New Die Package Extends 3D TLC e.MMC Endurance to MLC/SLC Levels of ATP E750Pi/Pc, E650Si/Sc Series e.MMC

时间： 2022-02-17 来源：ATP ELECTRONICS

技术问答

Taipei, Taiwan (February) – ATP Electronics, the global leader in specialized storage and memory solutions, has introduced its latest line of e.MMC devices built on 3D triple level cell (TLC) NAND. Using a new die package, the E750Pi/Pc and E650Si/Sc Series offer long-life performance, optimized power consumption and customizable configuration options.

ATP ELECTRONICS's new E750Pi/Pc Series e.MMC offerings are built with 3D TLC NAND flash but are configured as pseudo SLC (pSLC) to offer endurance on par with SLC NAND, while E650Si/Sc Series in native TLC has near-MLC endurance.

The E750Pi and E650Si Series are industrial temperature-operable (-40°C to 85°C), making them ideal for deployment in scenarios with extreme thermal challenges and harsh environments, while E750Pc and E650Sc support -25°C to 85°C operating temperatures for applications with non-critical thermal requirements.

“Industrial and embedded applications are becoming more varied, requiring storage devices to be more flexible with a wide array of specifications and options. The ATP e.MMC’s small footprint makes it a suitable, cost-effective solution for space-constrained environments. As a soldered-down solution, it is shock/vibration proof, so it has become a preferred storage medium for extremely rugged operations.” said Chris Lien, Head of the Embedded Business Unit at ATP. “As customers become more discerning in choosing data storage solutions to meet specific needs, ATP’s customization capabilities allow us to tailor-fit configurations to deliver better power efficiency, space-saving packages, and ball variations.”

Huge Features in a Tiny Footprint. Consuming low power during Sleep Mode, the E750Pi/Pc and E650Si/Sc Series e.MMC deliver huge power savings. The new e.MMC offerings comply with JEDEC e.MMC v5.1 standard (JESD84-B51), supporting high-speed 400 (HS400) DDR mode for a bandwidth of up to 400 MB/s.

The E650Si/Sc Series in native TLC offer capacities from 32 to 64 GB for use in mass storage applications, while the E750Pi/Pc in pSLC mode are available in capacities from 10 GB to 21 GB, which cuts down the TLC capacity but improves performance, reliability, and endurance.

Data Integrity Features

The ATP E750Pi/Pc and E650Si/Sc Series e.MMC feature the following technologies to ensure high levels of data integrity:

●AutoRefresh Technology improves the data integrity of read-only areas by monitoring the error bit level and read counts in every read operation.

●Dynamic Data Refresh Technology reduces the risks of read disturb and sustains data integrity in seldom-accessed areas.

●SRAM Soft Error Detector and Recovery mechanism maximizes data integrity by monitoring soft errors, which cannot be detected nor solved by ECC engines and can therefore significantly jeopardize data accuracy.

●Low-Density Parity-Check Error Correcting Code (LDPC ECC) provides powerful error correction to significantly improve data transfer reliability.

Customizable Configurations

Apart from the standard e.MMC size of 11.5 x 13 mm, customers may request a customized package size, such as the 9 x 10 mm option, for up to 40% space savings. ATP also offers value-added services to further optimize and tune power consumption. The E750Pi/Pc and E650Si/Sc Series e.MMC come in the standard 153-ball grid array (BGA) but depending on project, other ball variations such as the 100-ball option, may be requested. Other customizable configurations include firmware, testing, laser markings, and other specific features to meet their investment and application requirements.

