片,可涂布热凝胶,无硅热垫片,导热硅橡胶产品,热油脂,热绝缘垫片,热界面材料,高能热绝缘垫片,粘合带,高性能通用导热胶,高性能热垫片,可涂布填缝材料,导热垫片,可现场固化的灌注和底部填充材料,隔离器件,聚合焊料混合物,高性能通用导热脂,散热器,相变材料,TIM,THERM-A-FORM™化合物,可涂布式现场固化复合剂,热管理材料,现场成型化合物,无硅柔软丙烯酸导热垫片,65-00-T6XX-0030,WW-XX-5442-ZZZZ,WW-XX-D426-ZZZZ,T500,69-XX-20684-ZZZZ,WW-XX-D387-ZZZZ,69-12-XXXXX-A274,WW-XX-D390-ZZZZ,WW-XX-4659-ZZZZ,61 - 07 - 0909 - G570,69-XX-20698-ZZZZ,6WWXXYYYYZZZZ,T630,WW-XX-D409-ZZZZ,WW-XX-YYYY-ZZZZ,WW-XX-D6875-ZZZZ,WW-XX-D375-ZZZZ,WW-XX-D410-ZZZZ,69-XX-20686-ZZZZ,WW-XX-D424-ZZZZ,THERM-A-FORM™ T64X,69-11-25177-T630,65-00-T6XX - 0030,65-00-T670-3790,WW-XX-D399-ZZZZ,T63X,T404,T647,60-12-20264-TW10,69-11-24419-T630,T405,T646,T766,T644,T642,WW-XX-D385-ZZZZ,62-20-23116-T274,69-11-27155-575NS,69-12-22745-CW10,69 - 12 - XXXXX - A569,WW-XX-D414-ZZZZ,65-00-YYYY-ZZZZ,T650,T636,T635,WW-XX-D389-ZZZZ,65-00-T6XX - 0010,575-NS,WW-XX-D407-ZZZZ,62-16-23115-A274,WW-XX-8531-ZZZZ,WW-XX-D392-ZZZZ,WW-XX-D373-ZZZZ,69-11-27156-575NS,65-00-1642-0000,60-12-20267-TW10,T64X,69-11-27157-575NS,WW-XX-D379-ZZZZ,62-13-23114-T274,WW-XX-D396-ZZZZ,WW-XX-D382-ZZZZ,WW-XX-D418-ZZZZ,WW-XX-D403-ZZZZ,60-XX-YYYY-ZZZZ,274,WW-XX-4306-ZZZZ,62-04-23111-A274,65-00-1641-0000,65-00-T644-0045,WW-XX-402-ZZZZ,62-16-23115-T274,69-XX-20675-ZZZZ,WW-XX-4353-ZZZZ,WW-XX-D397-ZZZZ,T670,WW-XX-D417-ZZZZ,WW-XX-D378-ZZZZ,T405-R,T418,WW-XX-D419-ZZZZ,T777,T413,T414,WW-XX-D380-ZZZZ,T411,T412,69-12-22849-CW10,60-12-20269-TW10,65-00-T6XX-0180,WW-XX-D421-ZZZZ,WW-XX-4997-ZZZZ,WW-XX-D377-ZZZZ,T660,WW-XX-4305-ZZZZ,69-XX-27083-ZZZZ,69-12-23802-CW10,67-XX-YYYY-ZZZZ,69-11-27159-575NS,T444,65-01-1641-0000,WW-XX-4511-ZZZZ,174,TP575NS,65-00-T646-0200,WW-XX-D428-ZZZZ,WW-XX-5791-ZZZZ,WW-XX-8302-ZZZZ,WW-XX-D371-ZZZZ,WW-XX-D422-ZZZZ,974,976,65-00-T647-0200,WW-XX-6956-ZZZZ,T558,T557,WW-XX-4996-ZZZZ,61-07-0909-G174,62 - 20 - 0909 - A579,69-XX-20685-ZZZZ,60-12-20268-TW10,T441,62 - 20 - 0909 - A574,WW-XX-D381-ZZZZ,WW-XX-D412-ZZZZ,G974,65-00-T6XX - 0300,WW-XX-D411-ZZZZ,WW-XX-D374-ZZZZ,61 - 07 - 0909 - G174,WW-XX-4661-ZZZZ,WW-XX-D391-ZZZZ,PC07DS-7,WW-XX-D425-ZZZZ,WW-XX-D386-ZZZZ,6W-XX-YYYY-ZZZZ,WW-XX-D372-ZZZZ,WW-XX-D430-ZZZZ,65-00-T6XX-0300,WW-XX-D427-ZZZZ,WW-XX-D408-ZZZZ,WW-XX-D413-ZZZZ,69-11-27158-575NS,THERM-A-FORM™ 164X,WW-XX-D388-ZZZZ,69-XX-27072-ZZZZ,WW-XX-D423-ZZZZ,WW-XX-D376-ZZZZ,WW-XX-5792-ZZZZ,69-XX-20687-ZZZZ,WW-XX-D429-ZZZZ,WW-XX-D398-ZZZZ,T630G,6-6W-XX-YYYY-ZZZZ,69-XX-27070-ZZZZ,62-07-23112-A274,WW-XX-5527-ZZZZ,69-XX-27082-ZZZZ,62-10-23113-A274,WW-XX-D395-ZZZZ,1642,1641,WW-XX-4969-ZZZZ,65-00-T650-0003,WW-XX-4374-ZZZZ,WW-XX-D370-ZZZZ,WW-XX-D401-ZZZZ,62-20-23116-A274,WW-XX-D404-ZZZZ,WW-XX-D420-ZZZZ,C-WING,62-13-23114-A274,62-04-23111-T274,69-11-27154-575NS,65-00-T6XX - 0180,62-10-23113-T274,65-00-T644-0200,65-00-T642-0035,WW-XX-D383-ZZZZ,WW-XX-D405-ZZZZ,1671,60-12-20266-TW10,69 - 12 - XXXXX - A274,WW-XX-D416-ZZZZ,62-07-23112-T274,569,WW-XX-D065-ZZZZ,164X,T725,69-XX-YYYY-ZZZZ,65-00-T6XX-0010,65-00-T642-0250,65-00-T646-0045,WW-XX-D393-ZZZZ,THERM-A-GAP™ T63X,T609,570,WW-XX-D400-ZZZZ,69-XX-21259-ZZZZ,1678,574,1674,579,WW-XX-D406-ZZZZ,69-XX-20672-ZZZZ,65-00-T647-0045,WW-XX-D394-ZZZZ,69-XX-20991-ZZZZ,T710,580,WW-XX-D384-ZZZZ,WW-XX-D415-ZZZZ,60-12-20265-TW10,T-WING,航空,光学电子设备,封装与屏蔽技术领域,液体和气体处理行业,能量转换设备,汽车电子设备,马达和发动机控制器,电源和不间断电源,笔记本电脑和其他高密度、易手持的电子设备,图形处理器,发动机和变速器控制模块,过程控制领域,功耗低于25W的部件,气候控制领域,过滤技术领域,国防工业,含有带通用散热片的MOSFET阵列,消费电子产品,电信基础架构部件,移动电话,PCB,PC处理器,芯片组,服务器,气动技术领域,台式机,存储器模块,马达,发动机控制器,马达控制处理器,功率半导体,硬盘驱动器,电信设备,服务器CPU,电视机和消费电子产品,热管装配件,电视机,微处理器,电源模块,变速器控制模块,发动机,航空工业,移动设备,高速磁盘驱动器,台式机、便携式电脑和服务器,电源和UPS,台式机、便携式电脑,电压调节器,振动阻尼设备,水利行业,存储器,内存模块,机电行业
Parker Chomerics 产品概述
Parker Chomerics 提供一系列热界面材料、EMI 屏蔽材料和导电解决方案,包括导热凝胶、导热垫片、导热粘合带、导热油脂、EMI 屏蔽材料、导电密封剂、导电粘合剂、助粘底漆、微波吸收材料等,满足电子设备在导热、散热和电磁屏蔽方面的需求。产品广泛应用于航空、电信、生命科学、国防、商业和消费电子等领域。
