【应用】“热翼”型T-WING®系列散热薄片为独立IC提供散热解决方案，支持与不平整表面接近100%粘接

时间： 2019-12-02 来源：世强

代理服务

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散热方案设计

当前各类电子产品设计之初，很多时候结构工程师时常忽略了小功率IC端的热设计，在实际运行测试中发现IC过热，有时会引起芯片过热保护，停止工作，影响其稳定性和可靠性，其使用寿命也会大打折扣。而且其结构上往往很难改动，遇到此问题时，那如何采取有效的补救措施呢？

PARKER CHOMERICS推出由两片电绝缘薄膜以及夹在中间的 5盎司铜箔组成的散热薄片，能支持与凹形或其他不平整表面接近100%的粘接，以达到最佳的热性能和机械性能。重量轻，体积小，能够方便添加到现有的设计结构复杂的元件中，有很好的兼容性，操作方便。用于为常规散热片不适用且空间结构受限的IC散热，解决前期结构设计不当引起散热问题。

图1 运动板卡

图2 TWing产品

有客户控制板卡项目遇到类似问题，在设计时没有考虑到IC的散热，没有在PCB板间预留安装孔位，产品结构已成型，在最终测试环节中发现芯片工作温度在55以上，工程师们很担心芯片的可靠性及稳定性。

对于此项目散热需求，有推荐固美丽T-WING®系列散热薄片解决方案，测试结果反馈：实测芯片温度45.3C左右，降了10多度，且对邻近的组件无影响。经济有效，解决了客户当前散热需求。

从应用场景，产品性能和成本的角度来看，该散热解决方案在此项目中被证明是理想的。

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