Specifications

发送到邮箱 |
+1 赞 0
收藏
评论 0
| 转发至：

本文由星晴123转载自ATP ELECTRONICS，原文标题为:New Die Package Extends 3D TLC e.MMC Endurance to MLC/SLC Levels of ATP E750Pi/Pc, E650Si/Sc Series e.MMC，本站所有转载文章系出于传递更多信息之目的，且明确注明来源，不希望被转载的媒体或个人可与我们联系，我们将立即进行删除处理。

全部评论（0）

暂无评论

【产品】ATP在2019嵌入式世界大会上推出智能存储解决方案

领先的高性能工业专用存储器和存储解决方案制造商ATP Electronics于2019年2月26日至28日在德国纽伦堡展览中心1号展厅展示其最先进的嵌入式智能产品。ATP的最新嵌入式产品e.MMC是符合JEDEC e.MMC V5.1标准(JESD84-B51)的焊接式存储设备。

新产品发布时间 : 2019-12-19

【产品】ATP发布业界首款工业级SLC e.MMC E800Pi，单元擦写耐久性达6万次，面向高可靠性应用

2019年9月 – 聚焦工业应用的存储解决方案领导厂商ATP Electronics（华腾国际科技）日前发布了其最新产品线E800Pi ，这是业界首款基于SLC （Single Level Cell）闪存的eMMC产品，其单元擦写耐久性高达6万次以上。基于SLC闪存的E800Pi 系列eMMC产品目前提供1GB和2GB的容量，是启动型应用及其它高可靠嵌入式系统应用的理想选择。

新产品发布时间 : 2019-12-07

【产品】采用153球的FBGA封装方式的工业级e.MMC，温度范围-40~85℃

ATP工业级e.MMC是一种先进的存储解决方案，在内部管理所有后台操作，使主机免于处理低级的闪存操作，从而实现更快、更高效的处理。产品采用153球的FBGA封装方式，旨在满足工业应用的苛刻要求。

新产品发布时间 : 2019-12-08

ATP e.MMC集成数据刷新技术，确保数据在使用寿命期间的可靠性和准确性，对2D NAND e.MMC提供长期供货支持

ATP Electronics的e.MMC解决方案集成了数据刷新技术，专为空间受限的系统而设计和制造，可确保数据在整个使用寿命期间的可靠性和准确性。为了满足对基于2D NAND闪存的e.MMC的持续需求，ATP Electronics致力于长期向客户提供低容量e.MMC，产品容量包括MLC 8GB/16GB，pSLC模式的4GB/8GB。

原厂动态发布时间 : 2024-08-21

ATP（华腾国际）DRAM存储模块和NAND闪存产品选型指南（英文）

目录- Company Profile Segment Challenges and Solutions Thermal Solutions Endurance Solutions Security Solutions CFexpress & USB 3.0 Value Line SSDs DDR5 DRAM SOLUTIONS FLASH SOLUTIONS Flash Products Naming Rule Solutions & Technologies Flash Technology Overview table Complete Flash Spec Overview & Product Dimensions

型号- A750PI,E650SC SERIES,S600SC,B800PI,S750 SERIES,S600SI,S600SCA,E750PC SERIES,B600SC,N700PC,S700SC,E650SC,A750 SERIES,E600VC,S800PI,A750PI SERIES,I800PI,A600VC,A650SI,A650SC,N700 SERIES,S650SI,N750,N750PI,A800PI,A700PI,N700SI,N650 SERIES,E600SAA,N700SC,A750,N600SC,A600VC SERIES,E600SA,E650SI,E650SI SERIES,N750 SERIES,E700PIA,TR-03153,N600SI,S650,S650SC,E700PAA,N650SIA,E600SI,B600SC SERIES,S750SC,S600SIA,I700SC,N650SI,N600VI,E600SIA,E750PI,N650SC,N750PI SERIES,N600VC,I600SC,E750PC,S700PI,A650 SERIES,N650,N600 SERIES,N600VC SERIES,S650 SERIES,A650,AES-256,E700PI,A600SI,E750PI SERIES,N700PI,E700PA,S750,S750PI,E700PC,A600SC

选型指南 - ATP - v1.0 - 012023 PDF 英文下载

e.MMC MLC Solutions The Global Leader in Specialized Storage and Memory Solutions

型号- E700PI,E600SA,E700PIA,E600SIA,E700PA,E600SI,E600SC,E700PAA,E600SAA,E700PC

商品及供应商介绍 - ATP - v1.0 - 072024 PDF 英文下载

ATP（华腾国际）DRAM存储模块和NAND闪存产品选型指南（中文）

目录- 公司简介细分市场挑战和解决方案热管理解决方案 TSE闪存解决方案 DRAM解决方案闪存解决方案闪存解决方案-固态驱动器和模块闪存解决方案-存储卡闪存解决方案-托管NAND 闪存产品命名规则闪存规范概述和产品尺寸