PARKER CHOMERICS - 微波吸收材料,导电弹性体垫片,工业显示器定制屏幕保护器,EMI 屏蔽线缆包,导热粘合带,EMI 屏蔽材料,导电漆,导电现场成型材料垫片,显示器塑料窗,FINGERSTOCK 垫片,金属箔带,标准集成触摸屏 LCD 显示器,定向金属丝垫片,助粘底漆,导热散热片,EMI 屏蔽工程层压制件,导热电绝缘垫片,EMI 衰减电缆铁夹,金属丝网垫片,导热油脂,METALASTIC 垫片,导电遇热收缩软管,导电粘合剂,热界面材料,导热凝胶,导电密封剂,导热相变材料,EMI 屏蔽触摸屏,导热填隙垫片,显示器玻璃窗,织物泡沫衬垫,注塑成型塑料,导电油脂,导电小塑料球,导电热界面材料,导热现场固化型灌注和底部填充材料,EMI 屏蔽空气通风板,EMI 屏蔽膜,CHO-TOUCH™,CHO-STRAP®,CHO-SEAL®,STREAMSHIELD OMNI-CELL® SHIELD-CELL,T-WING®,CHO-MUTE®,CHO-MASK®,SPRING-LINE®,DURALAN™,CHO-BOND®,CHO-FAB®,THERM-A-GAP™,WIN-SHIELD®,CHO-SORB®,THERM-A-FORM™,CHO-THERM®,THERMFLOW®,CHO-SHRINK®,THERMATTACH®,METALASTIC®,PREMIER™,CHO-FOIL®,CHO-LUBE,SOFT-SHIELD®,CHO-FORM®,POLA®,TECKFILM™,CHO-SHIELD®,航空,医用电子产品,电信,环保密封,消费电子,有线电视,电视接收器,数字标牌,LCD 系统,耐候密封件,电子产品,国防,商业,电子屏蔽,打印机,PBX,连接器,腐蚀防护,无线电接收器,散热器,数据通信设备,弹性密封件,键盘,生命科学,电子产品冷却应用,计算机,CATV,电缆
热界面材料
Parker Chomerics提供一系列热管理、电磁屏蔽和显示解决方案。产品包括热界面材料、热传导胶、热传导胶垫、热传导粘合剂、热传导膏、热传导散热器、电磁屏蔽材料、导电密封剂、导电胶粘剂、粘合促进剂、导电润滑剂、屏蔽电缆套、微波吸收材料、EMI衰减铁氧体电缆夹、EMI屏蔽薄膜、触控屏、标准集成触摸屏LCD显示器和测试服务。这些产品广泛应用于航空航天、电信、生命科学、国防、商业和消费电子等领域。
PARKER CHOMERICS - MICROWAVE ABSORBER MATERIALS,EMI SHIELDING CABLE WRAP,THERMALLY CONDUCTIVE HEAT SPREADERS,EMI铁氧体,金属箔胶带,ELECTRICALLY GAP FILLERS,箔带,导热油脂,EMI GASKETS,导热现场固化灌封和底部填充材料,定制屏幕保护器,导电热塑性塑料,导电粘合剂,STANDARD INTEGRATED TOUCH- SCREEN LCD DISPLAYS,热界面材料,导电塑料小球,THERMALLY CONDUCTIVE GREASES,ELECTRICALLY CONDUCTIVE THERMOPLASTICS,手指簧片,METAL FOIL TAPES,SHIELDED AIR VENTILATION PANELS,CUSTOM SCREEN PROTECTORS,导热垫,导热电绝缘垫,ELECTRICALLY CONDUCTIVE PAINT,EMI SHIELDING ELASTOMER GASKETS,THERMAL INTERFACE MATERIALS,导电涂料,THERMALLY CONDUCTIVE GAP FILLER PADS,高品质扁平电缆护套,ELECTRICALLY CONDUCTIVE SEALANTS,ELECTRICALLY CONDUCTIVE ELAS- TOMER GASKETS,EMI屏蔽工程层压板,导热间隙填充垫,PLASTIC WINDOWS,塑料窗户,EMI SHIELDING FILM,METAL-BASED GASKET,EMI屏蔽触摸屏,LECTRICALLY CONDUCTIVE PAINTS,自动分配的现场成型(FIP)EMI屏蔽垫圈,导热凝胶,METALASTIC GASKETS,HIGH QUALITY FLAT CABLE JACKETS,THERMALLY CONDUCTIVE PHASE CHANGE MATERIALS,导电油脂,THERMALLY CONDUCTIVE AT- TACHMENT TAPES,TIM,THERMALLY CONDUCTIVE GELS,ELECTRICALLY CONDUCTIVE ADHESIVES,FABRIC OVER FOAM GASKETS,ELECTRICALLY CONDUCTIVE HEAT SHRINKABLE TUBING,导电弹性体垫圈,FOIL TAPES,金属基垫片,ELASTOMER BASED ABSORBER MATERIALS,热润滑脂,STANDARD INTEGRATED OUCHSCREEN LCDS,HIGHLY CONDUCTIVE OPTICAL QUALITY POLYESTER