ATP新推高密度64GB DDR4超低外观DIMMS,增强嵌入式/工业/5G loT系统处理大量数据能力
专业存储和内存解决方案的全球领导者ATP Electronics推出其64GB DDR4超低外观DIMMS(VLP RDIMMs),专为嵌入式刀片计算和存储,工业单板计算机,企业网络和物联网系统(IoT系统)处理内存密集型工作负载而构建。新产品的密度是市场上典型32GB VLP RDIMM的两倍,以满足联网汽车、智能工厂和其他5G物联网应用不断产生的数据所带来的不断增长的内存需求。
高性能64GB VLP RDIMM在288针DIMM中组织为8192mb x 72位。每个模块采用18颗8Gx4 DDR4 SDRAM,采用双芯片封装(DDP)的堆叠芯片,由包含模块信息的512字节串行EEPROM组成,并包含纠错码(ECC),以支持错误检测和纠错。
超低外观:专为5G物联网、边缘网络打造
随着5G物联网的采用不断加速,数据正在从云存储转移到边缘计算;因此,电信、工业和企业部门需要坚固的服务器系统和云服务器用于其边缘网络。
这些VLP RDIMM的印刷电路板(PCB)高度仅为18.75毫米或0.74英寸,非常适合具有小尺寸和紧凑外壳设计的工业系统。它们可以垂直放置在刀片服务器内,以节省空间并最大限度地提高空气流动,从而有效地散热并保持系统凉爽。
RDIMMs:更好的信号完整性,全面的RAS
ATP新的64GB DDR4 RDIMMs通过其寄存器时钟驱动程序(RCD)来提供更好的信号完整性,该驱动程序缓冲主机内存控制器和DIMM上的DRAM或内存芯片之间的命令和地址信号。这种缓冲增加了功耗和内存延迟,但允许增加工作负载,并且由于具有更高的性能、更好的可伸缩性和更全面的可靠性、可用性和可维护性(RAS)特性而降低了拥有成本。
优化的性能
新的64GB VLP RDIMM针对Intel®Xeon®Platinum,金,银和青铜可扩展处理器,第8代Intel®Core™i7/i5/i3处理器和第三代AMD EPYC™处理器系列进行了优化。
可定制选项:宽温度可选
对于热循环要求不是很苛刻的条件下,ATP的64GB VLP RDIMM可以在商业温度等级(0℃至85℃)下随时使用。当安装在极端温度变化的恶劣环境中时,这些DDR4 DRAM也可以配置为工业级温度(-40℃至85℃),即使在极冷或极热的情况下,特别是在很少或没有气流的密闭外壳中,也可以实现可靠的24/7全天候运行。
产品规格
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本文由玄子转载自ATP官网,原文标题为:ATP提供罕见的64 GB DDR4 VLP RDIMM,本站所有转载文章系出于传递更多信息之目的,且明确注明来源,不希望被转载的媒体或个人可与我们联系,我们将立即进行删除处理。
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即使面对EDGE、5G和IIoT技术的新兴进展,DDR4仍然是必不可少的内存标准。ATP将持续通过其新的、更高密度的VLP RDIMM来改进其DDR4产品。数据生成和处理在未来几年将持续不减,而新的64 GB VLP RDIMM已准备好应对更快、更智能的内存密集型未来。
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FORESEE存储器选型表
FORESEE存储产品有内存模块、固态硬盘、闪存、eMMC等。工规MSATA SSD,工规 SATA M.2 2242 SSD,工规 SATA M.2 2280 SSD,商规DDR3L,用于工业电脑,轨道交通,工业设备,电力设备,服务器,POS机,医疗设备等。工规PPI SLC NAND FLASH,工规NMCP,工规PPI SLC NAND FLASH,工规SPI SLC NAND FLASH,用于电视,机顶盒,网通,IPC,行车记录仪,智能手环等。车规II EMMC,车规III EMMC,应用于车载前装,智能仪表,IVI,ADAS,域控,BMS,记录仪。工规EMMC,用于耐用性消费类电子,车载后装,商显,TV,黑白家电等。工业宽温EMMC,用于工业控制,通讯基站,智能电网,车载前装。
产品型号
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品类
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Density(Mb、Gb、GB、TB)
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Speed(MT/s、Gbps、MHz)
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Voltage (V)
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Memory
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Temp. Range (℃)
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Bus
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Interface
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Package
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Size (mm)
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FI4S26M016GSC3
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DDR4 DIMM
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16GB
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2666MT/s
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1.2V
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DDR4
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0℃ to 85℃
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64bits
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260pin
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SODIMM
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69.6 x 30mm
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FORESEE工业存储产品选型指南
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AS4C512M16D4A 512M x 16 bit DDR4 Synchronous DRAM (SDRAM)
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