型号- A750PI,S600SC,N750PI系列,B800PI,S750 SERIES,S600SI,S600SCA,B600SC,N700PC,S700SC,N600,E650SC,E750,E750PC系列,E600VC,S800PI,I800PI,E750 SERIES,A600VC,A650SI,N600系列,A650SC,N700 SERIES,S650SI,N750,N750PI,A800PI,A700PI,N700SI,E600SAA,N700SC,A750,N600SC,A600VC SERIES,E600SA,E650SI,E700PIA,N600SI,S650,S650SC,E700PAA,N600VC系列,N650系列,N650SIA,N750系列,E600SI,S750系列,E650,N700,S750SC,S600SIA,I700SC,N650SI,N600VI,E650SI系列,E600SIA,E650SC系列,E750PI,N650SC,S650系列,N600VC,I600SC,E750PC,A600VC系列,A650系列,S700PI,N700系列,N650,N600 SERIES,N600VC SERIES,A750PI系列,S650 SERIES,A650,E700PI,E750PI系列,A600SI,N700PI,A750系列,E700PA,E650 SERIES,S750,S750PI,E700PC,A600SC

选型指南 - ATP - v1.0 - 012023 PDF 中文下载

ATP 9x10 e.MMC Embedded Flash Storage Solution Commercial-Grade Configuration for Read-Intensive Applications

型号- E600VC

商品及供应商介绍 - ATP - v1.0 - 202207 PDF 英文下载

【产品】采用153-ball FBGA封装的e.MMC，具备超强耐用性和可靠性，满足严苛的工业应用要求

ATP ELECTRONICS工业级 e.MMC 解决方案是一种先进的存储解决方案，它将NAND闪存、先进的闪存控制器和快速多媒体卡（MMC）接口集成在同一个封装中。ATP e.MMC在内部管理所有后台操作，使主机不必处理低级别的闪存操作，从而实现更快、更高效的处理效率。

产品发布时间 : 2021-12-11

【应用】ATP的e.MMC、工业SD卡和工业microSD卡用于汽车领域，提供超大容量内存和宽温度支持

针对汽车智能化发展的需求，ATP拥有一系列内存和存储解决方案，包括e.MMC、工业SD卡、工业microSD卡等产品，其防护性、坚固性设计使其能够承受各种环境条件；紧凑的尺寸允许放置在小型嵌入式车辆系统中；而且，不同的容量和性能还确保了能够满足特定汽车需求。

应用方案发布时间 : 2019-12-06

ATP（华腾国际）固态硬盘选型指南

描述- Since 1991, we have consistently distinguished ourselves as one of the world’s leading original equipment manufacturers (OEM) of high-performance, high-quality and high-endurance NAND flash products and DRAM modules.

型号- A750PI,S600SC,B800PI,S750 SERIES,S600SI,B600SC,N700PC,A750 SERIES,E650SC,N601,N651SI,A600VI,S800PI,E600VC,I800PI,A600VC,A650SI,A650SC,N651SC,N750,S650SI,A600VI SERIES,N750PI,N651SIE,A800PI,N601 SERIES,A700PI,N651SIA,N650 SERIES,E600SAA,A750,A600VC SERIES,N600SC,E600SA,E650SI,N750 SERIES,E700PIA,N600SI,S650,S650SC,N651SI SERIES,E700PAA,B600SC SERIES,E600SI,N600VI SERIES,I700SC,N600VI,N650SI,E600SIA,N650SC,E750PI,N600VC,I600SC,E750PC,N651,S700PI,A650 SERIES,N650,N751PI,S700PC,N600VC SERIES,N651 SERIES,S650 SERIES,A650,N601SC,S750PC,E700PI,A600SI,N700PI,E700PA,S750,S750PI,E700PC,N651SCE,A600SC

选型指南 - ATP - v1.0 - 022024 PDF 英文下载