FILM,高性能玻璃,THIN HEAT SPREADERS,ELECTRICALLY CONDUCTIVE FORM-IN-PLACE MATERIAL GASKETS,THERMALLY CONDUCTIVE SILICONE ELASTOMER,FINGERSTOCK GASKETS,薄散热片,EMI SHIELDING ENGINEERED LAMINATES,EMI屏蔽涂料,导电密封剂,导热相变材料,电磁干扰屏蔽材料,玻璃窗,导热散热器,注塑成型塑料,THERMALLY CONDUCTIVE CURE-IN-PLACE POTTING AND UNDERFILL MATERIALS,THERMALLY CONDUCTIVE PAD,WIRE MESH GASKETS,ORIENTED WIRE GASKETS,电气填隙材料,COMPOSITE EMI SHIELDING AND WEATHER SEALING MATERIALS,微波吸收材料,THERMAL GREASES,ROBOTICALLY DISPENSED FORM-IN-PLACE (FIP) EMI SHIELDING GASKETS,HIGH-PERFORMANCE GLASS,标准集成触摸屏LCD显示器,EMI SHIELDING MATERIALS,金属弹性垫圈,EMI屏蔽膜,导热附着带,导电现场成型材料垫片,EMI FERRITES,PHASE-CHANGE THERMAL INTERFACE MATERIALS,EMI SHIELDING TOUCHSCREENS,导热有机硅弹性体,THERMALLY CONDUCTIVE ELECTRICAL INSULATOR PADS,导电热缩管,屏蔽空气通风板,EMI SHIELDED AIR VENTILATION PANELS,TIMS,泡沫垫圈上的织物,EMI SHIELDING PAINTS,定向钢丝垫圈,金属丝网垫圈,ELECTRICALLY CONDUCTIVE PLASTIC PELLETS,高导电光学质量聚酯膜,复合EMI屏蔽与耐候密封材料,EMI垫圈,GLASS WINDOWS,EMI屏蔽弹性体衬垫,ADHESION PROMOTING PRIMERS,粘合促进背涂胶,ELECTRICALLY CONDUCTIVE GREASE,INJECTED MOLDED PLASTIC,EMI屏蔽空气通风板,MI ATTENUATING FERRITE CABLE CHOAKS,EMI屏蔽电缆绕包,HEATERS,COMMERCIAL GRADE THERMAL INSULATOR PADS,标准集成屏幕液晶显示器,中波衰减铁氧体电缆阻塞,相变热界面材料,商业级绝热垫,弹性体基吸收材料,加热器,9025,WIN-SHIELD G,CHO-TOUCH™,CHO-STRAP®,9005,CHO-SEAL®,HO-MUTE 9025,T-WING®,CHO-MUTE®,CHO-MASK®,THERM-A-GAP™ GELS,SPRING-LINE®,DURALAN™,CHO-BOND®,THERM-A-GAP™,WIN-SHIELD®,CHO-SORB®,STREAMSHIELD OMNI-CELL® SHIELD-CELL,DURALAN G XL,THERM-A-FORM™,MESH STRIP,CHO-THERM®,THERMFLOW®,CHO-SHRINK®,DURALAN G,THERMATTACH®,CHO-FAB,METALASTIC®,PREMIER™,CHO-FOIL®,SHIELD WRAP,SOFT-SHIELD®,CHO-LUBE,CHO-FORM®,POLA®,TECKFILM™,CHO-MUTE 9005,CHO-SHIELD®,工业显示器,DATA COMMUNICATIONS EQUIPMENT,COMMON HEAT SINK,有线电视,ELECTRONIC EQUIPMENT,DISPLAYS,液晶触摸屏,医学电子学,RADIO,RECEIVERS,接收器,TOUCHSCREEN MOBILE DEVICES,CATVS,COMPUTERS,电视机,INDUSTRIAL DISPLAYS,PRINTERS,显示器,KEYBOARDS,普通散热器,TELEVISION,打印机,PBXS,GROUNDING CONSIST,电子设备,触摸屏移动设备,接地包括,MEDICAL ELECTRONICS,数据通信设备,工业应用,键盘,INDUSTRIAL APPLICATIONS,RADIO,LCD TOUCHSCREENS,PBX系统,计算机
