TDK’s New SmartMotion® Platform Accelerates Development of IOT Solutions Based on Invensense Motion Sensors

2023-07-10 TDK InvenSense News

TDK Corporation announces the worldwide availability of the SmartMotion® Platform encompassing 4 unique Development kits. The SmartMotion development kits enable rapid evaluation and development of InvenSense MEMS sensor-based solutions. Built on a single-board design, the platform enables fast system prototyping and parallel software development, resulting in faster deployment of end products to market. The SmartMotion platform is designed around Microchip’s G55MCU with built-in 512KB of Flash Memory and incorporates InvenSense’s market-leading 6-axis, 7-axis, or 9-axis motion sensor solutions.


Developers can evaluate and incorporate sensor functions like orientation, activity tracking, and gestures to develop state-of-the-art applications. The SmartMotion Platform integrates an on-board Embedded Debugger so external tools are not required to program or debug the G55 MCU, saving customers the cost of an external JTAG debugger.


SmartMotion Development kits


DK-20602 – Development platform for InvenSense ICM-20602, a high-performance 6-axis motion sensor that combines a 3-axis gyroscope and a 3-axis accelerometer.

DK-20648 – Development platform for InvenSense ICM-20648, a high-performance 6-axis motion sensor that combines a 3-axis gyroscope, 3-axis accelerometer, and Digital Motion ProcessorTM (DMPTM).

DK-20789 – Development platform for InvenSense ICM-20789, a high-performance 7-axis motion sensor combining a 3-axis gyroscope, 3-axis accelerometer, and a high-accuracy pressure sensor.

DK-20948 – Development platform for InvenSense ICM-20948, a high-performance 9-axis motion sensor that combines a 3-axis gyroscope, 3-axis accelerometer, 3-axis compass, and a Digital Motion ProcessorTM (DMPTM).


Each development kit includes InvenSense MotionLink, a GUI-based development tool, and embedded Motion Drivers (eMD) for InvenSense sensors. The MotionLink can be used to capture and visualize sensor data from the motion sensor. Sensor Fusion is supported in the eMD, consisting of a set of APIs to configure various aspects of the platform including sensor parameters such as full-scale range (FSR), output data rate (ODR), low-power or low-noise mode, and sensor interface to host (I²C and SPI).


Glossary

MEMS – Micro Electrical Mechanical Systems

Digital Motion Processor – DMP offloads computation of motion processing algorithms from the host processor, improving system performance

Sensor Fusion – Sensor Fusion is the aggregation of data from multiple sensors (Gyroscope, Accelerometer, Compass etc.) to obtain better information and accuracy, than using sensors individually.


 Key applications


DK-20602:

IoT

Smartphones, Tablets, Smart Watches

Wearables, Activity monitors

Cleaner Robots

Sports Equipment

Drones, Toys


DK-20648:

IoT

Smart Watches

Robots

Wearables, Health Monitoring band


DK-20789

IoT

Drones

Flying Toys

Wearables, Activity Monitors


DK-20948

IoT

Navigation

Industrial application

Wearables, Smartphones, Activity Monitors, Smart Watches

Drones, Toys

Sports Applications


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型号- IIM-42653,DK-42670-P,IIM-42652,IIM-42352,IIM-42351,DK-20100,DK-42351,ICM-40627,DK-42352,DK-42652,DK-42653,ICP-20100,ICM-42686-P,ICM-42688-P,ICM-42688-V,DK-42370-P,IIM-20670,DK-20670,ICM-42370-P,DK-42688-V,DK-42688-P,ICM-42670-P,DK-40627,AT32UC3A4256HHB-C1UR,DK-42686-P

02/16/2024  - TDK INVENSENSE  - 用户指南  - Revision: 1.2 代理服务 技术支持 批量订货

ICM-45605;ICM-40609-D;ICM-42670-P SmartMotion®

描述- 该资料主要介绍了多款高性能MEMS传感器及其应用。产品包括用于可穿戴设备、移动设备、AR/VR、无人机等领域的6轴MEMS IMU,具有低功耗、高精度、平衡陀螺仪技术等特点。此外,还介绍了产品的详细规格,如尺寸、输出数据率、工作电压等。

型号- ICM-45605,ICM-42688-P,ICM-40609-D,ICM-42670-P

2023/1/14  - TDK INVENSENSE  - 商品及供应商介绍 代理服务 技术支持 批量订货
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品牌:TDK InvenSense

品类:7-Axis device

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品类:9-axis MotionTracking device

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品类:6-axis MotionTracking device

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品类:3-axis accelerometer

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品牌:TDK InvenSense

品类:digital MEMS microphone

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品类:6-axis MotionTracking device

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MCU烧录/Flash烧录/CPLD烧录

可烧录IC封装SOP/MSOP/SSOP/TSOP/TSSOP/PLCC/QFP/QFN/MLP/MLF/BGA/CSP/SOT/DFN;IC包装Tray/Tube/Tape;IC厂商不限,交期1-3天。支持IC测试(FT/SLT),管装、托盘装、卷带装包装转换,IC打印标记加工。

最小起订量: 1pcs 提交需求>

2G/3G/4G射频测试

支持GSM / GPRS 等多种制式产品的射频测试,覆盖所有上行和下行的各项射频指标,包括频差、相差、调制、功率、功控、包络、邻道泄漏比、频谱、杂散、灵敏度、同道干扰、邻道干扰、互调、阻塞等等。满足CE / FCC / IC / TELEC等主流认证的射频测试需求。

实验室地址: 深圳 提交需求>

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