Parker Chomerics热界面材料产品保质期数据
本资料详细介绍了Parker Chomerics公司热界面材料的保质期数据。内容包括不同产品的原始保质期(以月为单位)和可用的保质期延长选项。资料还提供了如何重新认证热产品的流程,包括测试费用、材料提交要求、典型交货时间和认证结果的处理。
PARKER CHOMERICS - 导热电绝缘垫,现场导热固化,THERMAL GREASE,THERMALLY CONDUCTIVE GAP FILLER PADS,THERMAL HEAT SPREADER,导热凝胶,导热相变材料,灌封材料,THERMALLY CONDUCTIVE ATTACHMENT TAPES,热散热器,散热膏,THERMALLY CONDUCTIVE ELECTRICAL INSULATOR PADS,导热间隙填充垫,导热连接带,THERMALLY CONDUCTIVE GELS,THERMALLY CONDUCTIVE PHASE CHANGE MATE-RIALS,THERMALLY CONDUCTIVE CURE IN PLACE,POTTING MATERIALS,CHO-THERM 1674 W/PSA,THERM-A-GAP HCS10A,THERMATTACH T405,THERMAL GREASE T650,THERM-A-GAP 8010,THERM-A-GAP HCS10G,THERMATTACH T404,CHO-THERM T609 W/PSA,THERM-A-GAP A580,THERM-A-GAP G570,THERM-A-GAP GEL 45,THERM-A-GAP G174,CHO-THERM 1680 W/PSA,THERM-A-GAP G569,THERMFLOW T725,CHO-THERM T500,CHO-THERM T500 W/PSA,CHO-THERM 1678 W/PSA,THERMFLOW T766,T-WING,THERMATTACH T418,THERM-A-GAP A579,THERMATTACH T412,THERM-A-GAP A574,THERM-A-GAP T174,THERMATTACH T414,THERM-A-GAP A174,THERM-A-GAP A570,CHO-THERM 1646,THERM-A-FORM CIP 35,CHO-THERM 1677 W/PSA,CHO-THERM 1671 W/PSA,CHO-THERM T441 W/PSA,THERMATTACH T410,THERMATTACH T411,THERMFLOW T777,THERM-A-GAP A569,THERMAL GREASE T670,CHO-THERM 1671,CHO-THERM 1674,CHO-THERM 1677,THERM-A-GAP G274,CHO-THERM 1678,CHO-THERM T444,CHO-THERM T441,THERM-A-GAP TC50,THERM-A-GAP 976,THERMFLOW PC07DM-7,CHO-THERM T609,THERMAL GREASE T660,THERM-A-GAP T630,THERM-A-FORM T644,THERM-A-GAP GEL 30,THERM-A-FORM T646,THERM-A-GAP 974,THERM-A-FORM T647,THERM-A-GAP T274,THERM-A-GAP A274,THERM-A-GAP T636,THERM-A-GAP G580,THERM-A-GAP T635,THERM-A-FORM 1641,THERM-A-FORM 1642,THERM-A-GAP G574,THERM-A-GAP G579,THERM-A-GAP G974,THERMFLOW T557,THERMFLOW T710,THERMFLOW T558,THERM-A-FORM T642
PARKER CHOMERICS保质期信息
这份资料提供了Parker Chomerics公司热产品系列和层压解决方案产品的货架寿命信息。资料详细列出了不同材料的产品名称、货架寿命月份以及是否可以延长货架寿命。此外,还包括了如何进行产品再认证的流程和费用信息。
PARKER CHOMERICS - GEL30,PC07DM-7,1680 W/PSA,4800-10,G570,SOFT-SHIELD 3700,G174,4800-11,T500,SOFT-SHIELD 3500,G574,T-WING®,1679 W/PSA,82-X2X,G974,T441 W/PSA,G579,A580,1674 W/PSA,T630,CIP-35,T670,T274,T500 W/PSA,T418,GEL8010,T777,T414,GEL45,T411,T412,1671,82-X1X,CHO-FAB,1671 W/PSA,SOFT-SHIELD 4000,A274,G569,T660,T725,TS15 W/PSA,T404,T647,T405,T646,T766,T644,T444,T642,A569,G274,82-X4X,T609,1679,1678,1677,T609 W/PSA,1674,974,1678 W/PSA,976,T652,4850-10,T410,CHOMASK II,4850-11,T650,4850-12,T174,T558,T636,T635,HCS10G,T557,G580,CHO-FAB™,A579,CHO-FOIL®,TC50,82-X3X,A574,1646,A174,A570,1642,1641,T710 W/PSA,HCS10A,T441,1677 W/PSA
T-WING® and C-WING™Heat Spreaders Thin Heat Spreaders
本文介绍了T-WING®和C-WING™两种热扩散器。T-WING是一种薄型热扩散器,采用铜箔与电绝缘膜之间的粘合剂,适用于非平面表面,优化了散热性能;C-WING则是陶瓷版本,用于电磁干扰敏感的应用。两者都提供了一种低成本、有效的冷却IC器件的方法。
PARKER CHOMERICS - 60-12-20267-TW10,69-12-23802-CW10,69-12-22745-CW10,60-12-20264-TW10,C-WINGS,60-12-20266-TW10,60-12-20268-TW10,69-12-22849-CW10,60-12-20265-TW10,60-12-20269-TW10,T-WINGS
【产品】24V/450mA的单相正弦波直流无刷马达驱动IC CC6422
芯进电子的单相正弦波直流无刷马达驱动IC:CC6422为PWM调速的单线圈直流无刷散热风扇提供了单芯片的解决方案。该产品采用先进的高压BiCMOS工艺设计制造。内部集成了稳压模块,霍尔薄片,斩波失调消除模块,霍尔信号线性放大调制模块,功率全桥输出级,以及数字逻辑控制模块。
Parker Chomerics热界面材料
本资料详细介绍了Parker Chomerics公司热界面材料的保质期数据。包括不同产品的原始保质期和可用的保质期延长选项。资料还提供了如何重新认证热产品的流程和费用信息。
PARKER CHOMERICS - THERMAL INTERFACE MATERIALS,热界面材料,THERM-A-GAP HCS10A,THERMATTACH T405,THERMAL GREASE T650,THERM-A-GAP 8010,THERM-A-GAP HCS10G,THERMATTACH T404,THERM-A-GAP A580,THERM-A-GAP G174,THERM-A-GAP G570,THERM-A-GAP GEL 45,THERM-A-GAP G569,THERMFLOW T725,CHO-THERM T500,THERMFLOW T766,T-WING,THERMATTACH T418,THERM-A-GAP A579,THERMATTACH T412,THERM-A-GAP PAD 30,CHO-THERM 1680,THERM-A-GAP T174,THERM-A-GAP A574,THERMATTACH T414,THERM-A-GAP A174,THERM-A-GAP A570,CHO-THERM 1646,THERM-A-FORM CIP 35,THERMATTACH T410,THERMATTACH T411,THERMFLOW T777,THERM-A-GAP A569,THERMAL GREASE T670,CHO-THERM 1671,CHO-THERM 1674,CHO-THERM 1677,THERM-A-GAP G274,CHO-THERM 1678,CHO-THERM T444,CHO-THERM T441,THERM-A-GAP TC50,THERM-A-GAP 976,THERMFLOW PC07DM-7,CHO-THERM T609,THERMAL GREASE T660,THERM-A-GAP T630,THERM-A-FORM T644,THERM-A-GAP GEL 30,THERM-A-FORM T646,THERM-A-GAP 974,THERM-A-FORM T647,THERM-A-GAP T274,THERM-A-GAP A274,THERM-A-GAP T636,THERM-A-GAP G580,THERM-A-GAP T635,THERM-A-FORM 1641,THERM-A-FORM 1642,THERM-A-GAP G574,THERM-A-GAP G579,THERM-A-GAP G974,THERM-A-GAP PAD 60,THERMFLOW T557,THERMFLOW T710,THERMFLOW T558,THERM-A-FORM T642
OCDT2.E140244-其他绝缘、陶瓷、金属和导电材料-成分UL产品IQ
本资料详细介绍了多种绝缘、陶瓷、金属和导电材料,包括不同类型的绝缘材料、导电尼龙布、导电硅、铜填充硅橡胶垫圈、电导性硅橡胶密封材料等。资料中列出了各种材料的厚度、颜色、最小值、整体值、金属类型、编号、火焰等级、热老化指数、热冲击指数、恢复温度指数、全球点火温度、全球火焰指数和 Comparative Tracking Index(CTI)等参数。此外,还提供了材料的UL认证信息,包括认证编号和认证状态。
PARKER CHOMERICS - POLYETHYLENE TEREPHTHALATE-CLAD ALUMINUM LAMINATE,以片材形式提供的导电硅胶,硅基导热间隙垫,硅(SI)填隙材料,导热填隙材料,EMI屏蔽垫片,硅基导热胶,金属材料,SILICONE (SI) GAP FILLER,硅酮耐热腻子,聚对苯二甲酸乙二醇酯覆铜箔层压板,MULTIPLANAR URETHANE BASED FOAM GASKET,SILICONE (SI) BASED THERMALLY CONDUCTIVE ADHESIVE,THERMALLY CONDUCTIVE DOUBLE SIDED TAPE,硅基导热密封胶,SILICONE (SI) BASED THERMALLY CONDUCTIVE GAP PAD,有机硅热界面材料,硅酮热填隙材料,INSULATED GROUND STRAP,SILICONE GAP FILLER,THERMALLY CONDUCTIVE PHASE-CHANGE INTERFACE MATERIAL,氧化铝填充聚酰亚胺片材绝缘,FULLY CURED DISPENSABLE GEL,导热相变界面材料,CONDUCTIVE NYLON FABRIC,EMI SHIELDING GASKET,绝缘接地带,ELECTRICALLY CONDUCTIVE URETHANE-FOAM GASKET,CONDUCTIVE SILICONE FURNISHED AS SHEETS,硅(SI)热凝胶,THERMALLY CONDUCTIVE GAP FILLER,导热聚酰亚胺胶带,ALUMINA FILLED POLYIMIDE SHEET INSULATION,SILICONE THERMAL GAP FILLER,SILICONE MATERIAL,SILICONE (SI) PSA TAPE,CONDUCTING MATERIALS,THERMALLY CONDUCTIVE LAMINATES,硅胶填缝剂,CURED SILICON MATERIAL,POLYETHYLENE TEREPHTHALATE-CLAD COPPER LAMINATE,硅酮(SI)压敏胶带,电磁屏蔽层压板,POLYMER SOLDER HYBRID PHASE CHANGE MATERIAL,THERMALLY CONDUCTIVE GAP FILLER, CURED SILICON MATERIAL,SILICONE ELASTOMER (SI),硅橡胶(SIR),完全固化的可点胶的凝胶,填铜硅胶垫圈,聚氨酯泡沫,COPPER-FILLED SILICONE GASKETS,组成部分,导电聚氨酯泡沫衬垫,硅橡胶板,导热双面胶带,硅树脂材料,固化硅材料,SILICONE, SILVER PARTICLE FILLED MATERIAL,导热填隙固化硅材料,ELECTROMAGNETIC SHIELDING LAMINATES,SILICONE (SI) THERMAL GEL,THERMALLY CONDUCTIVE DOUBLE SIDED ACRYLIC TAPE,导电材料,SILICONE RUBBER (SIR),导电尼龙织物,COMPONENT,硅热凝胶,导热双面丙烯酸胶带,SILICONE (SI) BASED THERMALLY CONDUCTIVE SEALANT,SILICONE THERMAL INTERFACE MATERIAL,PHASE CHANGE MATERIAL,硅树脂、银颗粒填充材料,陶瓷材料,聚合物焊料混合相变材料,聚对苯二甲酸乙二醇酯包铝层压板,多平面聚氨酯基泡沫垫片,SILICONE RUBBER SHEETS,METALLIC MATERIALS,SILICONE THERMAL PUTTY,导热层压板,绝缘材料,CERAMIC MATERIALS,有机硅弹性体(SI),INSULATING MATERIALS,相变材料,THERMALLY CONDUCTIVE POLYIMIDE TAPE,SILICONE THERMAL GEL,POLYURETHANE FOAM,MCS12,5541,G570,4850,T500,SS3500,HCS35,G974,G579,A580,T474,77-1A,T-WING,XTS-900,HCS40,S6305E,5550,4220,A474,G569,SS4850,400,T647G,1122V,6372,5560,T647,T404,T646,T405,1000,HC-FIP-C,CHO-VER,6371,6370,CIP110,GEL 45,T491,CIP35,SS7000-1,T636,4000,SS3500M,4002,G580,GEL 30,4003,THERM-A-GAPTM PAD 30,TC50,CJ-021,T-725,CJ-022,SS5000,1750-2250,5568,3700,GEL 37,579KT,6310,T705,CIP210,77-0,SS3500-1F,4800,4008,77-1,4009,FIP-C,6309,30V0,T405-R,T418,L-1971,SS3500-1E,T777,SS3500-1D,T414,SS3500-1C,T654,T411,THERM-A-GAPTM GEL75,SS3500-1B,1671,1273,T-630,A274,SS4010,1661,GEL 8010,GREEN-1B,T386,GEL AB,6571,6570,HCS10,5000,THERM-A-GAPTM PAD 60,CRS,MCS30,A569,S6304M,G515RFA,T609,T410-R,4800-2,4800-1,5519,1556,SS3700A,574,1674,1673,1310,976,5513,T174,5515,TPI-130,F174,A579,T-379,CL-336,F574,A574,1688,A174,A570,3500,1684,T441,S6305
【产品】能够兼容各种非平面的IC芯片散热薄片T-WING®,降温可达10~20°C
Parker Chomerics推出T-WING®系列散热薄片,为空间受限的IC芯片提供了经济有效的冷却手段,而常规的散热器却不适用。T-WING散热片由两片电绝缘薄膜以及夹在中间的 5盎司(0.007英寸/0.18毫米厚)铜箔组成。 高强度的硅胶PSA(压敏型粘合剂)提供与元件强力的粘合。 这些“热翼”型散热片的兼容属性支持与非平面的封装表面接近100%的粘接,以达到最佳的散热和机械性能。
【选型】微型散热器T-WING用于快充接头散热设计,满足产品防火要求,厚度仅为0.178mm
快充接头其体积小,工作电流大,热量堆积产生的高温会影响芯片的可靠性,因此散热问题是产品设计的难点。推荐Parker Chomerics的微型散热器T-WING,整体厚度13mil(0.33mm),由电绝缘薄膜、PSA、铜箔组成。
【产品】低压缩力、低挠曲力的可点胶导热填隙凝胶THERM-A-GAP™,高适形、预固化
Parker Chomerics推出的THERM-A-GAP™系列的导热填隙凝胶是一种高适形、预固化、单组分的化合物。该交联结构的凝胶具有卓越的长期热稳定性和可靠的性能。 这种独特的材料在脆弱的组件上甚至比最软的填隙薄片都具有低得多的机械应力。 它们是多组件和共用散热器中可变间隙的理想填隙材料。
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使用FloTHERM和Smart CFD软件,提供前期热仿真模拟、结构设计调整建议、中期样品测试和后期生产供应的一站式服务,热仿真技术团队专业指导。
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